# US 10,872,848 B2 · Semiconductor package with leadframe interconnection structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,848 B2 - Document ID: US10872848B2 - Status: Granted - Kind: B2 - Application number: 16/170,692 - Filed: 2018-10-25 - Published: 2020-04-30 - Granted: 2020-12-22 - Earliest claimed: 2018-10-25 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Woon Yik Yong; Andreas Kucher; Chia-Yen Lee; Shao Ping Wan - Web page: https://patentgrep.com/patent/US10872848B2 ## CPC - H10W 70/415: {Leadframe inner leads serving as die pads} - H10W 90/811: {Multiple chips on leadframes} - H01S 5/0231: Stems - H01S 5/0232: Lead-frames - H01S 5/02325: Mechanically integrated components on mount members or optical micro-benches - H10W 72/012: {of bump connectors, dummy bumps or thermal bumps} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - G01S 7/4814: {of transmitters alone} - G01S 7/4815: {using multiple transmitters} - H01S 5/02216: Butterfly-type, i.e. with electrode pins extending horizontally from the housings - H01S 5/02234: Resin-filled housings; the housings being made of resin - H01S 5/042: Electrical excitation {; Circuits therefor (monolithically integrated laser drive components H01S5/0261)} - H01S 5/4025: {Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence)} - H10W 70/427: {Bent parts} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/29: Bond pads specially adapted therefor - H10W 72/325: {Die-attach connectors having a filler embedded in a matrix} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES ## Abstract An embodiment of a semiconductor package includes a leadframe and a mold compound partly encasing the leadframe so that leads protrude from the mold compound and at least two die pads have a surface at a first side of the leadframe which is not covered by the mold compound. A laser module is attached to the surface of the at least two die pads which is not covered by the mold compound. A driver die is attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module. The driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and driver die to the leadframe. ## Claims ### Claim 1 A semiconductor package, comprising: a leadframe comprising leads and a plurality of die pads; a mold compound partly encasing the leadframe so that the leads protrude from the mold compound and at least two of the plurality of die pads have a surface at a first side of the leadframe which is not covered by the mold compound; a laser module attached to the surface of the at least two die pads which is not covered by the mold compound, the laser module configured to emit laser light outward from the semiconductor package; and a driver die attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module, wherein the driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and the driver die to the leadframe. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein the leads extend along a first plane within the mold compound, and wherein the at least two die pads extend along a second plane within the mold compound different than the first plane so that a step is provided between the at least two die pads and the leads within the mold compound. ### Claim 3 (depends on 1) The semiconductor package of claim 1, wherein the leads and the at least two die pads extend along a same first plane within the mold compound. ### Claim 4 (depends on 3) The semiconductor package of claim 3, wherein the mold compound has an opening which extends to the surface of the at least two die pads, and wherein the laser module is disposed in the opening. ### Claim 5 (depends on 4) The semiconductor package of claim 4, further comprising a transparent epoxy covering the laser module and filling the opening in the mold compound. ### Claim 6 (depends on 4) The semiconductor package of claim 4, wherein a thickness of the laser module is less than a height of the opening in the mold compound, and wherein the thickness of the laser module and the height of the opening are measured in a direction perpendicular to the first side of the leadframe. ### Claim 7 (depends on 1) The semiconductor package of claim 1, further comprising one or more capacitors attached to the first side of the leadframe or to a second side of the leadframe opposite the first side. ### Claim 8 (depends on 7) The semiconductor package of claim 7, wherein the one or more capacitors are encased in the mold compound. ### Claim 9 (depends on 7) The semiconductor package of claim 7, wherein the first side of the leadframe is not covered by the mold compound so that the one or more capacitors are not encased in the mold compound. ### Claim 10 A method of manufacturing a semiconductor package, the method comprising: providing a leadframe comprising leads and a plurality of die pads; partly encasing the leadframe in a mold compound so that the leads protrude from the mold compound and at least two of the plurality of die pads have a surface at a first side of the leadframe which is not covered by the mold compound; attaching a laser module to the surface of the at least two die pads which is not covered by the mold compound, the laser module configured to emit laser light outward from the semiconductor package; and attaching a driver die to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module, wherein the driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and the driver die to the leadframe. ### Claim 11 (depends on 10) The method of claim 10, wherein the leads extend along a first plane within the mold compound, wherein the at least two die pads extend along a second plane within the mold compound different than the first plane so that a step is provided between the at least two die pads and the leads within the mold compound, and wherein the driver die is attached to the leadframe in a flip-chip configuration. ### Claim 12 (depends on 10) The method of claim 10, wherein the leads and the at least two die pads extend along a same first plane within the mold compound, wherein the driver die is attached to the leadframe in a flip-chip configuration, and wherein the surface at the first side of the leadframe which is not covered by the mold compound via an over-molded film-assist molding process. ### Claim 13 (depends on 12) The method of claim 12, wherein an opening is formed in the mold compound during the over-molded film-assist molding process, the opening extending to the surface of the at least two die pads and sized to receive the laser module. ### Claim 14 (depends on 13) The method of claim 13, further comprising: covering the laser module and filling the opening in the mold compound with a transparent epoxy. ### Claim 15 (depends on 10) The method of claim 10, further comprising: attaching one or more capacitors to the first side of the leadframe or to a second side of the leadframe opposite the first side.