# US 10,873,052 B2 · Mask plate and thin-film encapsulation method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,873,052 B2 - Document ID: US10873052B2 - Status: Granted - Kind: B2 - Application number: 16/084,869 - Filed: 2018-02-11 - Published: 2020-09-24 - Granted: 2020-12-22 - Earliest claimed: 2017-11-27 - Assignees: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. - Applicants: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. - Inventors: Xiao Du; Yungsheng Chen - Web page: https://patentgrep.com/patent/US10873052B2 ## CPC - C23C 16/042: {using masks} - H10K 71/70: Testing, e.g. accelerated lifetime tests - H10K 59/10: OLED displays - H10K 59/873: {Encapsulations} - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract The present invention provides a mask plate, including a shielding region and an opening region. Wherein the shielding region surrounds the opening region, a shape and location of the opening region corresponds to a film forming region and a portion of a bonding region of a sub-pixel such that a thin film encapsulation material which passes the opening region covers the film forming region and the portion of the bonding region of the sub-pixel, and revealing a FPC region and a testing port. Accordingly, the traces of the boning region on the sub-pixel can be covered and protected by the thin film in order to solve the problem that the traces are damaged or broken so that a lighting yield rate is decreased. ## Claims ### Claim 1 A mask plate, comprising: a shielding region and an opening region; wherein the shielding region surrounds the opening region, a shape and location of the opening region corresponds to a film forming region and a portion of a bonding region of a sub-pixel such that a thin film encapsulation material which passes the opening region covers the film forming region and the portion of the bonding region of the sub-pixel, and revealing a flexible printed circuit (FPC) region and a testing port; wherein the shielding region of the mask plate includes an outer frame and a stopping block extended from a middle portion of a bottom edge of the outer frame to an interior of the opening region of the mask plate and the opening region of the mask plate comprises a primary open space corresponding to the film forming region and secondary open spaces extending from and in communication with the primary open space to respectively define a first opening and a second opening at two sides of the stopping block to expose the portion of the bonding region of the sub-pixel, wherein the stopping block masks the FPC region on the sub-pixel. ### Claim 2 (depends on 1) The mask plate according to claim 1, wherein the stopping block is a rectangle, left and right sides at the interior of the shielding region, a top edge, and an extension of an upper edge of the stopping block at the bottom edge commonly form a rectangular region of the opening region, each of the first opening and the second opening is a rectangle and a width of the first opening and a width of the second opening are the same. ### Claim 3 (depends on 2) The mask plate according to claim 2, wherein the left and right edges and the top edge at the interior of the shielding region are offset outwardly with 100˜500 μm with respect to a corresponding location of the film forming region of the sub-pixel, a distance between the bottom edge of the interior of the shielding region and an upper edge of the bonding region is 100˜500 μm. ### Claim 4 (depends on 2) The mask plate according to claim 2, wherein a distance between the upper edge of the stopping block and a lower edge of the bonding region is 100˜500 μm. ### Claim 5 (depends on 1) The mask plate according to claim 1, wherein a thickness of the mask plate is 0.01˜0.3 mm. ### Claim 6 (depends on 1) The mask plate according to claim 1, wherein the number of the opening regions is above two, and the opening regions are disposed separately. ### Claim 7 (depends on 6) The mask plate according to claim 6, wherein the opening regions are arranged as a matrix on the mask plate. ### Claim 8 A thin-film encapsulation method, comprising following steps: providing a mask plate, wherein the mask plate includes a shielding region and an opening region, the shielding region surrounds the opening region, a shape and location of the opening region corresponds to a film forming region and a portion of a bonding region of a sub-pixel; aligning the mask plate with a glass substrate on which the sub-pixel provided and moving the mask plate to be close to the glass substrate; inputting a thin-film encapsulation material to pass through the opening region of the mask plate in order to form an encapsulation protection layer on the glass substrate, wherein the thin-film encapsulation material which passes through the opening region covers the film forming region and the portion of the bonding region of the sub-pixel to which the opening region corresponds, such that a flexible printed circuit (FPC) region and a testing port of the sub-pixel are not covered by the thin-film encapsulation material and are thus exposed; and separating the mask plate from the glass substrate, and inspecting a status of a thin film formed on the glass substrate; wherein the shielding region of the mask plate includes an outer frame and a stopping block extended from a middle portion of a bottom edge of the outer frame to an interior of the opening region of the mask plate and the opening region of the mask plate comprises a primary open space corresponding to the film forming region and secondary open spaces extending from and in communication with the primary open space to respectively define a first opening and a second opening at two sides of the stopping block to expose the portion of the bonding region of the sub-pixel, wherein the stopping block masks the FPC region on the sub-pixel. ### Claim 9 (depends on 8) The thin-film encapsulation method according to claim 8, wherein the mask plate is coated with a corrosion protection film in advance.