# US 10,872,786 B2 · Printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,872,786 B2 - Document ID: US10872786B2 - Status: Granted - Kind: B2 - Application number: 16/910,959 - Filed: 2020-06-24 - Published: 2020-10-15 - Granted: 2020-12-22 - Earliest claimed: 2017-09-29 - Assignees: LG Innotek Co., Ltd. - Applicants: LG Innotek Co., Ltd. - Inventors: Sung Oh Cho; Yoon Tai Kim - Web page: https://patentgrep.com/patent/US10872786B2 ## CPC - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/66: Conductive materials thereof - H10W 70/685: comprising multiple insulating layers - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer. ## Claims ### Claim 1 A printed circuit board comprising: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer includes a first region in contact with the first pad and a second region spaced apart from the first pad, wherein the first region of the first conductive layer and the second region of the first conductive layer are monolithically formed with each other, wherein the second region of the first conductive layer comprises a portion of the first conductive layer that is bent in an outward direction, wherein the second conductive layer includes a first region in contact with the second pad and a second region spaced apart from the second pad, wherein the first region of the second conductive layer and the second region of the second conductive layer are monolithically formed with each other, wherein the second region of the second conductive layer comprises a portion of the second conductive layer that is bent in an outward direction, and wherein the first conductive layer is thicker than the second conductive layer, and wherein the first pad has a narrower width than does the second pad. ### Claim 2 (depends on 1) The printed circuit board of claim 1, wherein the first conductive layer is connected to a wire, and wherein the second conductive layer is connected to a solder. ### Claim 3 (depends on 1) The printed circuit board of claim 1, wherein the insulating layer includes a plurality of insulating layers, wherein the first pad is disposed on an upper surface of a first insulating layer disposed at an uppermost portion of the plurality of insulating layers, and wherein the second pad is disposed under a lower surface of a second insulating layer disposed at a lowermost portion of the plurality of insulating layers. ### Claim 4 (depends on 1) The printed circuit board of claim 1, wherein the portion of the second region of the first conductive layer is closest to the insulating layer and is spaced apart from the first pad, and wherein the portion of the second region of the second conductive layer is closest to the insulating layer and is spaced apart from the second pad. ### Claim 5 (depends on 3) The printed circuit board of claim 3, wherein each of the first pad and the second pad includes: a plating seed layer disposed at a surface of the uppermost insulating layer or the lowermost insulating layer and including copper; a first pattern disposed on the plating seed layer and including copper; and a second pattern disposed on the first pattern and including copper. ### Claim 6 (depends on 5) The printed circuit board of claim 5, wherein the first pattern of the first pad is thicker than the second pattern of the first pad, and wherein the first pattern of the second pad is thicker than the second pattern of the second pad. ### Claim 7 (depends on 5) The printed circuit board of claim 5, wherein a central portion of an upper surface of the first pattern of the first pad is located higher than an outer side portion of the first pattern of the first pad, and wherein a central portion of an upper surface of the first pattern of the second pad is located higher than an outer side portion of the first pattern of the second pad. ### Claim 8 (depends on 5) The printed circuit board of claim 5, wherein a width of an upper surface of the first pattern of the first pad is larger than a width of a lower surface of the first pattern of the first pad, and wherein a width of an upper surface of the first pattern of the second pad is larger than a width of a lower surface of the first pattern of the second pad. ### Claim 9 (depends on 5) The printed circuit board of claim 5, wherein the first region of the first conductive layer is in direct physical contact with the second pattern of the first pad, and the second region of the first conductive layer extends from the first region of the first conductive layer and is spaced apart from the plating seed layer of the first pad, the first pattern of the first pad, and the second pattern of the first pad, and wherein the second region of the first conductive layer is not in physical contact with any of the plating seed layer of the first pad, the first pattern of the first pad, and the second pattern of the first pad. ### Claim 10 (depends on 9) The printed circuit board of claim 9, wherein the first region of the second conductive layer is in direct physical contact with the second pattern of the second pad, and the second region of the second conductive layer extends from the first region of the second conductive layer and is spaced apart from the plating seed layer of the second pad, the first pattern of the second pad, and the second pattern of the second pad, and wherein the second region of the second conductive layer is not in physical contact with any of the plating seed layer of the second pad, the first pattern of the second pad, and the second pattern of the second pad. ### Claim 11 A printed circuit board comprising: an insulating layer; a first pad disposed on a first surface of the insulating layer; a second pad disposed on a second surface of the insulating layer opposite to the first surface; a first passivation layer disposed on the first surface of the insulating layer and exposing an upper surface of the first pad; and a second passivation layer disposed on the second surface of the insulating layer and exposing a lower surface of the second pad; and a first conductive layer disposed on the first pad, wherein the first conductive layer includes: a first region in direct physical contact with the upper surface of the first pad; and a second region extending from the first region and spaced apart from the first pad, wherein the first region of the first conductive layer and the second region of the first conductive layer are monolithically formed with each other, wherein the second passivation layer has an opening partially or completely exposing the lower surface of the second pad, and wherein the first conductive layer includes a third region disposed between the first region and the second region and in direct physical contact with a side surface of the first pad. ### Claim 12 (depends on 11) The printed circuit board of claim 11, wherein the first conductive layer includes gold (Au), wherein the printed circuit board includes a second conductive layer disposed on the second pad and including gold (Au), wherein the second conductive layer includes a first region in direct physical contact with a lower surface of the second pad and a second region extending from the first region and spaced apart from the second pad, wherein the second region of the first conductive layer comprises a portion of the first conductive layer that is closest to the insulating layer and is spaced apart from the first pad, wherein the second region of the second conductive layer comprises a portion of the second conductive layer that is closest to the insulating layer and is spaced apart from the second pad. ### Claim 13 (depends on 12) The printed circuit board of claim 12, wherein a thickness, in a longitudinal direction perpendicular to the first surface of the insulating layer, of the first region of the first conductive layer is greater than a thickness, in the longitudinal direction, of the first region of the second conductive layer. ### Claim 14 (depends on 11) The printed circuit board of claim 11, wherein a width of an upper surface of the first pad is larger than that of a lower surface thereof. ### Claim 15 (depends on 12) The printed circuit board of claim 12, wherein each of the first pad and the second pad includes: a plating seed layer disposed on the first surface or the second surface of the insulating layer and including copper; a first pattern disposed on the plating seed layer and including copper; and a second pattern disposed on the first pattern and including copper. ### Claim 16 (depends on 15) The printed circuit board of claim 15, wherein an end portion of the second region of the first conductive layer is located higher than an outer side region of an upper surface of the first pattern of the first pad, and wherein an end portion of the second region of the second conductive layer is located lower than an outer side region of a lower surface of the first pattern of the second pad. ### Claim 17 (depends on 12) The printed circuit board of claim 12, wherein a thickness, in a longitudinal direction perpendicular to the first surface of the insulating layer, of the second region of the first conductive layer is different from a thickness, in the longitudinal direction, of the second region of the second conductive layer. ### Claim 18 (depends on 12) The printed circuit board of claim 12, wherein the first conductive layer is directly connected to a wire, and wherein the second conductive layer is directly connected to a solder.