# US 10,873,120 B2 · Multilayer board and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,873,120 B2 - Document ID: US10873120B2 - Status: Granted - Kind: B2 - Application number: 16/439,733 - Filed: 2019-06-13 - Published: 2019-09-26 - Granted: 2020-12-22 - Earliest claimed: 2017-01-27 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Chu Xu - Web page: https://patentgrep.com/patent/US10873120B2 ## CPC - H01P 3/026: {Coplanar striplines [CPS]} - H01P 3/08: Microstrips; Strip lines - H01P 3/085: {Triplate lines} - H01P 3/088: {Stacked transmission lines} - H05K 1/02: Details - H05K 1/0221: {Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines} - H05K 1/0298: {Multilayer circuits} - H05K 3/46: Manufacturing multilayer circuits - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H05K 3/4694: {Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density (H05K3/4691 takes precedence)} - H05K 2201/0723: provided by an inner layer of PCB - H05K 2201/09236: Parallel layout - H05K 2201/09618: Via fence, i.e. one-dimensional array of vias - H05K 2201/09972: Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently - H05K 2201/09981: Metallised walls - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line. ## Claims ### Claim 1 A multilayer board comprising: a layered body including a plurality of insulating base material layers that are layered; and a first signal line, a second signal line, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, an interlayer connecting conductor, and a first sub-ground conductor provided in and on the plurality of insulating base material layers; wherein a first transmission line includes the first signal line, the first ground conductor, the second ground conductor, the insulating base material layer sandwiched between the first signal line and the first ground conductor of the plurality of insulating base material layers, and the insulating base material layer sandwiched between the first signal line and the second ground conductor of the plurality of insulating base material layers; a second transmission line includes the second signal line, the second ground conductor, the third ground conductor, the insulating base material layer sandwiched between the second signal line and the second ground conductor of the plurality of insulating base material layers, and the insulating base material layer sandwiched between the second signal line and the third ground conductor of the plurality of insulating base material layers; the first signal line overlaps the first opening when seen in a layering direction of the plurality of insulating base material layers; no signal line exists between the second signal line and the first signal line; the second signal line is provided on a layer different from a layer of the plurality of insulating base material layers including the first signal line; the second signal line includes a portion extending side by side with the first signal line when seen in the layering direction; the first ground conductor, the second ground conductor, and the third ground conductor are connected by the interlayer connecting conductor; the third ground conductor is disposed on a layer of the plurality of insulating base material layers including the first signal line or a layer of the plurality of insulating base material layers positioned between the first signal line and the second signal line of the plurality of insulating base material layers; the first sub-ground conductor is disposed between the first signal line and the second signal line when seen in the layering direction and disposed between the second ground conductor and the third ground conductor in the layering direction; and the second ground conductor and the third ground conductor are connected by the first sub-ground conductor and the interlayer connecting conductor. ### Claim 2 (depends on 1) The multilayer board according to claim 1, further comprising: a second sub-ground conductor provided on the plurality of insulating base material layers; wherein the second sub-ground conductor is disposed at a position on an opposite side of the first signal line from the second signal line when seen in the layering direction and disposed between the first ground conductor and the third ground conductor in the layering direction. ### Claim 3 (depends on 1) The multilayer board according to claim 1, further comprising: a third sub-ground conductor provided on the plurality of insulating base material layers; wherein the third sub-ground conductor is disposed at a position on an opposite side of the second signal line from the first signal line when seen in the layering direction and disposed between the second ground conductor and the third ground conductor in the layering direction. ### Claim 4 (depends on 1) The multilayer board according to claim 1, wherein the interlayer connecting conductor includes a first interlayer connecting conductor disposed between the first signal line and the second signal line when seen in the layering direction. ### Claim 5 (depends on 1) The multilayer board according to claim 1, wherein the interlayer connecting conductor includes a second interlayer connecting conductor disposed at a position on an opposite side of the first signal line from the second signal line when seen in the layering direction. ### Claim 6 (depends on 1) The multilayer board according to claim 1, wherein the interlayer connecting conductor includes a third interlayer connecting conductor disposed at a position on an opposite side of the second signal line from the first signal line when seen in the layering direction. ### Claim 7 (depends on 1) The multilayer board according to claim 1, wherein the first transmission line is configured to transmit an analog signal; and the second transmission line is configured to transmit a digital signal. ### Claim 8 (depends on 1) The multilayer board according to claim 1, wherein the first opening includes a plurality of first openings that are arranged along an extending direction of the first signal line when seen in the layering direction. ### Claim 9 (depends on 1) The multilayer board according to claim 1, further comprising: a third signal line provided on one of the plurality of insulating base material layers; and a second opening provided in the first ground conductor; wherein the third signal line overlaps the second opening when seen in the layering direction and is disposed at a position on an opposite side of the second signal line from the first signal line; a third transmission line includes the third signal line, the first ground conductor, the second ground conductor, the insulating base material layer sandwiched between the third signal line and the first ground conductor of the plurality of insulating base material layers, and the insulating base material layer sandwiched between the third signal line and the second ground conductor of the plurality of insulating base material layers; the second signal line is disposed on a layer of the plurality of insulating base material layers different from a layer including the third signal line and includes a portion extending side by side with the third signal line when seen in the layering direction; and the third ground conductor is disposed on a layer of the plurality of insulating base material layers including the third signal line or a layer of the plurality of insulating base material layers positioned between the third signal line and the second signal line. ### Claim 10 (depends on 9) The multilayer board according to claim 9, wherein the second opening includes a plurality of second openings that are arranged along an extending direction of the third signal line when seen in the layering direction. ### Claim 11 An electronic device comprising: a first circuit; a second circuit; and a multilayer board; wherein the first circuit and the second circuit are connected by the multilayer board; the multilayer board includes: a layered body including a plurality of insulating base material layers that are layered; and a first signal line, a second signal line, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, an interlayer connecting conductor, and a first sub-ground conductor provided in and on the plurality of insulating base material layers; wherein a first transmission line includes the first signal line, the first ground conductor, the second ground conductor, the insulating base material layer sandwiched between the first signal line and the first ground conductor of the plurality of insulating base material layers, and the insulating base material layer sandwiched between the first signal line and the second ground conductor of the plurality of insulating base material layers; a second transmission line includes the second signal line, the second ground conductor, the third ground conductor, the insulating base material layer sandwiched between the second signal line and the second ground conductor of the plurality of insulating base material layers, and the insulating base material layer sandwiched between the second signal line and the third ground conductor of the plurality of insulating base material layers; the first signal line overlaps the first opening when seen in a layering direction of the plurality of insulating base material layers; no signal line exists between the second signal line and the first signal line; the second signal line is provided on a layer different from a layer of the plurality of insulating base material layers including the first signal line; the second signal line includes a portion extending side by side with the first signal line when seen in the layering direction; the first ground conductor, the second ground conductor, and the third ground conductor are connected by the interlayer connecting conductor; the third ground conductor is disposed on a layer of the plurality of insulating base material layers including the first signal line or a layer of the plurality of insulating base material layers positioned between the first signal line and the second signal line of the plurality of insulating base material layers; the first sub-ground conductor is disposed between the first signal line and the second signal line when seen in the layering direction and disposed between the second ground conductor and the third ground conductor in the layering direction; and the second ground conductor and the third ground conductor are connected by the first sub-ground conductor and the interlayer connecting conductor. ### Claim 12 (depends on 11) The electronic device according to claim 11, further comprising: a second sub-ground conductor provided on the plurality of insulating base material layers; wherein the second sub-ground conductor is disposed at a position on an opposite side of the first signal line from the second signal line when seen in the layering direction and disposed between the first ground conductor and the third ground conductor in the layering direction. ### Claim 13 (depends on 11) The electronic device according to claim 11, further comprising: a third sub-ground conductor provided on the plurality of insulating base material layers; wherein the third sub-ground conductor is disposed at a position on an opposite side of the second signal line from the first signal line when seen in the layering direction and disposed between the second ground conductor and the third ground conductor in the layering direction. ### Claim 14 (depends on 11) The electronic device according to claim 11, wherein the interlayer connecting conductor includes a first interlayer connecting conductor disposed between the first signal line and the second signal line when seen in the layering direction. ### Claim 15 (depends on 11) The electronic device according to claim 11, wherein the interlayer connecting conductor includes a second interlayer connecting conductor disposed at a position on an opposite side of the first signal line from the second signal line when seen in the layering direction. ### Claim 16 (depends on 11) The electronic device according to claim 11, wherein the interlayer connecting conductor includes a third interlayer connecting conductor disposed at a position on an opposite side of the second signal line from the first signal line when seen in the layering direction. ### Claim 17 (depends on 11) The electronic device according to claim 11, wherein the first transmission line is configured to transmit an analog signal; and the second transmission line is configured to transmit a digital signal. ### Claim 18 (depends on 11) The electronic device according to claim 11, wherein the first opening includes a plurality of first openings that are arranged along an extending direction of the first signal line when seen in the layering direction. ### Claim 19 (depends on 11) The electronic device according to claim 11, further comprising: a third signal line provided on one of the plurality of insulating base material layers; and a second opening provided in the first ground conductor; wherein the third signal line overlaps the second opening when seen in the layering direction and is disposed at a position on an opposite side of the second signal line from the first signal line; a third transmission line includes the third signal line, the first ground conductor, the second ground conductor, the insulating base material layer sandwiched between the third signal line and the first ground conductor of the plurality of insulating base material layers, and the insulating base material layer sandwiched between the third signal line and the second ground conductor of the plurality of insulating base material layers; the second signal line is disposed on a layer of the plurality of insulating base material layers different from a layer including the third signal line and includes a portion extending side by side with the third signal line when seen in the layering direction; and the third ground conductor is disposed on a layer of the plurality of insulating base material layers including the third signal line or a layer of the plurality of insulating base material layers positioned between the third signal line and the second signal line. ### Claim 20 (depends on 19) The electronic device according to claim 19, wherein the second opening includes a plurality of second openings that are arranged along an extending direction of the third signal line when seen in the layering direction.