# US 10,872,867 B2 · Fan-out antenna packaging structure and preparation method thereof

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- Number: US 10,872,867 B2
- Document ID: US10872867B2
- Status: Granted
- Kind: B2
- Application number: 16/170,984
- Filed: 2018-10-25
- Published: 2019-10-31
- Granted: 2020-12-22
- Earliest claimed: 2017-10-25
- Assignees: SJ Semiconductor(Jiangyin) Corporation
- Applicants: SJ Semiconductor(Jiangyin) Corporation
- Inventors: Yenheng Chen; Chengchung Lin; Jangshen Lin; Chengtar Wu; Chihon Ho
- Web page: https://patentgrep.com/patent/US10872867B2

## CPC

- H10P 72/74: {using temporarily an auxiliary support}
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 1/36: Structural form of radiating elements, e.g. cone, spiral, umbrella; {Particular materials used therewith}(H01Q1/08, H01Q1/14 take precedence)
- H01Q 21/065: {Patch antenna array}
- H10W 20/42: Vias, e.g. via plugs
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/012: {of bump connectors, dummy bumps or thermal bumps}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/90: Bond pads, in general
- H10W 74/01: Manufacture or treatment
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/129: {forming a chip-scale package [CSP]}
- H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- H10W 44/248: {for antennas}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/655: Fan-out layouts
- H10W 72/0198: {batch processes}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/9413: {on encapsulations}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

The present disclosure provides a fan-out antenna packaging structure and a method for preparing the same. The fan-out antenna packaging structure comprises: a semiconductor chip; a plastic packaging material layer comprising a first surface and an opposite second surface, wherein the plastic packaging material layer packages a periphery of the semiconductor chip; a metal connecting pole located in the plastic packaging material layer and running through the plastic packaging material layer from top to bottom; an antenna structure located on the first surface of the plastic packaging material layer and electrically connected with the metal connecting pole; are distribution layer located on the second surface of the plastic packaging material layer and electrically connected with the semiconductor chip and the metal connecting pole; and a solder bump located on a surface, insulated from the plastic packaging material layer, of the redistribution layer, and electrically connected with the redistribution layer.

## Claims

### Claim 1

A method for preparing a fan-out antenna packaging structure, comprising the following steps:
1) providing a carrier and forming a peeling layer on an upper surface of the carrier;
2) mounting a semiconductor chip facing down on an upper surface of the peeling layer;
3) forming a metal connecting pole on the upper surface of the peeling layer;
4) forming a plastic packaging material layer on the upper surface of the peeling layer, wherein the plastic packaging material layer fills a gap between the semiconductor chip and the metal connecting pole, and encloses the semiconductor chip and the metal connecting pole; wherein the plastic packaging material layer comprises a first surface and a second surface opposite to the first surface, the second surface of the plastic packaging material layer is in contact with the peeling layer, and the first surface of the plastic packaging material layer exposes an upper surface of the metal connecting pole;
5) removing the carrier and the peeling layer;
6) forming a redistribution layer on the second surface of the plastic packaging material layer, wherein the redistribution layer is electrically connected with the semiconductor chip and the metal connecting pole;
7) forming an antenna structure on the first surface of the plastic packaging material layer, wherein the antenna structure is electrically connected with the metal connecting pole;
wherein forming the antenna structure comprises:
7-1) forming a first dielectric layer on the first surface of the plastic packaging material layer;
7-2) forming a first opening in the first dielectric layer, wherein the first opening exposes the upper surface of the metal connecting pole;
7-3) forming a first metal plug in the first opening and forming a first layer of metal antennas on an upper surface of the first dielectric layer, wherein the first layer of metal antennas is electrically connected with the metal connecting pole through the first metal plug;
7-4) forming a second dielectric layer on the upper surface of the first dielectric layer on which the first layer of metal antennas is formed, wherein the second dielectric layer covers the first layer of metal antennas;
7-5) forming a second opening in the second dielectric layer, wherein the second opening exposes part of the first layer of metal antennas; and
7-6) forming a second metal plug in the second opening, and forming a second layer of metal antennas on the second dielectric layer; and
8) forming a solder ball bump on a surface of the redistribution layer, wherein the solder ball bump is electrically connected with the redistribution layer and insulated from the plastic packaging material layer.

### Claim 2 (depends on 1)

The method for preparing the fan-out antenna packaging structure according to claim 1, characterized in that, in step 7), the method for forming an antenna structure on the first surface of the plastic packaging material layer comprises: forming the metal antennas on the first surface of the plastic packaging material layer as the antenna structure.

### Claim 3 (depends on 2)

The method for preparing the fan-out antenna packaging structure according to claim 2, characterized in that the metal antennas have a shape of spiral rectangular.

### Claim 4 (depends on 1)

The method for preparing the fan-out antenna packaging structure according to claim 1, characterized in that the metal antennas have a shape of a spiral rectangular.

### Claim 5 (depends on 4)

The method for preparing the fan-out antenna packaging structure according to claim 4, characterized in that a number of the metal antennas is more than one, and distributed in a plane of the surface of the dielectric layers.