# US 10,873,399 B2 · Method and system for a photonic interposer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,873,399 B2 - Document ID: US10873399B2 - Status: Granted - Kind: B2 - Application number: 16/533,541 - Filed: 2019-08-06 - Published: 2019-11-28 - Granted: 2020-12-22 - Earliest claimed: 2008-09-08 - Assignees: Luxtera, Inc. - Applicants: Luxtera LLC. - Inventors: Mark Peterson; Greg Young; Peter De Dobbelaere - Web page: https://patentgrep.com/patent/US10873399B2 ## CPC - H04B 10/43: using a single component as both light source and receiver, e.g. using a photoemitter as a photoreceiver - G02B 6/1225: {comprising photonic band-gap structures or photonic lattices} - H04B 10/70: Photonic quantum communication - H04B 10/801: {using optical interconnects, e.g. light coupled isolators, circuit board interconnections} - H10D 86/01: Manufacture or treatment - H10D 86/201: {the substrates comprising an insulating layer on a semiconductor body, e.g. SOI (H10D86/40 take precedence)} - H10W 70/635: {Through-vias} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/66: Conductive materials thereof - H10W 90/00: Package configurations - G02B 2006/12061: {Silicon} - G02B 2006/12142: {Modulator} - H10W 72/884: {Die-attach connectors and bond wires} - H04B: TRANSMISSION - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Methods and systems for a photonic interposer may include receiving a continuous wave (CW) optical signal in a silicon photonic interposer from an optical source. A modulated optical signal may be generated by processing the received CW optical signal based on a first electrical signal received from an electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signal, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of a processor core, a switch core, memory, or a router. ## Claims ### Claim 1 A method for communication, the method comprising: receiving a continuous wave (CW) optical signal in a photonic interposer; generating a first modulated optical signal in the photonic interposer by processing the CW optical signal based on a first electrical signal received from a complementary metal-oxide semiconductor (CMOS) electronics die; communicating the first modulated optical signal out of the photonic interposer via a first optical fiber; receiving a second modulated optical signal via a second optical fiber; and generating a second electrical signal in the photonic interposer based on the second modulated optical signal. ### Claim 2 (depends on 1) The method according to claim 1, further comprising communicating the second electrical signal to the CMOS electronics die via copper pillars. ### Claim 3 (depends on 1) The method according to claim 1, further comprising generating the CW optical signal in an optical source assembly on the photonic interposer. ### Claim 4 (depends on 3) The method according to claim 3, wherein the optical source assembly further comprises a semiconductor laser. ### Claim 5 (depends on 1) The method according to claim 1, further comprising processing the CW optical signal via an optical modulator in the photonic interposer. ### Claim 6 (depends on 5) The method according to claim 5, wherein the optical modulator further comprises a Mach-Zehnder interferometer modulator. ### Claim 7 (depends on 1) The method according to claim 1, further comprising generating the second electrical signal in the photonic interposer via a photodetector integrated in the photonic interposer. ### Claim 8 (depends on 1) The method according to claim 1, further comprising receiving the second modulated optical signal via grating couplers integrated in the photonic interposer. ### Claim 9 (depends on 1) The method according to claim 1, wherein the electronics die further comprises a processor core, a switch core, memory, or a router. ### Claim 10 An integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a photonic interposer, the integrated optical communication system being operable to: receive a continuous wave (CW) optical signal in the photonic interposer; generate a first modulated optical signal by processing the CW optical signal based on a first electrical signal received from the CMOS electronics die; communicate the first modulated optical signal out of the photonic interposer via a first optical fiber; receive a second modulated optical signal via a second optical fiber; and generate a second electrical signal in the photonic interposer based on the second modulated optical signal. ### Claim 11 (depends on 10) The system according to claim 10, wherein the integrated optical communication system is further operable to communicate the second electrical signal to the CMOS electronics die via copper pillars. ### Claim 12 (depends on 10) The system according to claim 10, wherein the integrated optical communication system is further operable to generate the CW optical signal in an optical source assembly on the photonic interposer. ### Claim 13 (depends on 12) The system according to claim 12, wherein the optical source assembly further comprises a semiconductor laser. ### Claim 14 (depends on 10) The system according to claim 10, wherein the integrated optical communication system is further operable to process the CW optical signal via an optical modulator in the photonic interposer. ### Claim 15 (depends on 14) The system according to claim 14, wherein the optical modulator further comprises a Mach-Zehnder interferometer modulator. ### Claim 16 (depends on 10) The system according to claim 10, wherein the integrated optical communication system is further operable to generate the second electrical signal in the photonic interposer via a photodetector integrated in the photonic interposer. ### Claim 17 (depends on 10) The system according to claim 10, wherein the integrated optical communication system is further operable to receive the CW optical signal via grating couplers integrated in the photonic interposer. ### Claim 18 (depends on 10) The system according to claim 10, wherein the electronics die further comprises a processor core, a switch core, memory, or a router. ### Claim 19 A system for communication, the system comprising: an integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a photonic interposer, the integrated optical communication system being operable to: receive a continuous wave (CW) optical signal in the photonics die from an optical source on the photonic interposer; generate a first modulated optical signal by modulating the CW optical signal based on a first electrical signal received from the CMOS electronics die; communicate the first modulated optical signal out of the photonic interposer via a first optical fiber; receive a second modulated optical signal via a second optical fiber; and generate a second electrical signal in the photonic interposer based on the second modulated optical signal.