# US 10,872,874 B2 · Bonding apparatus and method of bonding substrates > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,874 B2 - Document ID: US10872874B2 - Status: Granted - Kind: B2 - Application number: 16/109,769 - Filed: 2018-08-23 - Published: 2019-08-29 - Granted: 2020-12-22 - Earliest claimed: 2018-02-26 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Co., Ltd. - Inventors: Chen-Hua Yu; Ebin Liao; Wen-Chih Chiou - Web page: https://patentgrep.com/patent/US10872874B2 ## CPC - H10F 39/809: {of hybrid image sensors} - H10W 72/0198: {batch processes} - H10F 39/018: {of hybrid image sensors} - B29C 66/81455: {being a fluid inflatable bag or bladder, a diaphragm or a vacuum bag for applying isostatic pressure (inflatable element positioned between the joining tool and a backing-up part B29C66/82421)} - B30B 5/02: wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07163: {Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling} - H10W 72/07188: {Apparatus chuck} - H10W 72/07331: {Connecting techniques} - H10W 72/07332: {Compression bonding, e.g. thermocompression bonding} - H10W 90/722: {between stacked chips} - H10W 90/732: {between stacked chips} - H10W 90/792: {between multiple chips} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B30B: PRESSES IN GENERAL (producing ultra-high pressure or ultra-high pressure and high temperature to effect modifications of a substance, e.g. for making artificial diamonds B01J3/00 ){(compressing means for refuse receptacles B65F1/1405)} ## Abstract A bonding apparatus includes a chuck and a bonding head. The chuck is configured to carry a plurality of substrates to be bonded. The bonding head has a cavity facing the chuck and includes a divider, at least one pneumatic component and a diaphragm. The divider is disposed in the cavity and dividing the cavity into a plurality of compartments. The at least one pneumatic component is disposed in at least one of the compartments. The diaphragm covers the cavity and is disposed between the at least one pneumatic component and the chuck. ## Claims ### Claim 1 A bonding apparatus, comprising: a chuck configured to carry a plurality of substrates to be bonded; and a bonding head having a cavity facing the chuck, comprising: a divider disposed in the cavity and dividing the cavity into a plurality of compartments; at least one pneumatic component disposed in at least one of the plurality of compartments; and a diaphragm covering the cavity and disposed between the at least one pneumatic component and the chuck, wherein the diaphragm is configured to press against the plurality of substrates to be bonded when the at least one pneumatic component is inflated. ### Claim 2 (depends on 1) The bonding apparatus as claimed in claim 1, wherein the bonding head further comprises at least one gas inlet in gas communication with the at least one pneumatic component to inflate or deflate the at least one pneumatic component. ### Claim 3 (depends on 1) The bonding apparatus as claimed in claim 1, wherein the plurality of compartments comprises a central compartment and a peripheral compartment surrounding the central compartment. ### Claim 4 (depends on 3) The bonding apparatus as claimed in claim 3, wherein the at least one pneumatic component comprises a central pneumatic component disposed in the central compartment and a peripheral pneumatic component disposed in the peripheral compartment. ### Claim 5 (depends on 3) The bonding apparatus as claimed in claim 3, further comprising a pressing pin movably disposed in the central compartment, wherein the at least one pneumatic component is disposed in the peripheral compartment, and the diaphragm exposes the central compartment and covers the peripheral compartment. ### Claim 6 (depends on 3) The bonding apparatus as claimed in claim 3, wherein the peripheral compartment further comprises a plurality of sub-compartments divided by the divider and together surrounding the central compartment. ### Claim 7 (depends on 6) The bonding apparatus as claimed in claim 6, wherein the at least one pneumatic component comprises a central pneumatic component disposed in the central compartment and a plurality of peripheral pneumatic components disposed in the plurality of sub-compartments respectively. ### Claim 8 (depends on 3) The bonding apparatus as claimed in claim 3, wherein the peripheral compartment further comprises a plurality of concentric compartments divided by the divider and arranged in a concentric manner with respect to the central compartment. ### Claim 9 (depends on 8) The bonding apparatus as claimed in claim 8, wherein the at least one pneumatic component comprises a central pneumatic component disposed in the central compartment and a plurality of peripheral pneumatic components disposed in the plurality of concentric compartments respectively. ### Claim 10 (depends on 1) The bonding apparatus as claimed in claim 1 wherein a diameter of the cavity is substantially greater than a diameter of each of the plurality of substrates to be bonded. ### Claim 11 A bonding apparatus, comprising: a chuck configured to carry a plurality of substrates to be bonded; and a bonding head having a cavity facing the chuck, wherein the chuck and the bonding head are configured to be movable relative to each other, and the bonding head comprises: a divider disposed in the cavity and dividing the cavity into a central compartment and a peripheral compartment surrounding the central compartment; at least one peripheral pneumatic component disposed in the peripheral compartment; and a diaphragm covering the cavity and disposed between the at least one peripheral pneumatic component and the chuck, wherein the diaphragm is configured to press against the plurality of substrates to be bonded when the at least one peripheral pneumatic components are inflated. ### Claim 12 (depends on 11) The bonding apparatus as claimed in claim 11, further comprising a central pneumatic component disposed in the central compartment. ### Claim 13 (depends on 11) The bonding apparatus as claimed in claim 11, further comprising a pressing pin movably disposed in central compartment, wherein the diaphragm exposes the central compartment and covers the peripheral compartment. ### Claim 14 (depends on 11) The bonding apparatus as claimed in claim 11, wherein the peripheral compartment further comprises a plurality of sub-compartments divided by the divider and together surrounding the central compartment, the at least one peripheral pneumatic component comprises a plurality of peripheral pneumatic components disposed in the plurality of sub-compartments respectively. ### Claim 15 (depends on 11) The bonding apparatus as claimed in claim 11, wherein the peripheral compartment further comprises a plurality of concentric compartments divided by the divider and arranged in a concentric manner with respect to the central compartment, the at least one peripheral pneumatic component comprises a plurality of peripheral pneumatic components disposed in the plurality of concentric compartments respectively. ### Claim 16 (depends on 11) The bonding apparatus as claimed in claim 11, wherein a diameter of the cavity is substantially greater than a diameter of each of the plurality of substrates to be bonded. ### Claim 17 A bonding apparatus, comprising: a chuck configured to carry a plurality of substrates to be bonded; and a bonding head having a plurality of compartments facing the chuck, at least one pneumatic component disposed in at least one of the plurality of compartments and configured to be inflated or deflated, and a diaphragm covering the at least one pneumatic component. ### Claim 18 (depends on 17) The bonding apparatus as claimed in claim 17, wherein the plurality of compartments comprises a central compartment and a peripheral compartment surrounding the central compartment, and the at least one pneumatic component at least disposed in the peripheral compartment. ### Claim 19 (depends on 17) The bonding apparatus as claimed in claim 17, wherein the chuck further comprises a positioning cavity facing the bonding head and corresponding to the cavity of the bonding head. ### Claim 20 (depends on 19) The bonding apparatus as claimed in claim 19, wherein the chuck further comprises a positioning mechanism movably disposed in the positioning cavity to hold the plurality of substrates to be bonded in place.