# US 10,872,915 B2 · Optical package structure and method for manufacturing the same

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- Number: US 10,872,915 B2
- Document ID: US10872915B2
- Status: Granted
- Kind: B2
- Application number: 16/254,389
- Filed: 2019-01-22
- Published: 2020-07-23
- Granted: 2020-12-22
- Earliest claimed: 2019-01-22
- Assignees: Advanced Semiconductor Engineering, Inc.
- Applicants: Advanced Semiconductor Engineering, Inc.
- Inventors: Chia Yun Hsu; Ying-Chung Chen
- Web page: https://patentgrep.com/patent/US10872915B2

## CPC

- H10F 39/804: {Containers or encapsulations}
- H10F 39/011: {Manufacture or treatment of image sensors covered by group H10F39/12}
- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- H10F 71/137: {Batch treatment of the devices}
- H10F 77/40: Optical elements or arrangements (surface textures H10F77/70)
- H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80)
- H10W 72/01515: {Forming coatings}
- H10W 72/075: {of bond wires}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An optical package structure includes a substrate, an optical element, a spacer and an encapsulant. The substrate has a top surface. The optical element is disposed adjacent to the top surface of the substrate and has a first height H1. The spacer surrounds the optical element and has a top surface. A distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2. The encapsulant is disposed between the optical element and the spacer, and has a third height H3 at a position adjacent to the optical element. The encapsulant covers at least a portion of the optical element. The optical element is exposed from the encapsulant, and H2>H1≥H3.

## Claims

### Claim 1

An optical package structure, comprising:
a substrate having a top surface;
an optical element disposed adjacent to the top surface of the substrate and having a first height H1;
a spacer surrounding the optical element and having a top surface, wherein a distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2; and
an encapsulant disposed between the optical element and the spacer, and having a third height H3 at a position adjacent to the optical element, wherein the encapsulant covers at least a portion of the optical element, the optical element is exposed from the encapsulant, and H2>H1≥H3.

### Claim 2 (depends on 1)

The optical package structure of claim 1, wherein the optical element includes an optical sensing chip and a light-transmissive component.

### Claim 3 (depends on 1)

The optical package structure of claim 1, wherein the encapsulant has a concave surface.

### Claim 4 (depends on 1)

The optical package structure of claim 1, wherein the spacer is disposed on and attached to the substrate, and defines a tunnel.

### Claim 5 (depends on 4)

The optical package structure of claim 4, wherein a portion of the encapsulant is disposed in the tunnel of the spacer.

### Claim 6 (depends on 4)

The optical package structure of claim 4, wherein the spacer further defines an opening.

### Claim 7 (depends on 6)

The optical package structure of claim 6, wherein the opening is opposite to the tunnel.

### Claim 8 (depends on 6)

The optical package structure of claim 6, wherein the optical element is electrically connected to the substrate through a wire, and the wire is disposed in the opening of the spacer.

### Claim 9 (depends on 1)

The optical package structure of claim 1, wherein the spacer has an outer surface, and the encapsulant is exposed from the outer surface of the spacer.

### Claim 10 (depends on 9)

The optical package structure of claim 9, wherein the optical element is electrically connected to the substrate through a wire, and the wire is disposed under the spacer.

### Claim 11 (depends on 1)

The optical package structure of claim 1, wherein the encapsulant contacts the spacer.

### Claim 12 (depends on 1)

The optical package structure of claim 1, wherein a portion of the encapsulant is disposed under the spacer.

### Claim 13

An optical package structure, comprising:
a substrate having a top surface;
an optical element disposed adjacent to the top surface of the substrate;
a spacer surrounding the optical element and has an outer surface, wherein the spacer is disposed on and contacts the substrate, and the spacer defines a tunnel; and
an encapsulant covering at least a portion of the optical element and disposed between the optical element and the spacer, wherein the encapsulant is exposed from the outer surface of the spacer, and a lateral surface of the encapsulant is substantially coplanar with the outer surface of the spacer.

### Claim 14 (depends on 13)

The optical package structure of claim 13, wherein the optical element has a first height H1, the spacer has a top surface, a distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2, the encapsulant has a third height H3 at a position adjacent to the optical element, and H2>H1≥H3.

### Claim 15 (depends on 13)

The optical package structure of claim 13, wherein the optical element includes an optical sensing chip and a light-transmissive component.

### Claim 16 (depends on 13)

The optical package structure of claim 13, wherein the encapsulant has a concave surface.

### Claim 17 (depends on 13)

The optical package structure of claim 13, wherein a portion of the encapsulant is disposed in the tunnel of the spacer.

### Claim 18 (depends on 17)

The optical package structure of claim 17, wherein the spacer further defines an opening.

### Claim 19 (depends on 18)

The optical package structure of claim 18, wherein the opening is opposite to the tunnel.