# US 10,872,831 B2 · Method of forming a semiconductor package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,831 B2 - Document ID: US10872831B2 - Status: Granted - Kind: B2 - Application number: 16/391,190 - Filed: 2019-04-22 - Published: 2019-08-15 - Granted: 2020-12-22 - Earliest claimed: 2016-12-14 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Co., Ltd. - Inventors: Ying-Shin Han; Yen-Miao Lin; Chung-Chih Chen; Hsien-Liang Meng - Web page: https://patentgrep.com/patent/US10872831B2 ## CPC - H10W 76/60: Seals - H10W 76/01: Manufacture or treatment - H10W 76/15: Containers comprising an insulating or insulated base - H10W 40/10: Arrangements for heating - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H10W 70/695: Organic materials - H10W 72/072: {of bump connectors} - H10W 72/07236: {Soldering or alloying} - H10W 72/073: {of die-attach connectors} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/732: {between stacked chips} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of forming a semiconductor package includes dispensing an adhesive on a substrate that has an integrated circuit die attached thereon, placing a lid over the integrated circuit die such that a bottom surface of the lid caps at least a portion of the adhesive, and pressing the lid against the substrate such that a portion of the adhesive is squeezed from a space between the bottom surface of the lid and the substrate onto a sidewall of the lid. ## Claims ### Claim 1 A method of forming a semiconductor package, comprising: dispensing inner and an outer adhesive rings on a substrate having an integrated circuit die attached thereon, wherein the inner adhesive ring is between the integrated circuit die and the outer adhesive ring; placing a lid over the integrated circuit die such that a bottom surface of the lid caps at least a portion of the inner adhesive ring and at least a portion of the outer adhesive ring; and pressing the lid against the substrate such that the inner and outer adhesive rings are squeezed from a space between the bottom surface of the lid and the substrate onto an inner and an outer sidewall of the lid, respectively, wherein the inner adhesive ring on the inner sidewall of the lid is higher than the outer adhesive ring on the outer sidewall of the lid. ### Claim 2 (depends on 1) The method of claim 1, wherein the inner and outer adhesive rings are dispensed at a distance short enough such that the inner and outer adhesive rings are squeezed to adjoin each other during pressing the lid against the substrate. ### Claim 3 (depends on 1) The method of claim 1, wherein pressing the lid against the substrate is such that the inner adhesive ring on the inner sidewall of the lid is spaced apart from the integrated circuit die. ### Claim 4 (depends on 1) The method of claim 1, further comprising: dispensing an underfill between the integrated circuit die and the substrate, wherein pressing the lid against the substrate is such that the inner adhesive ring on the inner sidewall of the lid is spaced apart from the underfill. ### Claim 5 (depends on 1) The method of claim 1, wherein pressing the lid against the substrate is performed such that the inner and outer adhesive rings between the bottom surface of the lid and the substrate are thicker than the inner and outer adhesive rings on the inner and outer sidewalls of the lid. ### Claim 6 A method of forming a semiconductor package, comprising: attaching an integrated circuit die on a substrate; dispensing an inner adhesive portion and an outer adhesive portion on the substrate; and pressing a foot portion of a lid against the inner adhesive portion and the outer adhesive portion such that the inner adhesive portion and the outer adhesive portion are merged together, a portion of the inner adhesive portion is squeezed onto an inner sidewall of the foot portion, and a portion of the outer adhesive portion is squeezed onto an outer sidewall of the foot portion, wherein the portion of the inner adhesive portion on the inner sidewall is higher than the portion of the outer adhesive portion on the outer sidewall. ### Claim 7 (depends on 6) The method of claim 6, wherein the inner adhesive portion on the inner sidewall is spaced apart from the integrated circuit die. ### Claim 8 (depends on 6) The method of claim 6, further comprising: dispensing an underfill between the integrated circuit die and the substrate, wherein the inner adhesive portion on the inner sidewall is spaced apart from the underfill. ### Claim 9 A method of forming a semiconductor package, comprising: attaching an integrated circuit die on a substrate; dispensing a first adhesive on the integrated circuit die; dispensing a second adhesive on the substrate; and pressing a foot portion of a lid against the first and second adhesives such that a first portion of the second adhesive on an inner sidewall of the foot portion is higher than a second portion of the second adhesive on an outer sidewall of the foot portion and is lower than the first adhesive. ### Claim 10 (depends on 9) The method of claim 9, wherein the second adhesive has a better adhering ability than the first adhesive. ### Claim 11 (depends on 9) The method of claim 9, wherein the first adhesive has a better thermal conductivity than the second adhesive. ### Claim 12 (depends on 9) The method of claim 9, wherein the first portion of the second adhesive is spaced apart from the first adhesive. ### Claim 13 (depends on 9) The method of claim 9, wherein the first portion of the second adhesive is spaced apart from the integrated circuit die. ### Claim 14 (depends on 9) The method of claim 9, further comprising: dispensing an underfill between the substrate and the integrated circuit die, wherein the first portion of the second adhesive is spaced apart from the underfill. ### Claim 15 (depends on 1) The method of claim 1, wherein the inner adhesive ring on the inner sidewall of the lid is higher than a bottom surface of the integrated circuit die when pressing the lid against the substrate is complete. ### Claim 16 (depends on 1) The method of claim 1, wherein the inner adhesive ring on the inner sidewall of the lid is lower than a top surface of the integrated circuit die when pressing the lid against the substrate is complete. ### Claim 17 (depends on 1) The method of claim 1, wherein pressing the lid against the substrate is performed such that the inner adhesive ring on the inner sidewall of the lid is thicker than the outer adhesive ring on the outer sidewall of the lid measured in a direction along which a top surface of the substrate extends. ### Claim 18 (depends on 6) The method of claim 6, wherein the portion of the inner adhesive portion on the inner sidewall of the foot portion is higher than a bottom surface of the integrated circuit die when pressing the foot portion of the lid against the substrate is complete. ### Claim 19 (depends on 6) The method of claim 6, wherein the portion of the outer adhesive portion on the outer sidewall of the foot portion is lower than a bottom surface of the integrated circuit die when pressing the foot portion of the lid against the substrate is complete. ### Claim 20 (depends on 6) The method of claim 6, wherein pressing the foot portion of the lid against the substrate is performed such that the portion of the inner adhesive portion on the inner sidewall of the foot portion is thicker than the portion of the outer adhesive portion on the outer sidewall of the foot portion measured in a direction along which a top surface of the substrate extends.