# US 10,871,701 B2 · Lens driving device, and camera module and optical device, which include same

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- Number: US 10,871,701 B2
- Document ID: US10871701B2
- Status: Granted
- Kind: B2
- Application number: 16/319,063
- Filed: 2017-07-11
- Published: 2020-07-02
- Granted: 2020-12-22
- Earliest claimed: 2016-07-21
- Assignees: LG Innotek Co., Ltd.
- Applicants: LG Innotek Co., Ltd.
- Inventors: Tae Bong Park; Jun Taek Lee
- Web page: https://patentgrep.com/patent/US10871701B2

## CPC

- G03B 3/10: Power-operated focusing
- G03B 30/00: Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
- G02B 7/08: adapted to co-operate with a remote control mechanism
- G02B 7/09: adapted for automatic focusing or varying magnification
- G02B 27/646: {compensating for small deviations, e.g. due to vibration or shake (movement of one or more optical elements for control of motion blur in cameras, projectors or printers G03B2205/0007; image stabilisation in cameras peculiar to the presence or use of an electronic image sensor H04N23/68)}
- G03B 5/00: Adjustment of optical system relative to image or object surface other than for focusing
- G03B 17/02: Bodies
- H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof
- G03B 2205/0007: Movement of one or more optical elements for control of motion blur
- G03B 2205/0069: using electromagnetic actuators, e.g. voice coils
- H04N 25/00: Circuitry of solid-state image sensors [SSIS]; Control thereof
- G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D)
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION

## Abstract

An embodiment comprises: a housing; a bobbin, accommodated inside the housing, for mounting a lens; a first coil arranged on an outer peripheral surface of the bobbin; magnets arranged in the housing; a coil board which comprises second coils arranged below the housing and arranged so as to be spaced from each other and connection parts connected to the second coils; a circuit board, which is arranged below the coil board and comprises first pad parts arranged at locations corresponding to the connection parts; and a conductive adhesive member for bonding the connection part and the first pad part, which correspond to each other, wherein each of the connection parts comprises a groove part depressed from the outer surface of the coil board, and exposing any one corresponding upper surface among the first pad parts, and a bonding part prepared around the groove part, and the conductive adhesive member is arranged on the upper surface of the bonding part and on the upper surface of the first pad part exposed by the groove part and electrically connects the bonding part with the first pad part.

## Claims

### Claim 1

A lens moving apparatus comprising:
a housing;
a bobbin disposed in the housing;
a first coil disposed on the bobbin;
magnets disposed on the housing;
a coil board comprising second coils disposed under the housing so as to be spaced apart from each other and connectors connected to the second coils;
a circuit board disposed under the coil board and comprising first pads disposed at positions corresponding to the connectors; and
a conductive adhesive member for bonding the first pads to the corresponding connectors,
wherein each of the connectors comprises a recess, which is depressed from an outer surface of the coil board so as to expose an upper surface of a corresponding one of the first pads, and a bonding portion disposed near the recess, and
wherein the conductive adhesive member is disposed on an upper surface of the bonding portion and an upper surface of the first pad that is exposed through the recess so as to conductively connect the bonding portion to the first pad.

### Claim 2 (depends on 1)

The lens moving apparatus according to claim 1, wherein
the conductive adhesive member is spaced apart from an outer surface of the circuit board, and is positioned inside the outer surface of the circuit board.

### Claim 3 (depends on 2)

The lens moving apparatus according to claim 2, wherein the bonding portion of the coil board is disposed so as to be aligned with a corresponding one of the first pads in a direction parallel to an optical axis.

### Claim 4 (depends on 1)

The lens moving apparatus according to claim 1, wherein
the conductive adhesive member protrudes from an upper surface of the coil board in a direction toward the coil board from the circuit board.

### Claim 5 (depends on 4)

The lens moving apparatus according to claim 4,
wherein a lower surface of the conductive adhesive member covers the upper surface of the pad of the circuit board and the upper surface of the bonding portion of the coil board.

### Claim 6 (depends on 5)

The lens moving apparatus according to claim 5,
wherein an upper surface of the conductive adhesive member is positioned higher than an upper surface of the coil board.

### Claim 7 (depends on 1)

The lens moving apparatus according to claim 1, comprising:
upper elastic members coupled both to an upper portion of the bobbin and to an upper portion of the housing;
a lower elastic member coupled both to a lower portion of the bobbin and to a lower portion of the housing; and
support members disposed on side portions of the housing,
wherein each of the support members comprises an upper terminal portion, a lower terminal portion, and an elastic deformation portion connecting the upper terminal portion to the lower terminal portion, and
wherein each of the upper terminal portions of the support members is connected to a corresponding one of the upper elastic members.

### Claim 8 (depends on 7)

The lens moving apparatus according to claim 7, wherein
the circuit board comprises at least one second pad spaced apart from the first pads, and
wherein the at least one second pad is connected to at least one of the lower terminal portions of the support members.

### Claim 9 (depends on 2)

The lens moving apparatus according to claim 2, wherein at least one side of an upper surface of the circuit board is provided with two first pads, which are spaced apart from each other, and two second pads, which are spaced apart from each other, and
wherein the two second pads are positioned between the two first pads.

### Claim 10 (depends on 1)

The lens moving apparatus according to claim 1,
wherein the coil board further comprises wires or patterns connecting the second coils to the bonding portions of the connectors.

### Claim 11 (depends on 1)

The lens moving apparatus according to claim 1, comprising:
a cover member including a top plate and a side plate; and
a base disposed under the circuit board,
wherein the housing includes a stopper protruding from an upper surface of a corner of the housing,
wherein the cover member includes a depressed portion, which is formed by depressing a corner of the top plate, and
wherein the stopper overlaps at least part of the depressed portion in a direction perpendicular to an optical axis.

### Claim 12 (depends on 1)

The lens moving apparatus according to claim 1, wherein the recess is provided in a first region of at least one side of an upper surface of the coil board,
the at least one side of the upper surface of the coil board is provided with a second region, which is a remaining region excluding the first region, and
the first region is depressed lower than the second region.

### Claim 13 (depends on 2)

The lens moving apparatus according to claim 2, wherein the conductive adhesive member is solder or conductive paste.

### Claim 14 (depends on 1)

The lens moving apparatus according to claim 1, wherein the coil board comprises a conductive layer and an insulation layer disposed on the conductive layer, and
wherein the bonding portion is a portion of the conductive later exposed from the insulation layer.

### Claim 15 (depends on 13)

The lens moving apparatus according to claim 13, wherein a first surface of the conductive adhesive member that faces toward the outer surface of the circuit board is a flat surface.

### Claim 16 (depends on 15)

The lens moving apparatus according to claim 15, wherein a second surface of the conductive adhesive member is a curved surface, and the second surface of the conductive adhesive member faces the first surface of the conductive adhesive member.

### Claim 17 (depends on 9)

The lens moving apparatus according to claim 9, wherein the circuit board comprises a terminal rib bent at the upper surface of the circuit board and provided with a plurality of terminals, and
wherein the plurality of terminals are conductively connected to the first pads and the second pads.

### Claim 18

A lens moving apparatus comprising:
a housing;
a bobbin disposed in the housing;
a first coil disposed on the bobbin;
a magnet disposed on the housing;
a coil board comprising a second coil disposed under the housing and a connector connected to the second coil;
a circuit board disposed under the coil board and comprising a first pad; and
a conductive adhesive member for bonding the first pad to the connector,
wherein the connector comprises:
a recess depressed from an outer surface of the coil board so as to expose an upper surface of the first pad; and
a bonding portion disposed near the recess, and
wherein the conductive adhesive member conductively connects the bonding portion to the first pad.

### Claim 19 (depends on 18)

The lens moving apparatus according to claim 18, wherein the conductive adhesive member is disposed on an upper surface of the bonding portion and an upper surface of the first pad exposed through the recess.

### Claim 20 (depends on 1)

A camera module comprising:
a lens barrel;
a lens moving apparatus according to claim 1 for moving the lens barrel; and
an image sensor.