# US 10,872,847 B2 · Package structure and method for fabricating the same

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- Number: US 10,872,847 B2
- Document ID: US10872847B2
- Status: Granted
- Kind: B2
- Application number: 15/720,552
- Filed: 2017-09-29
- Published: 2018-11-29
- Granted: 2020-12-22
- Earliest claimed: 2017-05-25
- Assignees: Siliconware Precision Industries Co., Ltd.
- Applicants: Siliconware Precision Industries Co., Ltd.
- Inventors: Shao-Tzu Tang; Jia-Fong Yeh; Yi-Hsuan Liu; Mei-Chi Chen; Ying-Chou Tsai
- Web page: https://patentgrep.com/patent/US10872847B2

## CPC

- H10W 90/811: {Multiple chips on leadframes}
- G06V 40/1306: {non-optical, e.g. ultrasonic or capacitive sensing}
- H10W 70/465: {Bumps or wires}
- H10W 72/90: Bond pads, in general
- H10W 74/016: {using moulds}
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/655: Fan-out layouts
- H10W 72/0198: {batch processes}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07352: {changes in structures or sizes}
- H10W 72/321: {Structures or relative sizes of die-attach connectors}
- H10W 72/354: {comprising polymers}
- H10W 72/874: {On different surfaces}
- H10W 72/9413: {on encapsulations}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 74/10: characterised by their shape or disposition
- H10W 90/00: Package configurations
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING

## Abstract

A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.

## Claims

### Claim 1

A package structure, comprising:
a carrier being a circuit board;
an electronic component disposed on the circuit board and having a sensing surface;
at least one conductive element disposed on the circuit board, wherein the conductive element is a bonding wire segment or a loop-type bonding wire;
an encapsulant formed on the carrier and encapsulating the electronic component and the conductive element, with the sensing surface of the electronic component and a portion of a surface of the conductive element exposed from the encapsulant; and
a conductive layer formed on the encapsulant and electrically connecting the conductive element and the electronic component.

### Claim 2 (depends on 1)

The package structure of claim 1, wherein the electronic component is a fingerprint identification chip.

### Claim 3 (depends on 1)

The package structure of claim 1, wherein the conductive element is electrically connected to the carrier.

### Claim 4 (depends on 1)

The package structure of claim 1, further comprising an opening formed in the encapsulant to expose the portion of the surface of the conductive element.

### Claim 5 (depends on 1)

The package structure of claim 1, further comprising a plurality of conductive pads disposed on one side of the circuit board.

### Claim 6 (depends on 5)

The package structure of claim 5, wherein the electronic component, the conductive element and the encapsulant are disposed on the other opposite side of the circuit board.

### Claim 7

A package structure, comprising:
a lead frame having a die attach pad and a plurality of leads;
an electronic component disposed on the die attach pad and having a sensing surface;
at least one conductive element disposed on the leads, wherein the conductive element is a bonding wire segment or a loop-type bonding wire;
an encapsulant formed on the lead frame and encapsulating the electronic component and the conductive element, with the sensing surface of the electronic component and a portion of a surface of the conductive element exposed from the encapsulant; and
a conductive layer formed on the encapsulant and electrically connecting the conductive element and the electronic component.

### Claim 8 (depends on 7)

The package structure of claim 7, wherein the electronic component is a fingerprint identification chip.

### Claim 9 (depends on 7)

The package structure of claim 7, wherein the conductive element is electrically connected to the leads.

### Claim 10 (depends on 7)

The package structure of claim 7, further comprising an opening formed in the encapsulant to expose the portion of the surface of the conductive element.