# US 10,872,910 B2 · Display substrate motherboard, display substrate and fabrication method thereof, and display device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,910 B2 - Document ID: US10872910B2 - Status: Granted - Kind: B2 - Application number: 16/391,894 - Filed: 2019-04-23 - Published: 2020-03-05 - Granted: 2020-12-22 - Earliest claimed: 2018-08-30 - Assignees: Mianyang Boe Optoelectronics Technology Co., Ltd.; Boe Technology Group Co., Ltd. - Applicants: Mianyang Boe Optoelectronics Technology Co., Ltd.; Boe Technology Group Co., Ltd. - Inventors: Yansheng Li; Yingdan Zhang - Web page: https://patentgrep.com/patent/US10872910B2 ## CPC - G09G 3/20: for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix {no fixed position being assigned to or needed to be assigned to the individual characters or partial characters} - H10D 86/60: wherein the TFTs are in active matrices - G01R 31/2644: {Adaptations of individual semiconductor devices to facilitate the testing thereof} - H10D 86/021: {of multiple TFTs} - H10D 86/443: {adapted for preventing breakage, peeling or short circuiting} - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10P 74/273: {Interconnections for measuring or testing, e.g. probe pads} - G09G 2300/0426: Layout of electrodes and connections - G09G 2310/0281: Arrangement of scan or data electrode driver circuits at the periphery of a panel not inherent to a split matrix structure - G09G: ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION (arrangements for transferring data between digital computers and displays G06F3/14; static indicating arrangements comprising an association of a number of separate sources or light control cells G09F9/00; static indicating arrangements comprising integral associations of a number of light sources H01J, H01K, H10H, H05B33/12; scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission, details thereof H04N1/00) - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract At least one embodiment of the present disclosure provides a display substrate motherboard, a display substrate, a fabrication method thereof and a display device. The display substrate motherboard includes at least one display substrate unit, the display substrate unit includes a display region, a bonding region and a detection region, the bonding region is located on a side of the display region and the detection region is located on a side of the display region different from the bonding region and configured to detect the display substrate unit. ## Claims ### Claim 1 A display substrate motherboard, comprising at least one display substrate unit, the display substrate unit including: a display region; a bonding region, located on a side of the display region; and a detection region, located on a side of the display region that is opposite to the bonding region, and configured to detect the display substrate unit. ### Claim 2 (depends on 1) The display substrate motherboard according to claim 1, wherein, the display substrate unit includes a display function region, the display function region includes a display region and a bonding region, the detection region is located on a side of the display function region, and the display function region includes a signal line, a first end of the signal line extends to the bonding region, and a second end of the signal line that is opposite to the first end extends to the detection region. ### Claim 3 (depends on 2) The display substrate motherboard according to claim 2, further comprising: a detection contact pad, provided in the detection region and configured to be electrically connected with a detecting device during detection, wherein, the second end is electrically connected with the detection contact pad. ### Claim 4 (depends on 3) The display substrate motherboard according to claim 3, further comprising: a switching element, located in the detection region; wherein, the signal line is connected with the switching element in one-to-one correspondence, the second end of the signal line is electrically connected with a first end of the switching element, and a second end of the switching element is electrically connected with the detection contact pad. ### Claim 5 (depends on 4) The display substrate motherboard according to claim 4, further comprising: a detection control line, located in the detection region; wherein, the detection control line is electrically connected with a control end of the switching element, and is configured to provide a control signal that controls turn-on or turn-off of the switching element. ### Claim 6 (depends on 5) The display substrate motherboard according to claim 5, wherein, a number of detection control lines is set to one, and control ends of all the switching elements are electrically connected with the detection control line; or the number of detection control lines is set to be plural, the switching elements are divided into a plurality of groups, the plurality of groups are in one-to-one correspondence with the detection control lines, and a control end of each group of the switching elements is electrically connected with a corresponding one of the detection control lines. ### Claim 7 (depends on 5) The display substrate motherboard according to claim 5, wherein, the switching element is a thin film transistor, and the detection control line is electrically connected with a gate electrode of the thin film transistor. ### Claim 8 (depends on 4) The display substrate motherboard according to claim 4, wherein, the display substrate unit further includes a preset cutting line, the switching element is located between the preset cutting line and the display region, and the detection contact pad is located on a side of the preset cutting line that is opposite to the display region. ### Claim 9 (depends on 4) The display substrate motherboard according to claim 4, wherein, the detection contact pad is electrically connected with second ends of at least two of the switching elements. ### Claim 10 A display substrate, comprising: a display region; a bonding region, located on a side of the display region; and a detection region, located on a side of the display region that is opposite to the bonding region, and configured to detect the display substrate unit. ### Claim 11 (depends on 10) The display substrate according to claim 10, wherein, the display substrate comprises a display function region, the display function region includes the display region and the bonding region, the detection region is located on a side of the display function region, and the display function region includes a signal line, a first end of the signal line extends to the bonding region, and a second end of the signal line that is opposite to the first end extends to the detection region. ### Claim 12 (depends on 11) The display substrate according to claim 11, further comprising: a switching element, provided in the detection region, wherein, the second end of the signal line that is opposite to the first end is electrically connected with a first end of the switching element, and a second end of the switching element extends to a cutting edge of the display substrate that is located on a side of the detection region. ### Claim 13 (depends on 12) The display substrate according to claim 12, wherein, the second end of the switching element is aligned with the cutting edge of the display substrate that is located on a side of the detection region. ### Claim 14 (depends on 10) A display device, comprising the display substrate according to claim 10. ### Claim 15 A fabrication method of a display substrate, comprising: providing a base substrate, the base substrate including a plurality of display substrate unit regions, the display substrate unit region including a detection region, a display region and a bonding region, the bonding region being located on a side of the display realm that is opposite to the detection region; and cutting the base substrate along a preset cutting line passing through the detection region, to obtain the display substrate. ### Claim 16 (depends on 15) The fabrication method of the display substrate according to claim 15, wherein, the display substrate unit region includes a display function region, and the detection region is located on a side of the display function region, the fabrication method further comprises: forming a detection contact pad in the detection region, and forming a signal line on the display function region, a first end of the signal line extending to the bonding region, and a second end of the signal line that is opposite to the first end being electrically connected with the detection contact pad; the cutting the base substrate along the preset cutting line passing through the detection region includes: cutting the base substrate along the preset cutting line passing through the detection region and located on a side of the detection contact pad close to the display function region. ### Claim 17 (depends on 16) The fabrication method according to claim 16, further comprising: forming a switching element in the detection region; wherein, the second end of the signal line is electrically connected with a first end of the switching element, a second end of the switching element is electrically connected with the detection contact pad, and the preset cutting line is located between the second end of the switching element and the detection contact pad. ### Claim 18 (depends on 17) The fabrication method according to claim 17, further comprising: forming a detection control line in the detection region; wherein, the detection control line is formed to be electrically connected with the switching element, and is configured to control turn-on and turn-off of the switching element.