# US 10,873,352 B2 · Radio-frequency module and communication apparatus

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- Number: US 10,873,352 B2
- Document ID: US10873352B2
- Status: Granted
- Kind: B2
- Application number: 16/414,962
- Filed: 2019-05-17
- Published: 2019-09-05
- Granted: 2020-12-22
- Earliest claimed: 2016-12-27
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Hiroshi Nishikawa
- Web page: https://patentgrep.com/patent/US10873352B2

## CPC

- H03H 9/6483: {Ladder SAW filters}
- H04B 1/0475: {with means for limiting noise, interference or distortion (H04B1/0483 takes precedence)}
- H03H 9/02952: {of parasitic capacitance}
- H03H 9/0552: {the device and the other elements being mounted on opposite sides of a common substrate}
- H03H 9/0557: {the other elements being buried in the substrate}
- H03H 9/13: for networks consisting of piezoelectric or electrostrictive materials (for networks using surface acoustic waves H03H9/145)
- H03H 9/205: having multiple resonators (crystal tuning forks H03H9/21)
- H03H 9/25: Constructional features of resonators using surface acoustic waves {(devices for manipulating acoustic surface waves in general G10K11/36)}
- H03H 9/542: {including passive elements (H03H9/545 takes precedence)}
- H03H 9/568: {consisting of a ladder configuration}
- H03H 9/64: using surface acoustic waves
- H03H 9/72: Networks using surface acoustic waves
- H04B 1/00: Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B 1/0057: {using diplexing or multiplexing filters for selecting the desired band}
- H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)}
- H05K 1/0233: {Filters, inductors or a magnetic substance}
- H05K 1/0243: {Printed circuits associated with mounted high frequency components}
- H05K 1/181: associated with surface mounted components
- H04B 1/18: Input circuits, e.g. for coupling to an antenna or a transmission line (coupling networks between antennas or lines and receivers independent of the nature of the receiver H03H)
- H04B 1/52: Hybrid arrangements, i.e. arrangements for transition from single-path two-direction transmission to single-direction transmission on each of two paths or vice versa
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 2201/09618: Via fence, i.e. one-dimensional array of vias
- H05K 2201/1006: Non-printed filter
- H05K 2201/10083: Electromechanical or electro-acoustic component, e.g. microphone
- H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P)
- H04B: TRANSMISSION
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A radio-frequency module (20) includes a module substrate (50) and a filter (21). The filter (21) has a sensitive GND electrode and a non-sensitive GND electrode that are connected to an external-connection ground terminal of the module substrate (50), and parallel-arm resonators. An inductance component generated by the sensitive GND electrode shifts, by a first shift amount, an attenuation pole that corresponds to a parallel-arm resonator and that is formed near a pass band. An inductance component generated by the non-sensitive GND electrode shifts, by a second shift amount, an attenuation pole that corresponds to a parallel-arm resonator and that is formed near the pass band. The first shift amount is larger than the second shift amount, and the distance between the sensitive GND electrode and the external-connection ground terminal is smaller than the distance between the non-sensitive GND electrode and the external-connection ground terminal.

## Claims

### Claim 1

A radio-frequency module comprising:
a module substrate having a first main surface and a second main surface that face away from each other and a plurality of external-connection ground terminals;
a circuit element mounted on the first main surface of the module substrate; and
a switch IC mounted on the second main surface of the module substrate, wherein
the circuit element has
a circuit substrate,
an input electrode and an output electrode that are disposed on the circuit substrate,
a first ground electrode disposed on the circuit substrate and connected to one of the plurality of external-connection ground terminals, and
a second ground electrode disposed on the circuit substrate and connected to one of the plurality of external-connection ground terminals,
the first ground electrode is connected, on the circuit substrate, to an electrode or a wiring line that is disposed on the circuit substrate,
the second ground electrode is not connected to either of the electrode and the wiring line that are disposed on the circuit substrate, and
a distance between the first ground electrode and a first external-connection ground terminal connected to the first ground electrode is smaller than a distance between the second ground electrode and the first external-connection ground terminal connected to the second ground electrode in plan view of the module substrate.

### Claim 2 (depends on 1)

A communication apparatus comprising:
the radio-frequency module according to claim 1; and
an RF signal processing circuit that processes a radio-frequency signal received from the radio-frequency module.