# US 10,872,999 B2 · Optoelectronic module having dual encapsulation with opening for receiving an optical assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,999 B2 - Document ID: US10872999B2 - Status: Granted - Kind: B2 - Application number: 15/999,848 - Filed: 2017-02-17 - Published: 2020-04-23 - Granted: 2020-12-22 - Earliest claimed: 2016-02-19 - Assignees: ams Sensors Singapore Pte. Ltd. - Applicants: ams Sensors Singapore Pte. Ltd. - Inventors: Camilla Camarri; Mario Cesana; Hartmut Rudmann - Web page: https://patentgrep.com/patent/US10872999B2 ## CPC - G01S 7/4814: {of transmitters alone} - G01S 7/4816: {of receivers alone} - H10F 55/00: Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto - H10F 55/25: wherein the radiation-sensitive devices and the electric light source are all semiconductor devices - H10F 77/407: {indirectly associated with the devices} - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10F 99/00: Subject matter not provided for in other groups of this subclass - H10W 90/00: Package configurations - G01S 7/4813: {Housing arrangements} - G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An optoelectronic module includes first and second optical channels having respective active optoelectronic components. A transparent encapsulation is over the active optoelectronic components, and opaque encapsulation is on the transparent encapsulation. The opaque encapsulation has a first opening over a first active optoelectronic component and a second opening over a second optoelectronic component. The opaque encapsulation forms a ledge in an area of the second opening, and an optical assembly is disposed on the ledge within the second opening over the second optoelectronic component. ## Claims ### Claim 1 An optoelectronic module comprising: first and second optical channels; a first active optoelectronic component disposed in the first optical channel; a second active optoelectronic component disposed in the second optical channel; a first region of transparent encapsulation over the first active optoelectronic component, and a second region of transparent encapsulation over the second active optoelectronic component, wherein the first and second regions of transparent encapsulations are composed of the same material as one another; opaque encapsulation on the first and second regions of transparent encapsulation, wherein the opaque encapsulation has a first opening over the first active optoelectronic component and a second opening over the second active optoelectronic component, the opaque encapsulation forming a ledge in an area of the second opening; an optical assembly disposed on the ledge within the second opening over the second active optoelectronic component; and a substrate on which the first and second optoelectronics are mounted, wherein the second region of transparent encapsulation extends to a height above the substrate less than a height to which first region of transparent encapsulation extends. ### Claim 2 (depends on 1) The optoelectronic module of claim 1 wherein the opaque encapsulation is molded directly to the first and second regions of transparent encapsulation. ### Claim 3 (depends on 1) The optoelectronic module of claim 1 wherein the opaque encapsulation is an overmold on the first and second regions of transparent encapsulation. ### Claim 4 (depends on 1) The optoelectronic module of claim 1 wherein the opaque encapsulation comprises a photo-structured, opaque coating. ### Claim 5 (depends on 1) The optoelectronic module of claim 1 wherein the first and second openings are formed in the photo-structured, opaque coating. ### Claim 6 (depends on 1) The optoelectronic module of claim 1 wherein one of the active optoelectronic components comprises an optical emitter and the other one of the active optoelectronic components comprises an optical sensor. ### Claim 7 (depends on 6) The optoelectronic module of claim 6 wherein the first and second transparent encapsulations are substantially transparent to a wavelength of light emitted by the optical emitter. ### Claim 8 (depends on 1) The optoelectronic module of claim 1 wherein the first active optoelectronic component comprises an optical emitter and the second active optoelectronic component comprises an optical sensor. ### Claim 9 (depends on 1) The optoelectronic module of claim 1 wherein the first region of transparent encapsulation over the first active optoelectronic component includes a passive optical element operable to modify a property of light passing through the passive optical element. ### Claim 10 (depends on 1) The optoelectronic module of claim 1 wherein the opaque encapsulation defines walls and a top of the module. ### Claim 11 (depends on 1) The optoelectronic module of claim 1 wherein the optical assembly includes: a barrel containing one or more optical elements, wherein the barrel has a thread on its external surface; a holder for the barrel, wherein the barrel is arranged within the holder such that a thread on an inner surface of the holder engages the thread of the barrel. ### Claim 12 (depends on 1) The optoelectronic module of claim 1 wherein the optical assembly includes: a barrel containing one or more optical elements, wherein the barrel has a thread on its external surface, the barrel being arranged within the second opening such that the thread on the external surface of the barrel engages an opposing thread on a sidewall of the second opening. ### Claim 13 (depends on 11) The optoelectronic module of claim 11, wherein the second opening and the ledge have a circular shape. ### Claim 14 (depends on 1) The optoelectronic module of claim 1, further comprising an opaque dam disposed on the substrate and across the optoelectronic module between the first and the second optoelectronic components, and wherein the opaque encapsulation includes a wall portion which extends above and abuts the opaque dam.