# US 10,872,882 B2 · LED module assemblies for displays > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,882 B2 - Document ID: US10872882B2 - Status: Granted - Kind: B2 - Application number: 16/674,570 - Filed: 2019-11-05 - Published: 2020-02-27 - Granted: 2020-12-22 - Earliest claimed: 2017-10-12 - Assignees: Lumens Co., Ltd. - Applicants: Lumens Co., Ltd. - Inventors: Chunki Min; Keunoh Kim; Huikyeong Noh; Kyungmin Cho - Web page: https://patentgrep.com/patent/US10872882B2 ## CPC - H10W 90/00: Package configurations - H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings - H10H 20/853: characterised by their shape - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract Disclosed is an LED module assembly for a display including a first LED module and a second LED module. The first LED module includes a first unit substrate, a plurality of LED chips mounted on the first unit substrate to form a plurality of pixels, and a first light absorbing layer formed on the first unit substrate. The second LED module includes a second unit substrate, a plurality of LED chips mounted on the second unit substrate to form a plurality of pixels, and a second light absorbing layer formed on the second unit substrate. The first unit substrate and the second unit substrate are laterally connected to each other. Each of the first light absorbing layer and the second light absorbing layer includes a plurality of valleys formed between the plurality of pixels. The first light absorbing layer includes a first inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the first unit substrate. The second light absorbing layer includes a second inclined portion formed obliquely from the upper end edge of the interface between the first unit substrate and the second unit substrate to the upper portion of the side surface of each of the outer LED chips mounted on the second unit substrate. At least one of the plurality of valleys is formed by the first inclined portion and the second inclined portion meeting each other. ## Claims ### Claim 1 An LED module assembly for a display comprising a plurality of LED modules comprising a first LED module and a second LED module, wherein the first LED module comprises: a first unit substrate; a plurality of pixels, each of which comprises at least three LED chips mounted on the first unit substrate; and a light absorbing layer formed on the first unit substrate and comprising a plurality of valleys, each of which is formed between the two adjacent LED chips in the corresponding pixel on the first unit substrate, and a plurality of valleys formed at constant intervals between the pixels adjacent to each other in the transverse direction and at constant intervals between the pixels adjacent to each other in the longitudinal direction, wherein the second LED module comprises: a second unit substrate connected to the first unit substrate while being in contact with one side surface of the first unit substrate; a plurality of pixels, each of which comprises at least three LED chips mounted on the second unit substrate; and a light absorbing layer formed on the second unit substrate and comprising a plurality of valleys, each of which is formed between the two adjacent LED chips in the corresponding pixel on the second unit substrate, and a plurality of valleys formed at constant intervals between the pixels adjacent to each other in the transverse direction and at constant intervals between the pixels adjacent to each other in the longitudinal direction, and wherein the widths of the valleys between the pixels are larger than those of the valleys between the chips. ### Claim 2 (depends on 1) The LED module assembly according to claim 1, wherein the light absorbing layers comprise a plurality of valleys formed between the plurality of pixels and at least one of the plurality of valleys is formed by a first inclined portion and a second inclined portion. ### Claim 3 (depends on 1) The LED module assembly according to claim 1, wherein the valleys between the pixels are deeper than the valleys between the chips. ### Claim 4 (depends on 1) The LED module assembly according to claim 1, wherein each of the valleys between the chips is formed from the upper end edge of the side surface of the corresponding LED chip and forms its lower end with the surface of the first unit substrate or the second unit substrate. ### Claim 5 (depends on 4) The LED module assembly according to claim 4, wherein the lower end of each of the valleys between the chips is located in the central portion between the two adjacent LED chips in the corresponding pixel and is curved. ### Claim 6 (depends on 1) The LED module assembly according to claim 1, wherein a light absorbing part is formed at the interface between the first unit substrate and the second unit substrate. ### Claim 7 (depends on 1) The LED module assembly according to claim 1, wherein the at least three LED chips are flip-chip bonded onto the first unit substrate or the second unit substrate. ### Claim 8 (depends on 1) The LED module assembly according to claim 1, wherein the side surfaces of the plurality of unit substrates comprising the first unit substrate and the second unit substrate are vertically cut surfaces. ### Claim 9 (depends on 1) The LED module assembly according to claim 1, wherein the surface of each of the at least three LED chips is exposed to the outside and lies at the same level as the upper end of the corresponding valley. ### Claim 10 An LED module assembly for a display comprising a plurality of LED modules comprising a first LED module and a second LED module, wherein the first LED module comprises: a first unit substrate; a plurality of pixels, each of which comprises at least three LED chips mounted on the first unit substrate; and a light absorbing layer formed on the first unit substrate and comprising a plurality of valleys, each of which is formed between the two adjacent LED chips in the corresponding pixel on the first unit substrate, and a plurality of valleys formed at constant intervals between the pixels adjacent to each other in the transverse direction and at constant intervals between the pixels adjacent to each other in the longitudinal direction, wherein the second LED module comprises: a second unit substrate in contact with and connected to the first unit substrate; a plurality of pixels, each of which comprises at least three LED chips mounted on the second unit substrate; and a light absorbing layer formed on the second unit substrate and comprising a plurality of valleys, each of which is formed between the two adjacent LED chips in the corresponding pixel on the second unit substrate, and a plurality of valleys formed at constant intervals between the pixels adjacent to each other in the transverse direction and at constant intervals between the pixels adjacent to each other in the longitudinal direction, and wherein the intervals in the longitudinal or transverse direction at the interface between the first unit substrate and the second unit substrate are the same as the intervals in the longitudinal or transverse direction in the first unit substrate or the second unit substrate. ### Claim 11 (depends on 10) The LED module assembly according to claim 10, wherein the plurality of light absorbing layers comprise a plurality of valleys formed at the intervals in the longitudinal or transverse direction and at least one of the plurality of valleys comprises a first inclined portion and a second inclined portion. ### Claim 12 (depends on 10) The LED module assembly according to claim 10, wherein the plurality of light absorbing layers comprise a plurality of valleys formed at the intervals in the longitudinal or transverse direction and a first inclined portion and/or a second inclined portion are formed between the outer ones of the pixels located on the plurality of unit substrates in the longitudinal or transverse direction. ### Claim 13 (depends on 10) The LED module assembly according to claim 10, wherein the valleys between the pixels are formed by a first inclined portion and a second inclined portion symmetric to each other with respect to the interface between the first unit substrate and the second unit substrate at the boundary between the first LED module and the second LED module. ### Claim 14 (depends on 10) The LED module assembly according to claim 10, wherein the valleys between the pixels are deeper than the valleys between the chips. ### Claim 15 (depends on 10) The LED module assembly according to claim 10, wherein each of the valleys between the chips is formed from the upper end edge of the side surface of the corresponding LED chip and forms its lower end with the surface of the first unit substrate or the second unit substrate. ### Claim 16 (depends on 15) The LED module assembly according to claim 15, wherein the lower end of each of the valleys between the chips is located in the central portion between the two adjacent LED chips in the corresponding pixel and is curved. ### Claim 17 (depends on 10) The LED module assembly according to claim 10, wherein a light absorbing part is formed at the interface between the first unit substrate and the second unit substrate. ### Claim 18 (depends on 10) The LED module assembly according to claim 10, wherein the at least three LED chips are flip-chip bonded onto the first unit substrate or the second unit substrate. ### Claim 19 (depends on 10) The LED module assembly according to claim 10, wherein the side surfaces of the plurality of unit substrates comprising the first unit substrate and the second unit substrate are vertically cut surfaces. ### Claim 20 (depends on 10) The LED module assembly according to claim 10, wherein the surface of each of the at least three LED chips is exposed to the outside and lies at the same level as the upper end of the corresponding valley.