# US 10,872,828 B2 · Inspection and replacement method for micro LED

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- Number: US 10,872,828 B2
- Document ID: US10872828B2
- Status: Granted
- Kind: B2
- Application number: 16/369,802
- Filed: 2019-03-29
- Published: 2019-10-03
- Granted: 2020-12-22
- Earliest claimed: 2018-03-29
- Assignees: Point Engineering Co., Ltd.
- Applicants: Point Engineering Co., Ltd.
- Inventors: Bum Mo Ahn; Seung Ho Park
- Web page: https://patentgrep.com/patent/US10872828B2

## CPC

- G01R 31/2635: {Testing light-emitting diodes, laser diodes or photodiodes}
- H10P 74/232: {comprising connection or disconnection of parts of a device in response to a measurement}
- H10H 20/01: Manufacture or treatment
- H10H 20/85: Packages
- H10H 20/8506: {Containers}
- H10P 74/20: characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects}
- H10P 74/207: {Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics}
- H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes}
- H10W 90/00: Package configurations
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present invention relates to an inspection and replacement method for a micro LED, the method being configured to inspect whether the micro LED is defective and replace a defective micro LED with a normal micro LED. More particularly, the present invention relates to an inspection and replacement method for a micro LED in which when micro LEDs are transferred to a display substrate, the micro LEDs are inspected so as to detect and remove a defective micro LED, and a normal micro LED is placed at a position where the defective micro LED is removed so as to be replaced with the defective micro LED.

## Claims

### Claim 1

An inspection and replacement method for a micro LED, the method comprising:
gripping micro LEDs on a transfer head;
inspecting whether the micro LEDs gripped on the transfer head are defective;
removing a defective micro LED, which is detected in the inspection process, from the transfer head;
gripping a functional micro LED on the transfer head at a position where the defective micro LED is removed; and
transferring all the micro LEDs gripped on the transfer head to a display substrate.

### Claim 2

An inspection and replacement method for a micro LED, the method comprising:
gripping micro LEDs on a transfer head;
inspecting whether the micro LEDs gripped on the transfer head are defective;
removing a defective micro LED, which is detected in the inspection process, from the transfer head;
transferring all the micro LEDs gripped on the transfer head to a display substrate; and
attaching a functional micro LED to the display substrate at a position where the defective micro LED is removed.

### Claim 3

An inspection and replacement method for a micro LED, the method comprising:
gripping micro LEDs on a transfer head;
inspecting whether the micro LEDs gripped on the transfer head are defective;
transferring all the micro LEDs gripped on the transfer head to a display substrate;
removing a defective micro LED, which is detected in the inspection process, from the display substrate; and
attaching a functional micro LED to the display substrate at a position where the defective micro LED is removed.