# US 10,872,868 B2 · Fan-out antenna packaging structure and preparation method thereof

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- Number: US 10,872,868 B2
- Document ID: US10872868B2
- Status: Granted
- Kind: B2
- Application number: 16/171,239
- Filed: 2018-10-25
- Published: 2019-10-31
- Granted: 2020-12-22
- Earliest claimed: 2017-10-25
- Assignees: SJ Semiconductor(Jiangyin) Corporation
- Applicants: SJ Semiconductor (Jiangyin) Corporation
- Inventors: Yenheng Chen; Chengchung Lin; Jangshen Lin; Chengtar Wu; Chihon Ho
- Web page: https://patentgrep.com/patent/US10872868B2

## CPC

- H10P 72/74: {using temporarily an auxiliary support}
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 9/27: Spiral antennas
- H10W 20/42: Vias, e.g. via plugs
- H10W 72/012: {of bump connectors, dummy bumps or thermal bumps}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/90: Bond pads, in general
- H10W 74/01: Manufacture or treatment
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/129: {forming a chip-scale package [CSP]}
- H10P 72/7424: {used as a support during the manufacture of self-supporting substrates}
- H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- H10W 44/209: {Vertical interconnections, e.g. vias}
- H10W 44/248: {for antennas}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/655: Fan-out layouts
- H10W 72/07207: {Temporary substrates, e.g. removable substrates}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

The present disclosure provides a fan-out antenna packaging structure and a method for preparing the same. The fan-out antenna packaging structure comprises: a semiconductor chip; a plastic packaging material layer, comprising a first surface and a second surface opposite to the first surface, wherein the plastic packaging material layer wraps around a periphery of the semiconductor chip; a metal connecting wire disposed through the plastic packaging material layer from top to bottom; an antenna structure, located on the first surface of the plastic packaging material layer and electrically connected with the metal connecting wire; a redistribution layer, located on the second surface of the plastic packaging material layer and electrically connected with the semiconductor chip and the metal connecting wire; and a solder ball bump, located on a surface of the redistribution layer, electrically connected with the redistribution layer and insulated from the plastic packaging material layer.

## Claims

### Claim 1

A method for preparing a fan-out antenna packaging structure, comprising the following steps:
1) providing a carrier and forming a peeling layer on an upper surface of the carrier;
2) forming a redistribution layer on a surface of the peeling layer;
3) providing a semiconductor chip and mounting the semiconductor chip face-down on a surface of the redistribution layer;
4) forming a metal connecting wire on the surface of the redistribution layer by adopting a wire bonding process;
5) forming a plastic packaging material layer on the surface of the peeling layer, wherein the plastic packaging material layer fills a gap between the semiconductor chip and the metal connecting wire and a gap between the semiconductor chip and the redistribution layer; wherein the plastic packaging material encloses the semiconductor chip and the metal connecting wire; wherein the plastic packaging material layer comprises a first surface and a second surface opposite to each other, wherein the second surface of the plastic packaging material layer is in contact with the redistribution layer, and wherein the first surface of the plastic packaging material layer exposes an upper surface of the metal connecting wire;
6) forming an antenna structure on the first surface of the plastic packaging material layer, wherein the antenna structure is electrically connected with the metal connecting wire;
wherein forming an antenna structure on the first surface of the plastic packaging material layer comprises the following steps:
6-1) forming a first dielectric layer on the first surface of the plastic packaging material layer;
6-2) forming a first opening in the first dielectric layer, wherein the first opening exposes the upper surface of the metal connecting wire;
6-3) forming a first metal plug in the first opening and forming a first layer of metal antennas on an upper surface of the first dielectric layer, wherein the first layer of metal antennas is electrically connected with the metal connecting wire through the first metal plug;
6-4) forming a second dielectric layer on the upper surface of the first dielectric layer on which the first layer of metal antennas are formed, wherein the second dielectric layer completely covers the first layer of metal antennas;
6-5) forming a second opening in the second dielectric layer, wherein the second opening exposes part of the first layer of metal antennas; and
6-6) forming a second metal plug in the second opening, and forming a second layer of metal antennas on the second dielectric layer;
7) removing the carrier and the peeling layer; and
8) forming a solder ball bump on a surface of the redistribution layer, wherein the solder ball bump is electrically connected with the redistribution layer and is insulated from the plastic packaging material layer.

### Claim 2 (depends on 1)

The method for preparing the fan-out antenna packaging structure according to claim 1, characterized in that, in step 6), the method for forming an antenna structure on the first surface of the plastic packaging material layer comprises: forming the layer of metal antennas on the first surface of the plastic packaging material layer as the antenna structure.

### Claim 3 (depends on 2)

The method for preparing the fan-out antenna packaging structure according to claim 2, characterized in that the metal antennas have a shape of a spiral rectangular.

### Claim 4 (depends on 1)

The method for preparing the fan-out antenna packaging structure according to claim 1, characterized in that the metal antennas have a shape of a spiral rectangular.

### Claim 5 (depends on 4)

The method for preparing the fan-out antenna packaging structure according to claim 4, characterized in that a number of the metal antennas is more than one and the more than one metal antennas are distributed in the plane of the dielectric layers.