# US 10,873,012 B2 · LED light bulb having filament with layered light conversion layer

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- Number: US 10,873,012 B2
- Document ID: US10873012B2
- Status: Granted
- Kind: B2
- Application number: 16/666,432
- Filed: 2019-10-29
- Published: 2020-02-27
- Granted: 2020-12-22
- Earliest claimed: 2017-12-26
- Assignees: J1Axing Super Lighting Electric Appliance Co., Ltd
- Applicants: Jiaxing Super Lighting Electric Appliance Co., Ltd
- Inventors: Tao Jiang; Weihong Xu; Yukihiro Saito; Hayato Unagike; Aiming Xiong; Junfeng Xu; Yiching Chen
- Web page: https://patentgrep.com/patent/US10873012B2

## CPC

- F21K 9/232: specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
- H10H 20/8516: {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient}
- F21K 9/237: Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases (F21K9/238 takes precedence)
- F21V 3/08: the material comprising photoluminescent substances
- F21V 9/32: characterised by the arrangement of the photoluminescent material
- H10H 20/8511: {characterised by their material, e.g. binder}
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 90/00: Package configurations
- F21Y 2103/10: comprising a linear array of point-like light-generating elements
- F21Y 2105/12: characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
- F21Y 2107/00: Light sources with three-dimensionally disposed light-generating elements
- F21Y 2109/00: Light sources with light-generating elements disposed on transparent or translucent supports or substrates
- F21Y 2115/10: Light-emitting diodes [LED]
- H10H 20/85: Packages
- H10H 20/8513: {having two or more wavelength conversion materials}
- H10W 72/07552: {changes in structures or sizes}
- H10W 72/527: {Multiple bond wires having different sizes}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/10: characterised by their shape or disposition
- H10W 90/753: {between laterally-adjacent chips}
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED

## Abstract

An LED light bulb, comprising of: a lamp housing; a bulb base connected to the lamp housing; a stem connected to the bulb base and located in the lamp housing; a single flexible LED filament, disposed in the lamp housing, the flexible LED filament comprising: a plurality of LED sections; a plurality of conductive sections, located between the adjacent two LED sections, where each of the conductive sections includes a conductor, the conductor is copper foil; at least two conductive electrodes; and a light conversion layer comprising a phosphor layer and a silicon layer superposed on the phosphor layer, disposed on the LED chips and at least two sides of the conductive electrodes, and a portion of the conductive electrodes is exposed by the light conversion layer, the LED chip comprising a upper surface and a lower surface opposite to the upper surface of the LED chip, the phosphor layer directly contacts the upper surface of the LED chip, and a base layer contacts the lower surface of the LED chip; the base layer is formed from organosilicon-modified polyimide resin composition comprising an organosilicon-modified polyimide and a thermal curing agent.

## Claims

### Claim 1

An LED light bulb, consisting of:
a lamp housing doped with a golden yellow material or its surface coated with a yellow film;
a bulb base connected to the lamp housing;
a stem connected to the bulb base and located in the lamp housing, the stem comprises a stand extending to the center of the lamp housing;
a single flexible LED filament, disposed in the lamp housing, the flexible LED filament comprising:
a plurality of LED sections, each of the LED sections includes at least one LED chip;
a plurality of conductive sections, located between the adjacent two LED sections, where each of the conductive sections includes a conductor, the conductor is copper foil;
at least two conductive electrodes, respectively disposed corresponding to the LED sections and electrically connected to the LED sections; and
a light conversion layer comprising a phosphor layer and a silicon layer superposed on the phosphor layer, disposed on the LED chips and at least two sides of the conductive electrodes, and a portion of the conductive electrodes is exposed by the light conversion layer, the LED chip comprising a upper surface and a lower surface opposite to the upper surface of the LED chip, wherein the phosphor layer directly contacts the upper surface of the LED chip, and a base layer contacts the lower surface of the LED chip;
two conductive supports, each of the two conductive supports connected with both the stem and the flexible LED filament; and
a driving circuit, electrically connected with the two conductive supports;
a plurality of supporting arms, each of the supporting arms comprise a first end and a second end opposite to the first end of the supporting arms, the first end of each of the supporting arms is connected with the stand while the second end of each of the supporting arms is connected with the flexible LED filament;
wherein the base layer is formed from organosilicon-modified polyimide resin composition comprising an organosilicon-modified polyimide and a thermal curing agent, wherein the organosilicon-modified polyimide comprises a repeating unit represented by the following general Formula (I):
wherein Ar1 is a tetra-valent organic group having a benzene ring or an alicyclic hydrocarbon structure, Ar2 is a di-valent organic group having a monocyclic alicyclic hydrocarbon structure, R is each independently methyl or phenyl, n is 1˜5;
wherein the organosilicon-modified polyimide has a number average molecular weight of 5000˜100000;
wherein the thermal curing agent is selected from the group consisting of epoxy resin, isocyanate and bisoxazoline compounds.

### Claim 2 (depends on 1)

The LED light bulb according to claim 1, wherein the thickness of the phosphor layer and the silicon layer are equal.

### Claim 3 (depends on 1)

The LED light bulb according to claim 1, wherein the thickness of the phosphor layer and the silicon layer are unequal.

### Claim 4 (depends on 3)

The LED light bulb according to claim 3, wherein the thickness of the phosphor layer and the silicon layer respectively is 30 to 70 um and 30 to 50 um.

### Claim 5 (depends on 4)

The LED light bulb according to claim 4, wherein the silicon layer does not contain phosphor.

### Claim 6 (depends on 5)

The LED light bulb according to claim 5, wherein each of the LED sections includes at least two LED chips that are electrically connected to each other.

### Claim 7 (depends on 6)

The LED light bulb according to claim 6, wherein Ar1 is derived from a dianhydride, and Ar2 is derived from a diamine.

### Claim 8 (depends on 7)

The LED light bulb according to claim 7, wherein Ar1 is a tetra-valent organic group having a monocyclic alicyclic hydrocarbon structure or a bridged-ring alicyclic hydrocarbon structure, Ar2 is a di-valent organic group comprising a functional group having active hydrogen, where the functional group having active hydrogen is any one of hydroxyl, amino, carboxy and mercapto.

### Claim 9 (depends on 8)

The LED light bulb according to claim 8, wherein the organosilicon-modified polyimide resin composition further comprises an additive selected from the group consisting of fluorescent powders, heat dispersing particles and a coupling agent.

### Claim 10 (depends on 9)

The LED light bulb according to claim 9, wherein the heat dispersing particles have a particle size distribution of 0.1˜100 μm, the content of small particle size of below 1 μm is 5˜20%, the content of medium particle size of 1˜30 μm is 50˜70%, and the content of large particle size of above 30 μm is 20˜40%.

### Claim 11 (depends on 10)

The LED light bulb according to claim 10, wherein the content of the fluorescent powders is no more than 7 times of the weight of the organosilicon-modified polyimide.

### Claim 12 (depends on 11)

The LED light bulb according to claim 11, wherein the base layer has an elongation at break of 1˜5%, and a refractive index of 1.4˜1.55.

### Claim 13 (depends on 12)

The LED light bulb according to claim 12, wherein a spectral distribution of the light bulb is between wavelength range of about 400 nm to 800 nm, and three peak wavelengths P1, P2, P3 are appeared in the wavelength ranges corresponding to light emitted by the light bulb, the wavelength of the peak P1 is between 430 nm and 480 nm, the wavelength of the peak P2 is between 580 nm and 620 nm, and the wavelength of the peak P3 is between 680 nm and 750 nm, wherein a light intensity of the peak P1 is less than that of the peak P2, and the light intensity of the peak P2 is less than that of the peak P3.

### Claim 14 (depends on 13)

The LED light bulb according to claim 13, wherein points of the flexible LED filament in an xyz coordinates are defined as X, Y, and Z, an x-y plane of the xyz coordinates is perpendicular to the height direction of the light bulb, a z-axis of xyz coordinates is parallel with stem, where the conductive sections comprising first conductive sections and second conductive sections, and every two adjacent LED sections are connected by the bending first and second conductive sections, and the number of the first conductive sections is one more than the number of the second conductive sections.

### Claim 15 (depends on 14)

The LED light bulb according to claim 14, wherein the flexible LED filament comprise three first conductive sections, two second conductive section, and six LED sections and every two adjacent LED sections are connected by the bending first and second conductive sections.

### Claim 16 (depends on 15)

The LED light bulb according to claim 15, wherein the height of each of the three first conductive sections is greater than the height of each of the two second conductive section in the Z direction.

### Claim 17 (depends on 16)

The LED light bulb according to claim 16, wherein the height of each of the two conductive electrodes is less than the height of each of the first conductive section in the Z direction.

### Claim 18 (depends on 17)

The LED light bulb according to claim 17, wherein the projections of the opposite LED sections are overlapped each other when the flexible LED filament is projected on the XZ plane.

### Claim 19 (depends on 18)

The LED light bulb according to claim 18, wherein when the flexible LED filament is projected on the XY plane, the projections of the second conductive sections are located in one side of a straight line connecting between the two conductive electrodes.

### Claim 20 (depends on 19)

The LED light bulb according to claim 19, wherein when the flexible LED filament is projected on the XY plane, the projections of a portion of the first conductive sections are located in one side of a straight line connecting between the two conductive electrodes.