# US 10,872,949 B2 · Display panel and display device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,949 B2 - Document ID: US10872949B2 - Status: Granted - Kind: B2 - Application number: 16/229,033 - Filed: 2018-12-21 - Published: 2019-09-26 - Granted: 2020-12-22 - Earliest claimed: 2018-03-22 - Assignees: Boe Technology Group Co., Ltd. - Applicants: Boe Technology Group Co., Ltd. - Inventors: Hongfei Cheng; Yuxin Zhang - Web page: https://patentgrep.com/patent/US10872949B2 ## CPC - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout} - H10K 59/87: {Passivation; Containers; Encapsulations} - H10K 59/8722: {Peripheral sealing arrangements, e.g. adhesives, sealants} - H10K 59/873: {Encapsulations} - H10H 20/812: within the light-emitting regions, e.g. having quantum confinement structures - H10K 2102/311: {Flexible OLED} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract The present disclosure provides a display panel and a display device. The display panel includes a power supply wiring layer on a base substrate and an encapsulation layer on a side of the power supply wiring layer distal to the base substrate. The power supply wiring layer and the encapsulation layer at least partially overlap, and a part of the power supply wiring layer overlapping with the encapsulation layer has an irregular structure for increasing a contact area between the power supply wiring layer and the encapsulation layer. ## Claims ### Claim 1 A display panel, comprising: a power supply wiring layer on a base substrate and an encapsulation layer on a side of the power supply wiring layer distal to the base substrate, wherein the power supply wiring layer and the encapsulation layer at least partially overlap, and a part of the power supply wiring layer overlapping with the encapsulation layer has an irregular structure for increasing a contact area between the power supply wiring layer and the encapsulation layer, wherein the power supply wiring layer comprises a power supply bonding wire in a peripheral region of the display panel, the power supply bonding wire at least partially overlaps with the encapsulation layer, an orthographic projection, on the base substrate, of a part of the power supply bonding wire overlapping with the encapsulation layer has an outline at least partly having a nonlinear shape, and an orthographic projection, on the base substrate, of a part of the power supply bonding wire not overlapping with the encapsulation layer has an outline at least partly having a nonlinear shape. ### Claim 2 (depends on 1) The display panel according to claim 1, wherein the power supply wiring layer further comprises a power supply bus in a peripheral region of the display panel and overlapping with the encapsulation layer, and an outline of an orthographic projection of the power supply bus on the base substrate at least partly has a nonlinear shape. ### Claim 3 (depends on 2) The display panel according to claim 2, wherein the nonlinear shape comprises one or any combination of an arc shape, a fold-line shape, and a wave shape. ### Claim 4 (depends on 3) The display panel according to claim 3, wherein an outline, close to the peripheral region of the display panel, of the orthographic projection of the power supply bus on the base substrate has a wave shape; and/or an outline, close to a display region of the display panel, of the orthographic projection of the power supply bus on the base substrate has a wave shape. ### Claim 5 (depends on 2) The display panel according to claim 2, wherein the power supply bus comprises at least one of: a second protrusion on a side of the power supply bus facing the encapsulation layer; and a second hollowed-out part in the power supply bus. ### Claim 6 (depends on 5) The display panel according to claim 5, wherein in a case where the power supply bus comprises the second protrusion, an orthographic projection of the second protrusion on the base substrate has one of: a circular shape, an elliptical shape, a square shape, a rectangular shape, and a diamond shape; and in a case where the power supply bus comprises the second hollowed-out part, the second hollowed-out part has one of: a circular shape, an elliptical shape, a square shape, a rectangular shape, and a diamond shape. ### Claim 7 (depends on 5) The display panel according to claim 5, wherein in a case where the power supply bus comprises only the second protrusion, the power supply bus comprises a plurality of second protrusions and the plurality of second protrusions are uniformly distributed; in a case where the power supply bus comprises only the second hollowed-out part, the power supply bus comprises a plurality of second hollowed-out parts and the plurality of second hollowed-out parts are uniformly distributed; and in a case where the power supply bus comprises the second protrusion and the second hollowed-out part, the second protrusion and the second hollowed-out part are uniformly distributed. ### Claim 8 (depends on 5) The display panel according to claim 5, wherein in a case where the power supply bus comprises the second protrusion, the second protrusion and the power supply bus are formed of a same material. ### Claim 9 (depends on 2) The display panel according to claim 2, wherein a surface of the power supply bus in contact with the encapsulation layer is at least partly a curved surface. ### Claim 10 (depends on 1) The display panel according to claim 1, wherein the nonlinear shape comprises one or any combination of an arc shape, a fold-line shape, and a wave shape. ### Claim 11 (depends on 1) The display panel according to claim 1, wherein the power supply bonding wire comprises at least one of: a first protrusion on a side of the power supply bonding wire facing the encapsulation layer; and a first hollowed-out part in the power supply bonding wire. ### Claim 12 (depends on 11) The display panel according to claim 11, wherein in a case where the power supply bonding wire comprises the first protrusion, an orthographic projection of the first protrusion on the base substrate has one of: a circular shape, an elliptical shape, a square shape, a rectangular shape, and a diamond shape; and in a case where the power supply bonding wire comprises the first hollowed-out part, an orthographic projection of the first hollowed-out part on the base substrate has one of: a circular shape, an elliptical shape, a square shape, a rectangular shape, and a diamond shape. ### Claim 13 (depends on 11) The display panel according to claim 11, wherein in a case where the power supply bonding wire comprises only the first protrusion, the power supply bonding wire comprises a plurality of first protrusions and the plurality of first protrusions are uniformly distributed; in a case where the power supply bonding wire comprises only the first hollowed-out part, the power supply bonding wire comprises a plurality of first hollowed-out parts and the plurality of first hollowed-out parts are uniformly distributed; and in a case where the power supply bonding wire comprises the first protrusion and the first hollowed-out part, the first protrusion and the first hollowed-out part are uniformly distributed. ### Claim 14 (depends on 11) The display panel according to claim 11, wherein in a case where the power supply bonding wire comprises the first protrusion, the first protrusion and the power supply bonding wire are formed of a same material. ### Claim 15 (depends on 1) The display panel according to claim 1, wherein a surface of the power supply bonding wire in contact with the encapsulation layer is at least partly a curved surface. ### Claim 16 (depends on 1) The display panel according to claim 1, wherein an entirety of an outline of an orthographic projection of the power supply bonding wire on the base substrate has a continuous nonlinear shape. ### Claim 17 (depends on 1) The display panel according to claim 1, wherein the power supply wiring layer further comprises a power supply wire in a display region of the display panel and overlapping with the encapsulation layer, and a third hollowed-out part is provided in the power supply wire. ### Claim 18 (depends on 1) A display device, comprising the display panel according to claim 1. ### Claim 19 (depends on 18) The display device according to claim 18, wherein the display panel is an organic light emitting diode display panel or a quantum dot light emitting diode display panel. ### Claim 20 (depends on 1) The display panel according to claim 1, wherein the irregular structure comprises at least one of a protrusion on a side of the power supply wiring layer facing the encapsulation layer; and a hollowed-out part in the power supply wiring layer.