# US 10,872,793 B2 · System and method for monitoring operation conditions of semiconductor manufacturing apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,793 B2 - Document ID: US10872793B2 - Status: Granted - Kind: B2 - Application number: 16/129,746 - Filed: 2018-09-12 - Published: 2019-05-16 - Granted: 2020-12-22 - Earliest claimed: 2017-11-10 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Co., Ltd. - Inventors: Chih-Yu Wang; Tien-Wen Wang; Hsin-Hui Chou; In-Tsang Lin - Web page: https://patentgrep.com/patent/US10872793B2 ## CPC - H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring} - B24B 49/003: {involving acoustic means} - B24B 49/10: involving electrical means (B24B49/02, B24B49/08 take precedence) - H04R 1/04: Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) - H04R 1/08: Mouthpieces; {Microphones;} Attachments therefor - H10P 72/0616: {Monitoring of warpages, curvatures, damages, defects or the like} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) ## Abstract In a method of operating an apparatus for manufacturing or analyzing semiconductor wafers, sound in a process chamber of the apparatus during an operation of the apparatus is detected. An electrical signal corresponding to the detected sound is acquired by a signal processor. The acquired electrical signal is processed by the signal processor. An event during the operation of the apparatus is detected based on the processed electrical signal. The operation of the apparatus is controlled according to the detected event. ## Claims ### Claim 1 A method of operating an apparatus for manufacturing or analyzing semiconductor wafers, the method comprising: detecting sound in a process chamber of the apparatus during an operation of the apparatus; acquiring an electrical signal corresponding to the detected sound by a signal processor; processing, by the signal processor, the acquired electrical signal; detecting an event during the operation of the apparatus based on the processed electrical signal; and controlling the operation of the apparatus according to the detected event, wherein the method further comprises: when an abnormal event is detected, it is determined whether the abnormal even is self-recoverable, and upon determining that the abnormal even is self-recoverable, continuing the operation of the apparatus. ### Claim 2 (depends on 1) The method of claim 1, further comprising: in response to detecting the event, transmitting, by the signal processor, a feedback signal corresponding to the detected event to a controller of the apparatus, wherein the controller controls the operation of the apparatus based on the feedback signal. ### Claim 3 (depends on 1) The method of claim 1, wherein the sound is detected by one or more microphones. ### Claim 4 (depends on 1) The method of claim 1, wherein the sound is detected by multiple microphones having different detection frequency ranges. ### Claim 5 (depends on 4) The method of claim 4, wherein at least one of the multiple microphones has a detection frequency range in an audible sound range. ### Claim 6 (depends on 4) The method of claim 4, wherein at least one of the multiple microphones has a detection frequency range in an ultrasonic sound range. ### Claim 7 (depends on 4) The method of claim 4, wherein: the apparatus further includes a wafer handler for transferring a semiconductor wafer, and at least one of the multiple microphones is disposed on the water handler. ### Claim 8 (depends on 4) The method of claim 4, wherein: the apparatus further includes a movable wafer stage on which a semiconductor wafer is placed, and at least one of the multiple microphones is disposed on the movable wafer stage. ### Claim 9 (depends on 1) The method of claim 1, wherein the event includes at least one selected the group consisting of a mechanical error, a mechanical failure, and a collision of two or more parts. ### Claim 10 (depends on 1) The method of claim 1, wherein processing the electrical signal comprises at least one selected from the group consisting of filtering the electrical signal to remove noise or ambient sound from the detected sound, and processing the electrical signal in a frequency domain. ### Claim 11 (depends on 10) The method of claim 10, wherein the recognizing patterns comprises matching patterns of sounds with known events based on event models or using previously learned correspondence between patterns of sounds and events. ### Claim 12 A method of operating an apparatus for manufacturing or analyzing semiconductor wafers, the method comprising: transferring a semiconductor wafer by an wafer handler from a first place to a second place; detecting sound in a process chamber of the apparatus during transferring the semiconductor wafer; acquiring an electrical signal corresponding to the detected sound by a signal processor; processing, by the signal processor, the acquired electrical signal; detecting an event during the transferring the semiconductor wafer of the apparatus based on the processed electrical signal; and controlling the transferring the semiconductor wafer according to the detected event, wherein processing the electrical signal comprises at least one selected from the group consisting of filtering the electrical signal to remove noise or ambient sound from the detected sound, detecting a position of a source of the detected sound, and processing the electrical signal a frequency domain. ### Claim 13 (depends on 12) The method of claim 12, further comprising: in response to detecting the event, transmitting, by the signal processor, a feedback signal corresponding to the detected event to a controller of the wafer handler, wherein the controller controls the transferring the semiconductor wafer of the apparatus based on the feedback signal. ### Claim 14 (depends on 12) The method of claim 12, wherein the sound is detected by one or more microphones. ### Claim 15 (depends on 12) The method of claim 12, wherein the sound is detected by multiple microphones having different detection frequency ranges. ### Claim 16 (depends on 15) The method of claim 15, wherein at least one of the multiple microphones has a detection frequency range in an audible sound range. ### Claim 17 (depends on 15) The method of claim 15, wherein at least one of the multiple microphones has a detection frequency range in an ultrasonic sound range. ### Claim 18 A method of operating a plurality of apparatuses for manufacturing or analyzing semiconductor wafers, the method comprising: detecting sound or vibration in a process chamber of each of the plurality of apparatuses during an operation of each of the plurality of apparatuses; acquiring an electrical signal corresponding to the detected sound or vibration by a signal processor provided to each of the plurality of apparatuses; processing, by the signal processor, the acquired electrical signal; outputting, from each of the plurality of apparatuses, the acquired electrical signal to a server, wherein the server, based on a change in a characteristic sound or vibration, predicts or estimates a next maintenance timing. ### Claim 19 (depends on 18) The method of claim 18, wherein the sound in the process chamber is detected, and the sound is detected by multiple microphones. ### Claim 20 (depends on 18) The method of claim 18, wherein the vibration is detected and the vibration is detected by one of an accelerometer, a piezoelectric sensor, or a micro electro mechanical system (MEMS) sensor.