# US 10,872,853 B2 · Module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,853 B2 - Document ID: US10872853B2 - Status: Granted - Kind: B2 - Application number: 16/152,920 - Filed: 2018-10-05 - Published: 2019-02-14 - Granted: 2020-12-22 - Earliest claimed: 2016-04-11 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Issei Yamamoto - Web page: https://patentgrep.com/patent/US10872853B2 ## CPC - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/68: Shapes or dispositions thereof - H10W 74/016: {using moulds} - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/00: Package configurations - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A module with high reliability is provided by inhibiting occurrences of air bubbles caused with rise in flow resistance of resin when a sealing resin layer is formed using a die. A module includes a wiring board, components mounted over an upper face of the wiring board, and a sealing resin layer laminated over the upper face. On the upper face, the sealing resin layer includes a high-level region with a long distance from the upper face of the wiring board, a low-level region with a short distance from the upper face, and a level difference region. In a portion included in the wiring board and corresponding to the low-level region and the level difference region, a thin portion is formed so as to be thinner than the remaining portion and overlaps the low-level region at least partially in a plan view. ## Claims ### Claim 1 A module comprising: a wiring board; a component mounted over a principal face of the wiring board; and a sealing resin layer that is laminated over the principal face of the wiring board and covers the component, wherein: on an opposite face of the sealing resin layer opposite to the principal face of the wiring board, a high-level region has a long distance from the opposite face to the principal face of the wiring board, a low-level region has a short distance from the opposite face to the principal face of the wiring board, and a level difference region is between the high-level region and the low-level region, the wiring board includes a thin portion smaller in thickness than a remaining portion, the component is mounted in the thin portion, and when viewed in a direction perpendicular to the principal face of the wiring board, at least part of the level difference region and the low-level region of the sealing resin layer overlaps the thin portion. ### Claim 2 (depends on 1) The module according to claim 1, wherein a sum of a projection area of the level difference region projected onto the principal face of the wiring board and an area of the low-level region is larger than or equal to an area of a surface of the thin portion facing the sealing resin layer. ### Claim 3 (depends on 1) The module according to claim 1, wherein a sum of a projection area of the level difference region projected onto the principal face of the wiring board and an area of the low-level region is smaller than an area of a surface of the thin portion facing the sealing resin layer. ### Claim 4 (depends on 1) The module according to claim 1, wherein an edge of the low-level region and an edge of the thin portion are formed along an edge of the wiring board, and a length of the low-level region along the edge of the wiring board is approximately equal to a length of the thin portion along the edge of the wiring board. ### Claim 5 (depends on 1) The module according to claim 1, wherein an edge of the low-level region and an edge of the thin portion are formed along an edge of the wiring board, and a length of the low-level region along the edge of the wiring board is larger than a length of the thin portion along the edge of the wiring board. ### Claim 6 A module comprising: a wiring board; a component mounted over a principal face of the wiring board; and a sealing resin layer that is laminated over the principal face of the wiring board and covers the component, wherein: on an opposite face of the sealing resin layer opposite to the principal face of the wiring board, a high-level region has a long distance from the opposite face to the principal face of the wiring board, a low-level region has a short distance from the opposite face to the principal face of the wiring board, and a level difference region is between the high-level region and the low-level region, the wiring board includes a thin portion smaller in thickness than a remaining portion, a difference in thickness between the remaining portion and the thin portion is less than the short distance of the low-level region, and when viewed in a direction perpendicular to the principal face of the wiring board, at least part of the level difference region and the low-level region of the sealing resin layer overlaps the thin portion. ### Claim 7 (depends on 6) The module according to claim 6, wherein an edge of the low-level region and an edge of the thin portion are formed along an edge of the wiring board, and a length of the low-level region along the edge of the wiring board is approximately equal to a length of the thin portion along the edge of the wiring board. ### Claim 8 (depends on 6) The module according to claim 6, wherein the low-level region and an edge of the thin portion are formed along an edge of the wiring board, and a length of the low-level region along the edge of the wiring board is approximately equal to a length of the thin portion along the edge of the wiring board. ### Claim 9 (depends on 1) The module according to claim 1, wherein the low-level region and the thin portion are formed along an edge of the wiring board, and a length of the low-level region along the edge is approximately equal to a length of the thin portion along the edge of the wiring board. ### Claim 10 (depends on 6) The module according to claim 6, wherein an edge of the low-level region and an edge of the thin portion are formed along an edge of the wiring board, and a length of the low-level region along the edge of the wiring board is larger than a length of the thin portion along the edge of the wiring board. ### Claim 11 (depends on 1) The module according to claim 1, wherein another component is mounted in the thin portion. ### Claim 12 (depends on 6) The module according to claim 6, wherein the component is mounted in the thin portion. ### Claim 13 (depends on 12) The module according to claim 12, wherein another component is mounted in the thin portion. ### Claim 14 (depends on 6) The module according to claim 6, wherein a sum of a projection area of the level difference region projected onto the principal face of the wiring board and an area of the low-level region is larger than or equal to an area of a surface of the thin portion facing the sealing resin layer. ### Claim 15 (depends on 6) The module according to claim 6, wherein a sum of a projection area of the level difference region projected onto the principal face of the wiring board and an area of the low-level region is smaller than an area of a surface of the thin portion facing the sealing resin layer.