# US 10,874,018 B2 · Printed wiring board having embedded pads and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,874,018 B2 - Document ID: US10874018B2 - Status: Granted - Kind: B2 - Application number: 16/502,170 - Filed: 2019-07-03 - Published: 2019-10-24 - Granted: 2020-12-22 - Earliest claimed: 2016-08-22 - Assignees: Ibiden Co., Ltd. - Applicants: Ibiden Co., Ltd. - Inventors: Teruyuki Ishihara; Hiroyuki Ban; Haiying Mei - Web page: https://patentgrep.com/patent/US10874018B2 ## CPC - H05K 1/0284: {Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014)} - H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)} - H05K 3/007: {Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence)} - H05K 3/4682: {Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H05K 3/205: {using a pattern electroplated or electroformed on a metallic carrier} - H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components} - H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)} - H05K 2201/0367: Metallic bump or raised conductor not used as solder bump - H05K 2201/10674: Flip chip - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/655: Fan-out layouts - H10W 70/685: comprising multiple insulating layers - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A printed wiring board includes a laminate including first conductor pads on first surface side of the laminate and second conductor pads on second surface side of the laminate, and a solder resist layer formed on the first surface side of the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has first surface on the first surface side and second surface on the second surface side on the opposite side with respect to the first surface of the laminate, and the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces exposed from the second surfaces of the laminate respectively and that the surfaces of the second conductor pads are protruding from the second surface of the laminate. ## Claims ### Claim 1 A printed wiring board, comprising: a laminate comprising a plurality of first conductor pads on a first surface side of the laminate and a plurality of second conductor pads on a second surface side of the laminate; and a solder resist layer formed on the first surface side of the laminate and having a plurality of openings formed such that the openings are exposing the first conductor pads respectively, wherein the laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on an opposite side with respect to the first surface of the laminate, each of the second conductor pads has an embedded portion embedded in the second surface of the laminate and a protruding portion protruding from the second surface of the laminate such that the second conductor pads have surfaces exposed and protruding from the second surface of the laminate and that the embedded portion has a width that is substantially equal to a width of the protruding portion in a thickness direction of the laminate, the plurality of second conductor pads is formed on a center side of the second surface of the laminate, the laminate includes a plurality of third conductor pads formed on the second surface side of the laminate such that the third conductor ads are positioned on an outer peripheral side than the plurality of second conductor pads, embedded in the second surface of the laminate and have surfaces exposed from the second surface of the laminate respectively, and the plurality of second conductor pads is formed such that the plurality of second conductor pads has a pitch that is smaller than a pitch of the plurality of third conductor pads. ### Claim 2 (depends on 1) A printed wiring board according to claim 1, wherein the laminate includes a via conductor structure penetrating from the first surface to the second surface of the laminate such that the via conductor structure comprises at least one via conductor formed in the resin insulating layer and tapering from the first surface side toward the second surface side of the laminate. ### Claim 3 (depends on 1) A printed wiring board according to claim 1, wherein the plurality of first conductor pads is formed on the first surface of the laminate. ### Claim 4 (depends on 1) A printed wiring board according to claim 1, wherein the second surface of the laminate is not covered with a solder resist layer. ### Claim 5 (depends on 1) A printed wiring board according to claim 1, further comprising: an electronic component connected to the plurality of second conductor pads such that the electronic component is mounted on the second surface side of the laminate. ### Claim 6 (depends on 1) A printed wiring board according to claim 1, wherein the plurality of second conductor pads is formed such that each of the second conductor pads comprises a dissimilar metal layer comprising mutually different metal layers. ### Claim 7 (depends on 6) A printed wiring board according to claim 6, wherein the dissimilar metal layer comprises a copper plating layer and a corrosion resistant plating layer formed on the copper plating layer. ### Claim 8 (depends on 1) A printed wiring board according to claim 1, wherein the plurality of second conductor pads is formed such that the surfaces of the second conductor pads have a height in a range of 2 μm to 10 μm from the second surface of the laminate. ### Claim 9 (depends on 1) A printed wiring board according to claim 1, wherein the plurality of third conductor pads is formed such that each of the third conductor pads comprises a dissimilar metal layer comprising mutually different metal layers. ### Claim 10 (depends on 9) A printed wiring board according to claim 9, wherein the dissimilar metal layer of each of the third conductor pads comprises a copper plating layer and a corrosion resistant plating layer formed on the copper plating layer. ### Claim 11 (depends on 1) A printed wiring board according to claim 1, further comprising: a plurality of conductor posts formed on the second surface side of the laminate such that the conductor posts are formed on the third conductor pads respectively. ### Claim 12 (depends on 11) A printed wiring board according to claim 11, wherein the conductor posts comprise metal film layer portions formed in contact with the third conductor pads and plating layer portions formed on the metal film layer portions respectively. ### Claim 13 (depends on 12) A printed wiring board according to claim 12, wherein the plurality of conductor posts has a height in a range of 50 μm to 200 μm. ### Claim 14 (depends on 11) A printed wiring board according to claim 11, wherein the plurality of conductor posts is formed such that the plurality of conductor posts has a diameter that is greater than a diameter of the plurality of third conductor pads. ### Claim 15 (depends on 11) A printed wiring board according to claim 11, wherein the laminate includes a via conductor structure penetrating from the first surface to the second surface of the laminate such that the via conductor structure, one of the conductor posts and one of the first conductor pads are formed in overlapping positions and that the via conductor structure is connecting the one of the conductor posts and the one of the first conductor pads. ### Claim 16 (depends on 1) A printed wiring board according to claim 1, wherein the plurality of third conductor pads is formed such that the surfaces of the third conductor pads are protruding from the second surface of the laminate. ### Claim 17 (depends on 1) A printed wiring board according to claim 1, wherein the resin insulating layer of the laminate forms the second surface of the laminate, and the laminate includes a plurality of via conductors formed in the resin insulating layer such that each of the via conductors is connected to the embedded portion of a respective one of the second pads in the resin insulating layer. ### Claim 18 (depends on 2) A printed wiring board according to claim 2, wherein the plurality of first conductor pads is formed on the first surface of the laminate. ### Claim 19 (depends on 2) A printed wiring board according to claim 2, wherein the second surface of the laminate is not covered with a solder resist layer. ### Claim 20 (depends on 2) A printed wiring board according to claim 2, further comprising: an electronic component connected to the plurality of second conductor pads such that the electronic component is mounted on the second surface side of the laminate.