# US 10,872,819 B2 · Workpiece processing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,819 B2 - Document ID: US10872819B2 - Status: Granted - Kind: B2 - Application number: 15/937,402 - Filed: 2018-03-27 - Published: 2018-10-04 - Granted: 2020-12-22 - Earliest claimed: 2017-04-04 - Assignees: Disco Corporation - Applicants: Disco Corporation - Inventors: Kenji Takenouchi - Web page: https://patentgrep.com/patent/US10872819B2 ## CPC - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - B28D 5/022: {by cutting with discs or wheels} - H10P 34/422: {using incoherent radiation} - H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/7416: {used during dicing or grinding} - H10P 72/7422: {used to protect an active side of a device or wafer} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B28D: WORKING STONE OR STONE-LIKE MATERIALS ## Abstract A processing method for processing a plate-shaped workpiece having a division line on the front side and a multilayer member containing metal formed on the back side is provided. The processing method includes a holding step of holding the front side of the workpiece on a holding table in the condition where the multilayer member formed on the back side of the workpiece is exposed, a cutting step of cutting the workpiece along the division line by using a cutting blade after performing the holding step, thereby forming a cut groove dividing the multilayer member, and a laser processing step of applying a laser beam to the workpiece along the cut groove after performing the cutting step. The cutting step includes the step of supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece. ## Claims ### Claim 1 A processing method for processing a plate-shaped workpiece having a division line on a front side and a multilayer member containing metal formed on a back side, wherein the front side includes a plurality of devices thereon, said processing method comprising: a holding step of holding the front side of said plate-shaped workpiece on a holding table in a condition where said multilayer member formed on the back side of said plate-shaped workpiece is exposed; a cutting step of cutting said plate-shaped workpiece along said division line by using a cutting blade after performing said holding step, thereby forming a cut groove dividing said multilayer member, with a remainder portion of said plate-shaped workpiece remaining below a base of the cut groove; and a laser processing step of applying a laser beam to said plate-shaped workpiece along said cut groove after performing said cutting step, wherein the laser beam passes through said cut groove before passing into said plate-shaped workpiece, wherein said laser beam is applied to the back side of said plate-shaped workpiece in said laser processing step; said cutting step including supplying a cutting fluid containing an organic acid and an oxidizing agent to said plate-shaped workpiece, and wherein the base of said cut groove formed during said cutting step is slightly lower in level than a lower surface of the multilayer member, such that a depth of said cut groove is less than a thickness of the remainder portion of said plate-shaped workpiece remaining below the base of the cut groove, and wherein said laser processing step includes applying a laser beam having a wavelength capable of being transmitted through said plate-shaped workpiece along said cut groove to thereby form a modified layer inside said plate-shaped workpiece along said cut groove; said processing method further comprising a dividing step of dividing said plate-shaped workpiece along said modified layer after performing said laser processing step. ### Claim 2 A processing method for processing a plate-shaped workpiece having a division line on a front side and a multilayer member containing metal formed on a back side, wherein the front side includes a plurality of devices thereon, said processing method comprising: a holding step of holding the front side of said plate-shaped workpiece on a holding table in a condition where said multilayer member formed on the back side of said plate-shaped workpiece is exposed; a cutting step of cutting said plate-shaped workpiece along said division line by using a cutting blade after performing said holding step, thereby forming a cut groove dividing said multilayer member, with a remainder portion of said plate-shaped workpiece remaining below a base of the cut groove; and a laser processing step of applying a laser beam to said plate-shaped workpiece along said cut groove after performing said cutting step, wherein the laser beam passes through said cut groove before passing into said plate-shaped workpiece, wherein said laser beam is applied to the back side of said plate-shaped workpiece in said laser processing step; said cutting step including supplying a cutting fluid containing an organic acid and an oxidizing agent to said plate-shaped workpiece, and wherein the base of said cut groove formed during said cutting step is slightly lower in level than a lower surface of the multilayer member, such that a depth of said cut groove is less than a thickness of the remainder portion of said plate-shaped workpiece remaining below the base of the cut groove, and wherein said laser beam applied during said laser processing step has a wavelength capable of being absorbed by said plate-shaped workpiece along said cut groove to thereby fully cut said plate-shaped workpiece along said cut groove. ### Claim 3 (depends on 1) The processing method according to claim 1, said processing method further comprising a sheet attaching step of attaching a sheet to the front side of said plate-shaped workpiece before performing said laser processing step. ### Claim 4 (depends on 1) The processing method according to claim 1, further comprising a sheet attaching step of attaching a protective member to the front side of said plate-shaped workpiece, wherein the sheet attaching step is performed before the holding step. ### Claim 5 (depends on 1) The processing method according to claim 1, wherein said devices each comprise an integrated circuit. ### Claim 6 (depends on 1) The processing method according to claim 1, wherein said multilayer member is formed on the entire back side of the plate-shaped workpiece.