# US 10,872,800 B2 · Electrostatic chuck assembly for high temperature processes > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,800 B2 - Document ID: US10872800B2 - Status: Granted - Kind: B2 - Application number: 15/908,654 - Filed: 2018-02-28 - Published: 2018-07-05 - Granted: 2020-12-22 - Earliest claimed: 2014-10-17 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Vijay D. Parkhe - Web page: https://patentgrep.com/patent/US10872800B2 ## CPC - H10P 72/722: {Details of electrostatic chucks} - H10P 72/0432: {mainly by conduction} - H10P 72/0434: {mainly by convection} - H10P 72/72: using electrostatic chucks - H10P 72/7624: {characterised by the mechanical construction of the susceptor, stage or support} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract An electrostatic chuck assembly includes a puck and a cooling plate. The puck includes an electrically insulative upper puck plate comprising one or more heating elements and one or more electrodes to electrostatically secure a substrate and further includes a lower puck plate bonded to the upper puck plate by a metal bond, the lower puck plate comprising a plurality of features distributed over a bottom side of the lower puck plate at a plurality of different distances from a center of the lower puck plate, wherein each of the plurality of features accommodates one of a plurality of fasteners. The cooling plate is coupled to the puck by the plurality of fasteners, wherein the plurality of fasteners each apply an approximately equal fastening force to couple the cooling plate to the puck. ## Claims ### Claim 1 An electrostatic chuck assembly comprising: a puck comprising: an electrically insulative upper puck plate comprising one or more heating elements and one or more electrodes to electrostatically secure a substrate; and a lower puck plate bonded to the electrically insulative upper puck plate by a metal bond, the lower puck plate comprising a plurality of features distributed over the lower puck plate at a plurality of different distances from a center of the lower puck plate, wherein each of the plurality of features accommodates one of a plurality of fasteners; a cooling plate coupled to the lower puck plate by the plurality of fasteners; and at least one of a gasket or an o-ring disposed on a top side of at least a portion of the cooling plate, wherein the plurality of fasteners each apply an approximately equal fastening force to couple the cooling plate to the puck, to compress at least one of the o-ring or the gasket, and to maintain an approximately equal separation between the cooling plate and the lower puck plate and facilitate a uniform heat transfer between the cooling plate and the lower puck plate. ### Claim 2 (depends on 1) The electrostatic chuck assembly of claim 1, wherein the gasket is a perfluoropolymer (PFP) gasket, and wherein the PFP gasket acts as a thermal choke between the cooling plate and the puck. ### Claim 3 (depends on 1) The electrostatic chuck assembly of claim 1, further comprising: a flexible graphite layer on the gasket. ### Claim 4 (depends on 1) The electrostatic chuck assembly of claim 1, wherein the cooling plate comprises: a base portion; and a spring loaded heat sink connected to the base portion by a plurality of springs, wherein the plurality of springs apply a force to press the spring loaded heat sink against the lower puck plate. ### Claim 5 (depends on 1) The electrostatic chuck assembly of claim 1, wherein the plurality of fasteners comprise a plurality threaded fasteners and the plurality of features comprise a plurality of openings for receiving the plurality of threaded fasteners. ### Claim 6 (depends on 1) The electrostatic chuck assembly of claim 1, further comprising: an interface between the puck and the cooling plate, wherein the interface acts as a thermal choke that is configured to maintain a temperature difference between the cooling plate and the substrate of up to approximately 190° C. ### Claim 7 (depends on 1) The electrostatic chuck assembly of claim 1, wherein the electrically insulative upper puck plate comprises AlN and the lower puck plate comprises one of a) Molybdenum or b) a SiC porous body infiltrated with an AlSi alloy. ### Claim 8 (depends on 1) The electrostatic chuck assembly of claim 1, wherein the electrically insulative upper puck plate comprises Al2O3 and the lower puck plate comprises Al2O3. ### Claim 9 (depends on 1) The electrostatic chuck assembly of claim 1, wherein the electrically insulative upper puck plate comprises AlN and the lower puck plate comprises AlN. ### Claim 10 (depends on 1) The electrostatic chuck assembly of claim 1, wherein the o-ring is disposed around a perimeter of the puck at an interface between the electrically insulative upper puck plate and a base portion of the cooling plate. ### Claim 11 (depends on 1) The electrostatic chuck assembly of claim 1, further comprising: an electrically conductive path between a top of the lower puck plate and a bottom of the lower puck plate. ### Claim 12 (depends on 11) The electrostatic chuck assembly of claim 11, wherein the electrically conductive path comprises a hole filled with an electrically conductive material. ### Claim 13 An electrostatic chuck assembly, comprising: a puck comprising: an electrically insulative upper puck plate comprising one or more heating elements and one or more electrodes to electrostatically secure a substrate; and a lower puck plate bonded to the electrically insulative upper puck plate by a metal bond, the lower puck plate comprising a plurality of features distributed over the lower puck plate at a plurality of different distances from a center of the lower puck plate, wherein each of the plurality of features accommodates one of a plurality of fasteners; and an electrically conductive path between a top of the lower puck plate and a bottom of the lower puck plate; a cooling plate coupled to the lower puck plate by the plurality of fasteners, wherein the plurality of fasteners each apply an approximately equal fastening force to couple the cooling plate to the puck; and an electrically conductive gasket between the lower puck plate and the cooling plate, wherein the electrically conductive gasket contacts the electrically conductive path. ### Claim 14 A method comprising: forming a plurality of features in a lower puck plate, wherein the plurality of features are distributed over the lower puck plate at a plurality of different distances from a center of the lower puck plate, wherein each of the plurality of features accommodates one of a plurality of fasteners; bonding the lower puck plate to an electrically insulative upper puck plate with a metal bond to form a puck, the electrically insulative upper puck plate comprising one or more heating elements and one or more electrodes to electrostatically secure a substrate; disposing at least one of a gasket or an o-ring to a top side of at least a portion of a cooling plate; inserting one of the plurality of fasteners into each of the plurality of features formed in the lower puck plate; and coupling the cooling plate to the puck by tightening the plurality of fasteners, wherein the plurality of fasteners are tightened approximately equally to apply an approximately equal fastening force to couple the cooling plate to the puck, to compress at least one of the o-ring or the gasket, and to maintain an approximately equal separation between the cooling plate and the lower puck plate and facilitate a uniform heat transfer between the cooling plate and the lower puck plate. ### Claim 15 (depends on 14) The method of claim 14, further comprising: disposing a flexible graphite layer on the gasket. ### Claim 16 (depends on 14) The method of claim 14, further comprising: forming an electrically conductive path between a top of the lower puck plate and a bottom of the lower puck plate. ### Claim 17 (depends on 13) The electrostatic chuck assembly of claim 13, further comprising: at least one of a gasket or an o-ring disposed on a top side of at least a portion of the cooling plate. ### Claim 18 (depends on 17) The electrostatic chuck assembly of claim 17, wherein the gasket acts as a thermal choke between the cooling plate and the puck. ### Claim 19 (depends on 18) The electrostatic chuck assembly of claim 18, further comprising: a flexible graphite layer on the gasket. ### Claim 20 (depends on 13) The electrostatic chuck assembly of claim 13, wherein the cooling plate comprises: a base portion; and a spring loaded heat sink connected to the base portion by a plurality of springs, wherein the plurality of springs apply a force to press the spring loaded heat sink against the lower puck plate.