# US 10,873,145 B2 · Ground heat sink for dual inline memory module cooling > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,873,145 B2 - Document ID: US10873145B2 - Status: Granted - Kind: B2 - Application number: 16/465,087 - Filed: 2016-12-29 - Published: 2019-10-17 - Granted: 2020-12-22 - Earliest claimed: 2016-12-29 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Guoliang Ying; Na Chen; Liguang Du - Web page: https://patentgrep.com/patent/US10873145B2 ## CPC - H01R 12/737: {Printed circuits being substantially perpendicular to each other (for printed connections H05K3/366)} - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - G06F 1/20: Cooling means - H01R 31/06: Intermediate parts for linking two coupling parts, e.g. adapter (with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/94) - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/181: associated with surface mounted components - H05K 1/0207: {using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes} - H05K 2201/0397: Tab - H05K 2201/10159: Memory - H05K 2201/10325: Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support - H05K 2203/0323: Working metal substrate or core, e.g. by etching, deforming - H10W 40/10: Arrangements for heating - H10W 40/641: {Snap-on arrangements, e.g. clips} - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Aspects of the embodiments are directed to a printed circuit board (PCB) that includes a conductive layer extending from the printed circuit board to act as a heat sink for circuit components electrically and mechanically attached to the PCB. The conductive layer can be a copper ground layer of a multi-layered PCB. The PCB can include one or more circuit components, such as dynamic random access memory elements. In embodiments, the PCB is part of a dual inline memory module. The conductive layer can be fashioned such that it extends out from the PCB and returns over the circuit elements to define an air gap between the conductive layer and the surface of the PCB and/or the surface of the circuit elements. In embodiments, a connection adaptor can be used to accommodate various PCB thicknesses so that the PCB can be electrically connected to an edge connector. ## Claims ### Claim 1 An electronic component, comprising: a multi-layered printed circuit board (PCB) having a first PCB layer at a first surface of the multi-layered PCB and a second PCB layer at a second surface of the multi-layered PCB, wherein the second surface is opposite to the first surface, the multi-layered PCB has a first side surface that is not parallel to the first surface or the second surface, and the multi-layered PCB has a second side surface different than the first side surface; a conductive structure extending from the first side surface of the multi-layered PCB and folding back toward the multi-layered PCB such that a first portion of the conductive structure is between the first PCB layer and the second PCB layer, the first PCB layer is between a second portion of the conductive structure and the first portion of the conductive structure, and the second portion of the conductive structure is spaced apart from the first surface of the multi-layered PCB; and a plurality of metal contact fingers proximate to the second side surface, wherein the plurality of metal contact fingers are to be received in a socket. ### Claim 2 (depends on 1) The electronic component of claim 1, wherein the conductive structure includes a ground layer of the multi-layered PCB. ### Claim 3 (depends on 1) The electronic component of claim 1, wherein the conductive structure includes copper. ### Claim 4 (depends on 1) The electronic component of claim 1, further comprising: a circuit component coupled to the first surface of the multi-layered PCB, wherein the circuit component is between the second portion of the conductive structure and the first surface of the multi-layered PCB. ### Claim 5 (depends on 4) The electronic component of claim 4, wherein the circuit component is electrically connected to the conductive structure through a conductive pathway in the multi-layered PCB. ### Claim 6 (depends on 4) The electronic component of claim 4, wherein the circuit component includes a memory device. ### Claim 7 (depends on 1) The electronic component of claim 1, wherein the conductive structure is a first conductive structure, and the electronic component further includes: a second conductive structure extending from the first side surface of the multi-layered PCB and folding back toward the multi-layered PCB such that a first portion of the second conductive structure is between the first PCB layer and the second PCB layer, the first PCB layer is between a second portion of the second conductive structure and the first portion of the second conductive structure, and the second portion of the second conductive structure is spaced apart from the first surface of the multi-layered PCB. ### Claim 8 (depends on 1) The electronic component of claim 1, wherein the second side face is opposite to the first side face. ### Claim 9 An integrated circuit (IC) assembly, comprising: a printed circuit board (PCB), including: a conductive material extending from a first side face of the PCB such that a first portion of the conductive material is between a first PCB layer and a second PCB layer, and the first PCB layer is between the first portion of the conductive material and a second portion of the conductive material, and a plurality of metal contact fingers proximate to a second side face of the PCB, wherein the second side face of the PCB is different than the first side face of the PCB; and a PCB connection adaptor, comprising: a socket to receive the PCB, the socket including a plurality of metal contacts complementary to the plurality of metal contact fingers, and an interconnect portion to be received by an edge connector, the interconnect portion comprising a plurality of metal contact fingers electrically connected to the plurality of metal contacts of the socket. ### Claim 10 (depends on 9) The IC assembly of claim 9, wherein the plurality of metal contacts of the socket are not coplanar with the plurality of metal contact fingers of the interconnect portion. ### Claim 11 (depends on 9) The IC assembly of claim 9, wherein the plurality of metal contacts of the socket includes spring-loaded metal contacts. ### Claim 12 (depends on 9) The IC assembly of claim 9, wherein the conductive material includes copper. ### Claim 13 (depends on 9) The IC assembly of claim 9, further comprising: a circuit component coupled to a face of the PCB. ### Claim 14 (depends on 13) The IC assembly of claim 13, wherein the circuit component is electrically connected to the conductive material through a conductive pathway in the PCB. ### Claim 15 (depends on 13) The IC assembly of claim 13, wherein the circuit component includes a dynamic random access memory. ### Claim 16 (depends on 9) The IC assembly of claim 9, wherein the conductive material is a first conductive material, and the PCB further includes: a second conductive material extending from a side face of the PCB such that a first portion of the second conductive material is between the first PCB layer and the second PCB layer, and the first PCB layer is between the first portion of the second conductive material and a second portion of the second conductive material. ### Claim 17 (depends on 9) The IC assembly of claim 9, wherein first PCB layer is at a face of the PCB, and the second portion of the conductive material is spaced apart from the face of the PCB by an air gap. ### Claim 18 A dual inline memory module (DIMM), comprising: a multi-layered printed circuit board (MLPCB) structure, wherein the MLPCB structure includes a conductive material having a first portion embedded within an MLPCB and a second portion spaced away from and parallel to a face of the MLPCB, and the MLPCB structure does not include any electronic components coupled to the second portion of the conductive material; and at least one dynamic random access memory (DRAM) element coupled to the MLPCB structure. ### Claim 19 (depends on 18) The DIMM of claim 18, wherein the conductive material includes a third portion between the first portion and the second portion, wherein the third portion is perpendicular to the second portion and to the first portion. ### Claim 20 (depends on 18) The DIMM of claim 18, wherein the at least one DRAM element is between the second portion of the conductive material and the face of the PCB.