# US 10,872,816 B2 · High speed, high density, low power die interconnect system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,816 B2 - Document ID: US10872816B2 - Status: Granted - Kind: B2 - Application number: 15/913,125 - Filed: 2018-03-06 - Published: 2018-07-12 - Granted: 2020-12-22 - Earliest claimed: 2006-07-21 - Assignees: Gula Consulting Limited Liabiity Company - Applicants: Gula Consulting Limited Liability Company - Inventors: Ernest E. Hollis - Web page: https://patentgrep.com/patent/US10872816B2 ## CPC - H10W 20/056: {by filling conductive material into holes, grooves or trenches} - H01R 43/0256: {for soldering or welding connectors to a printed circuit board} - H10D 62/117: {Shapes of semiconductor bodies} - H10W 20/082: {the openings being tapered via holes} - H10W 20/497: {Inductive arrangements or effects of, or between, wiring layers} - H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)} - H10W 70/611: {for connecting multiple chips together} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/685: comprising multiple insulating layers - H10W 72/00: Interconnections or connectors in packages - H10W 72/019: {of bond pads} - H10W 72/90: Bond pads, in general - H10W 90/00: Package configurations - G02B 6/43: Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections - H10W 72/834: {Interconnections on sidewalls of chips} - H10W 90/293: {characterised by non-galvanic coupling between the chips, e.g. capacitive coupling} - H10W 90/295: {optical coupling} - H10W 90/722: {between stacked chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS ## Abstract A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may include active and passive elements. In one embodiment there is at least one interconnect coupling at least one conducting layer on a side of one die to at least one conducting layer on a side of the other die. Another interconnect embodiment is a slug having conducting and dielectric layers disposed between two or more die to interconnect between the die. Other interconnect techniques include direct coupling such as rod, ball, dual balls, bar, cylinder, bump, slug, and carbon nanotube, as well as indirect coupling such as inductive coupling, capacitive coupling, and wireless communications. The die may have features to facilitate placement of the interconnects such as dogleg cuts, grooves, notches, enlarged contact pads, tapered side edges and stepped vias. ## Claims ### Claim 1 A system comprising: a first die including a downwardly-facing surface and a plurality of conducting layers; a first inductive coupling portion arranged along the downwardly-facing surface of the first die in at least one of the plurality of conducting layers of the first die; a second die including an upwardly-facing surface and a plurality of conducting layers; and a second inductive coupling portion arranged along the upwardly-facing surface of the second die in at least one of the one or more conducting layers of the second die; wherein: the first inductive coupling portion and the second inductive coupling portion are configured to inductively couple the first die with the second die; the downwardly-facing surface of the first die and the upwardly-facing surface of the second die are separated by an interface material comprising at least one of a heat conductor or an interposer; and the interface material comprises a conductive elastomer. ### Claim 2 (depends on 1) The system of claim 1, wherein the interface material is not present in a region between the first inductive coupling portion and the second inductive coupling portion. ### Claim 3 (depends on 1) The system of claim 1, wherein the first inductive coupling portion comprises at least one of a spiral inductor, a serpentine inductor, or an interdigitated inductor. ### Claim 4 (depends on 3) The system of claim 3, wherein the first inductive coupling portion comprises a spiral inductor that spans only one of the plurality of conducting layers of the first die. ### Claim 5 (depends on 3) The system of claim 3, wherein the first inductive coupling portion comprises a serpentine inductor that spans a plurality of the conducting layers of the first die. ### Claim 6 (depends on 1) The system of claim 1, wherein the second inductive coupling portion comprises at least one of a spiral inductor, a serpentine inductor, or an interdigitated inductor. ### Claim 7 (depends on 6) The system of claim 6, wherein: the first inductive coupling portion comprises a spiral inductor that spans only one of the plurality of conducting layers of the first die; and the second inductive coupling portion comprises a spiral inductor that spans only one of the plurality of conducting layers of the second die. ### Claim 8 (depends on 6) The system of claim 6, wherein the second inductive coupling portion comprises a serpentine inductor that spans at least two of the one or more conducting layers of the second die. ### Claim 9 A system comprising: a first die including a downwardly-facing surface and an upwardly-facing surface; a first inductive coupling portion arranged along at least one of the downwardly-facing surface or the upwardly-facing surface of the first die; a second die including an upwardly-facing surface and a downwardly-facing surface; and a second inductive coupling portion arranged along: the upwardly-facing surface of the second die if the first inductive coupling portion is arranged along the downwardly-facing surface of the first die, or the downwardly-facing surface of the second die if the first inductive coupling portion is arranged along the upwardly-facing surface of the first die; wherein: the first inductive coupling portion and the second inductive coupling portion are configured to inductively couple the first die with the second die; the first die further comprises a vertical inductive coupling portion; the first inductive coupling portion comprises a horizontal inductive coupling portion; the first inductive coupling portion spans only one conducting layer in the first die; and the vertical inductive coupling portion spans a plurality of conducting layers in the first die. ### Claim 10 (depends on 9) The system of claim 9, further comprising a third die including a vertical inductive coupling portion, wherein the vertical inductive coupling portion of the third die is configured to inductively couple with the vertical inductive coupling portion of the first die. ### Claim 11 (depends on 10) The system of claim 10, further comprising a heat conducting material between the first die and the second die, but not between the first die and the third die. ### Claim 12 A system comprising: a first die including a downwardly-facing surface, a plurality of conducting layers, and a vertical inductive coupling portion; a first inductive coupling portion arranged along the downwardly-facing surface of the first die in at least one of the plurality of conducting layers of the first die; a second die including an upwardly-facing surface and a plurality of conducting layers; a second inductive coupling portion arranged along the upwardly-facing surface of the second die in at least one of the plurality of conducting layers of the second die; and a third die including a vertical inductive coupling portion, wherein the vertical inductive coupling portion of the third die is configured to inductively couple with the vertical inductive coupling portion of the first die; wherein the first inductive coupling portion and the second inductive coupling portion are configured to inductively couple the first die with the second die. ### Claim 13 (depends on 12) The system of claim 12, further comprising a heat conducting material between the first die and the second die, but not between the first die and the third die. ### Claim 14 (depends on 12) The system of claim 12, wherein: the first inductive coupling portion comprises a horizontal inductive coupling portion; the first inductive coupling portion spans only one of the plurality of conducting layers of the first die; and the vertical inductive coupling portion spans two or more of the plurality of conducting layers of the first die.