# US 10,872,976 B2 · Transistor arrangement with a load transistor and a sense transistor

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- Number: US 10,872,976 B2
- Document ID: US10872976B2
- Status: Granted
- Kind: B2
- Application number: 16/248,014
- Filed: 2019-01-15
- Published: 2019-07-18
- Granted: 2020-12-22
- Earliest claimed: 2018-01-16
- Assignees: Infineon Technologies Austria AG
- Applicants: Infineon Technologies Austria AG
- Inventors: Gerhard Noebauer
- Web page: https://patentgrep.com/patent/US10872976B2

## CPC

- H10D 30/669: {having voltage-sensing or current-sensing structures, e.g. emulator sections or overcurrent sensing cells}
- H10D 30/668: {having trench gate electrodes, e.g. UMOS transistors}
- H10D 62/127: {of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs}
- H10D 62/154: {Dispositions}
- H10D 62/158: {Dispositions}
- H10D 64/111: {Field plates}
- H10D 64/117: {Recessed field plates, e.g. trench field plates or buried field plates}
- G01R 19/0092: {Measuring current only}
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

A transistor arrangement and a method are disclosed. The transistor arrangement includes: a drift and drain region arranged in a semiconductor body and connected to a drain node; a plurality of load transistor cells each including a source region integrated in a first region of the semiconductor body; a plurality of sense transistor cells each including a source region integrated in a second region of the semiconductor body; a first source node electrically connected to the source region of each load transistor cell via a first source conductor having a first area specific resistance; and a second source node electrically connected to the source region of each sense transistor cell via a second source conductor having a second area specific resistance. The area specific resistance of the second source conductor is greater than the area specific resistance of the first source conductor.

## Claims

### Claim 1

A transistor arrangement, comprising:
a drift and drain region arranged in a semiconductor body and each connected to a drain node;
a plurality of load transistor cells each comprising a source region integrated in a first region of the semiconductor body;
a plurality of sense transistor cells each comprising a source region integrated in a second region of the semiconductor body;
a first source node electrically connected to the source region of each of the plurality of the load transistor cells via a first source conductor having a first area specific resistance; and
a second source node electrically connected to the source region of each of the plurality of the sense transistor cells via a second source conductor having a second area specific resistance,
wherein a second area specific resistance of the second source conductor is greater than a first area specific resistance of the first source conductor,
wherein the first area specific resistance is given by a resistance of the first source conductor multiplied with an overall area of the first region, and wherein the second area specific resistance is given by a resistance of the second source conductor multiplied an overall area of the second region.

### Claim 2 (depends on 1)

The transistor arrangement of claim 1, wherein the first source conductor comprises:
a first source metallization connected to the source region of each transistor cell of the plurality of load transistor cells; and
a first source pad arranged on top of the source metallization.

### Claim 3 (depends on 1)

The transistor arrangement of claim 1, wherein the second source conductor comprises:
a second source metallization connected to the source region of each transistor cell of the plurality of sense transistor cells;
a second source pad spaced apart from the second source metallization in a horizontal direction of the semiconductor body; and
a connection line electrically connecting the second source metallization with the second source pad.

### Claim 4 (depends on 3)

The transistor arrangement of claim 3, wherein the connection line comprises a section with locally reduced width, a section with locally reduced thickness, and/or a meandering section.

### Claim 5 (depends on 1)

The transistor arrangement of claim 1, wherein the second area specific resistance of the second source conductor (302) is given by R302·A2=c·(R101·A1−R102·A2)+R301·A1, where:
c is a constant selected from between 0.5 and 1.5;
R302·A2 is the second area specific resistance of the second source conductor;
R301·A1 is the first area specific resistance of the first source conductor;
R101·A1 is an area specific resistance of the drift and drain region between the plurality of the load transistor cells and the drain node;
R102·A2 is an area specific resistance of the drift and drain region between the plurality of the sense transistor cells and the drain node,
wherein A1 is the size of the area of the first region,
wherein A2 is the size of the area of the second region,
wherein R101 is a drift and drain region resistance of the load transistor,
wherein R102 is a drift and drain region resistance of the sense transistor,
wherein R301 is a source conductor resistance of the load transistor, and
wherein R302 is a source conductor resistance of the sense transistor.

### Claim 6 (depends on 1)

The transistor arrangement of claim 1, wherein each of the load transistor cells and sense transistor cells further comprises:
a body region; and
a gate electrode dielectrically insulated from the body region by a gate dielectric.

### Claim 7 (depends on 6)

The transistor arrangement of claim 6, wherein each of the load transistor cells and sense transistor cells further comprises:
a field electrode dielectrically insulated from the drift and drain region by a field electrode dielectric.

### Claim 8 (depends on 1)

The transistor arrangement of claim 1, further comprising:
an inactive region between the first region and the second region of the semiconductor body.

### Claim 9 (depends on 8)

The transistor arrangement of claim 8, wherein a dimension of the inactive region is greater than 0.5 times a square root of the size of the second region.

### Claim 10 (depends on 8)

The transistor arrangement of claim 8, wherein the inactive region comprises inactive transistor cells.

### Claim 11

An electronic circuit, comprising:
a transistor arrangement comprising:
a drift and drain region arranged in a semiconductor body and each connected to a drain node;
a plurality of load transistor cells each comprising a source region integrated in a first region of the semiconductor body;
a plurality of sense transistor cells each comprising a source region integrated in a second region of the semiconductor body;
a first source node electrically connected to the source region of each of the plurality of the load transistor cells via a first source conductor having a first area specific resistance; and
a second source node electrically connected to the source region of each of the plurality of the sense transistor cells via a second source conductor having a second area specific resistance,
wherein a second area specific resistance of the second source conductor is greater than a first area specific resistance of the first source conductor,
wherein the first area specific resistance is given by a resistance of the first source conductor multiplied with an overall area of the first region, and wherein the second area specific resistance is given by a resistance of the second source conductor multiplied an overall area of the second region; and
a regulator connected to the first source node and the second source node and configured to regulate an electric potential at the second source node such that the electric potential at the second source node essentially equals an electric potential at the first source node.

### Claim 12 (depends on 11)

The electronic circuit of claim 11, wherein the first source conductor comprises:
a first source metallization connected to the source region of each transistor cell of the plurality of load transistor cells; and
a first source pad arranged on top of the source metallization.

### Claim 13 (depends on 11)

The electronic circuit of claim 11, wherein the second source conductor comprises:
a second source metallization connected to the source region of each transistor cell of the plurality of sense transistor cells;
a second source pad spaced apart from the second source metallization in a horizontal direction of the semiconductor body; and
a connection line electrically connecting the second source metallization with the second source pad.

### Claim 14 (depends on 13)

The electronic circuit of claim 13, wherein the connection line comprises a section with locally reduced width, a section with locally reduced thickness, and/or a meandering section.

### Claim 15 (depends on 11)

The electronic circuit of claim 11, wherein the transistor arrangement further comprises an inactive region between the first region and the second region of the semiconductor body.

### Claim 16 (depends on 15)

The electronic circuit of claim 15, wherein a dimension of the inactive region is greater than 0.5 times a square root of the size of the second region of the semiconductor body.

### Claim 17 (depends on 15)

The electronic circuit of claim 15, wherein the inactive region comprises inactive transistor cells.

### Claim 18 (depends on 1)

The transistor arrangement of claim 1, wherein the first source conductor comprises a first source metallization connected to the source region of each transistor cell of the plurality of load transistor cells, wherein the second source conductor comprises a second source metallization connected to the source region of each transistor cell of the plurality of sense transistor cells, wherein the first and second source metallizations are different portions of the same layer of metallization, and wherein the greater area specific resistance of the second source metallization is at least partially provided by a connector that is electrically connected between the second source metallization and a contact pad.