# US 10,872,875 B2 · Bonding head and method for bonding semiconductor package, and semiconductor package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,875 B2 - Document ID: US10872875B2 - Status: Granted - Kind: B2 - Application number: 16/281,496 - Filed: 2019-02-21 - Published: 2020-01-23 - Granted: 2020-12-22 - Earliest claimed: 2018-07-17 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Sanghoon Lee; Jiwon Shin; Hyunggil Baek; Minkeun Kwak; Jongho Lee - Web page: https://patentgrep.com/patent/US10872875B2 ## CPC - H10W 72/0711: {Apparatus therefor} - H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills} - H10W 72/073: {of die-attach connectors} - H10W 72/30: Die-attach connectors - H10W 72/851: {Dispositions of multiple connectors or interconnections} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07178: {Means for aligning} - H10W 72/072: {of bump connectors} - H10W 72/07232: {Compression bonding, e.g. thermocompression bonding} - H10W 72/07332: {Compression bonding, e.g. thermocompression bonding} - H10W 72/07352: {changes in structures or sizes} - H10W 72/07353: {changes in shapes} - H10W 72/222: {Multilayered bumps, e.g. a coating on top and side surfaces of a bump core} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/321: {Structures or relative sizes of die-attach connectors} - H10W 72/334: {Cross-sectional shape, i.e. in side view} - H10W 72/354: {comprising polymers} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 99/00: Subject matter not provided for in other groups of this subclass - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method for bonding a semiconductor package includes loading a semiconductor chip on a substrate, and bonding the semiconductor chip to the substrate by using a bonding tool, the bonding tool including a pressing surface for pressing the semiconductor chip, and an inclined surface extending from one side of the pressing surface. Bonding the semiconductor chip to the substrate includes deforming a bonding agent disposed between the substrate and the semiconductor chip by pressing the bonding tool, and deforming the bonding agent includes generating a fillet by protruding a portion of the bonding agent beyond the semiconductor chip, and growing the fillet in such a way that a top surface of the fillet is grown in an extending direction of the inclined surface. ## Claims ### Claim 1 A method for bonding a semiconductor package, the method comprising: loading a semiconductor chip on a substrate; and bonding the semiconductor chip to the substrate by using a bonding tool, the bonding tool including: a pressing surface for pressing the semiconductor chip, a top surface spaced apart from the pressing surface, and an inclined surface extending from one side of the pressing surface to connect the pressing surface to the top surface, wherein bonding the semiconductor chip to the substrate includes deforming a bonding agent disposed between the substrate and the semiconductor chip by pressing the bonding tool, and wherein deforming the bonding agent includes generating a fillet by protruding a portion of the bonding agent beyond the semiconductor chip, and growing the fillet in such a way that a top surface of the fillet is grown in an extending direction of the inclined surface. ### Claim 2 (depends on 1) The method as claimed in claim 1, wherein the inclined surface is provided in plurality. ### Claim 3 (depends on 1) The method as claimed in claim 1, wherein bonding the semiconductor chip to the substrate further includes hardening the deformed bonding agent. ### Claim 4 (depends on 3) The method as claimed in claim 3, further comprising removing the bonding tool after hardening the deformed bonding agent. ### Claim 5 (depends on 3) The method as claimed in claim 3, wherein hardening the deformed bonding agent includes heating the deformed bonding agent by the bonding tool. ### Claim 6 (depends on 1) The method as claimed in claim 1, wherein an area of the pressing surface is equal to or greater than an area of a chip top surface of the semiconductor chip. ### Claim 7 (depends on 1) The method as claimed in claim 1, wherein the bonding agent includes at least one of a non-conductive film (NCF), non-conductive paste (NCP), an anisotropic conductive film, or anisotropic conductive paste. ### Claim 8 A bonding head for a semiconductor package, the bonding head comprising: a bonding tool to bond a semiconductor package, wherein the bonding tool includes: a pressing surface to press a semiconductor chip, a top surface spaced apart from the pressing surface, and an inclined surface connecting the pressing surface to the top surface, the inclined surface extending from the pressing surface to guide a growing direction of a fillet. ### Claim 9 (depends on 8) The bonding head as claimed in claim 8, further comprising a supporter coupled to the bonding tool. ### Claim 10 (depends on 9) The bonding head as claimed in claim 9, wherein the bonding tool and the supporter are detachably coupled to each other. ### Claim 11 (depends on 10) The bonding head as claimed in claim 10, wherein the supporter includes a through-hole. ### Claim 12 (depends on 9) The bonding head as claimed in claim 9, wherein the bonding tool and the supporter include a same material. ### Claim 13 (depends on 8) The bonding head as claimed in claim 8, wherein the inclined surface is provided in plurality. ### Claim 14 (depends on 8) The bonding head as claimed in claim 8, wherein the bonding tool includes an adsorption hole. ### Claim 15 (depends on 8) The bonding head as claimed in claim 8, further comprising a protective sheet protecting the pressing surface and the inclined surface. ### Claim 16 (depends on 8) The bonding head as claimed in claim 8, wherein a width of the top surface is larger than a width of the pressing surface along a horizontal direction parallel to the pressing surface. ### Claim 17 (depends on 16) The bonding head as claimed in claim 16, further comprising a supporter coupled to the top surface, a width of the supporter being larger than the width of the pressing surface along the horizontal direction parallel to the pressing surface. ### Claim 18 (depends on 8) The bonding head as claimed in claim 8, wherein an angle between the inclined surface and the pressing surface is a constant obtuse angle. ### Claim 19 (depends on 8) The bonding head as claimed in claim 8, wherein the bonding tool includes metal.