# US 10,871,689 B2 · Display substrate, display panel, display device and bonding method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,871,689 B2 - Document ID: US10871689B2 - Status: Granted - Kind: B2 - Application number: 15/757,066 - Filed: 2017-09-08 - Published: 2020-07-16 - Granted: 2020-12-22 - Earliest claimed: 2017-02-08 - Assignees: Boe Technology Group Co., Ltd.; Chongqing Boe Optoelectronics Technology Co., Ltd. - Applicants: BOE Technology Group Co., Ltd.; Chongqing BOE Optoelectronics Technology Co., Ltd. - Inventors: Cheng Zuo; Zhijun Xu; Kangpeng Dang - Web page: https://patentgrep.com/patent/US10871689B2 ## CPC - G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels} - G02F 1/133305: {Flexible substrates, e.g. plastics, organic film} - G02F 1/13338: {Input devices, e.g. touch panels} - G02F 1/133514: {Colour filters} - G02F 1/13458: {Terminal pads} - G02F 1/136286: {Wiring, e.g. gate line, drain line} - G06F 1/1652: {the display being flexible, e.g. mimicking a sheet of paper, or rollable} - G09F 9/301: {flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED} - H10D 86/00: Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates - H10D 86/441: {Interconnections, e.g. scanning lines} - H10D 86/60: wherein the TFTs are in active matrices - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10K 59/40: OLEDs integrated with touch screens - H10K 71/00: Manufacture or treatment specially adapted for the organic devices covered by this subclass - H10K 71/60: Forming conductive regions or layers, e.g. electrodes - H10K 77/10: Substrates, e.g. flexible substrates - H10K 77/111: {Flexible substrates} - H10W 72/944: {Dispositions of multiple bond pads} - H10W 80/743: {having disposition changed during the connecting} - Y02E 10/549: Organic PV cells - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - G09F: DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A display substrate, a display panel, a display device and a bonding method are provided. The display panel substrate includes: a transparent substrate comprising a display area and a bonding area located at the periphery of the display area. The bonding area is provided with a first bonding pad connected with a touch electrode, and a second bonding pad connected with a display electrode. One of the touch electrode and the display electrode is located in the display area, and the other electrode is located on another transparent substrate facing to the transparent substrate. ## Claims ### Claim 1 A display substrate, comprising: a transparent substrate comprising a display area and a bonding area located at the periphery of the display area, wherein the bonding area is provided with a first bonding pad connected with a touch electrode through a lead, and a second bonding pad connected with a display electrode; and the touch electrode is located in the display area, and the display electrode is located on another transparent substrate facing the transparent substrate, wherein the display substrate is a color filter substrate; and a via hole is further formed in the transparent substrate, and is configured to connect the display electrode and the second bonding pad, and wherein the first bonding pad and the touch electrode are located on a same surface of the transparent substrate. ### Claim 2 (depends on 1) The display substrate according to claim 1, wherein the second bonding pad and the via hole are spaced apart from each other. ### Claim 3 A display panel, comprising: a first transparent substrate and a second transparent substrate facing each other, wherein the first transparent substrate is located at a light-emitting side of the display panel; each of the first and second transparent substrates comprises a display area; a touch electrode is arranged in the display area of the first transparent substrate; a display electrode is arranged in the display area of the second transparent substrate; a via hole is formed in the first transparent substrate; wherein, the first transparent substrate is further provided with a bonding area located at the periphery of the display area, wherein a first bonding pad is connected to the touch electrode through a lead, a second bonding pad is connected to the display electrode, and both bonding pads are arranged in the bonding area; the via hole is configured to connect the second bonding pad and the display electrode, and the first bonding pad and the touch electrode are located on a same surface of the first transparent substrate; or, the second transparent substrate is further provided with a bonding area located at the periphery of the display area, wherein a first bonding pad is connected to the touch electrode, a second bonding pad is connected to the display electrode, and both bonding pads are arranged in the bonding area; and the via hole is configured to connect the first bonding pad and the touch electrode. ### Claim 4 (depends on 3) The display panel according to claim 3, further comprising: a printed circuit board and two flexible printed circuits, wherein the first bonding pad is connected to the printed circuit board through one of the two flexible printed circuits; and the second bonding pad is connected to the printed circuit board through the other one of the two flexible printed circuits. ### Claim 5 (depends on 4) A display device, comprising the display panel according to claim 4. ### Claim 6 (depends on 3) The display panel according to claim 3, further comprising: a printed circuit board and a flexible printed circuit, wherein the first bonding pad and the second bonding pad are connected to the printed circuit board through the same flexible printed circuit. ### Claim 7 (depends on 6) A display device, comprising the display panel according to claim 6. ### Claim 8 (depends on 3) A display device, comprising the display panel according to claim 3. ### Claim 9 (depends on 3) The display panel according to claim 3, wherein the second bonding pad and the via hole are spaced apart from each other. ### Claim 10 (depends on 3) The display panel according to claim 3, wherein when the bonding area is arranged on the first transparent substrate, the first bonding pad, the second bonding pad and the touch electrode are located on the same surface of the first transparent substrate; or when the bonding area is arranged on the second transparent substrate, the first bonding pad, the second bonding pad and the display electrode are located on the same surface of the second transparent substrate. ### Claim 11 (depends on 3) The display panel according to claim 3, wherein when the bonding area is arranged on the first transparent substrate, the first bonding pad, the second bonding pad and the touch electrode are located on the same surface of the first transparent substrate distal from the second transparent substrate; or when the bonding area is arranged on the second transparent substrate, the first bonding pad, the second bonding pad and the display electrode are located on the same surface of the second transparent substrate facing the first transparent substrate. ### Claim 12 A bonding method, comprising: providing a display panel comprising a first transparent substrate and a second transparent substrate facing each other, wherein the first transparent substrate is located at the light-emitting side of the display panel; each of the first and second transparent substrates comprises a display area; a touch electrode is arranged in the display area of the first transparent substrate; a display electrode is arranged in the display area of the second transparent substrate; wherein, the first transparent substrate is further provided with a bonding area located at the periphery of the display area, wherein a first bonding pad and a second bonding pad are arranged in the bonding area; the first bonding pad is connected to the touch electrode through a lead, the second bonding pad is connected to the display electrode, and the first bonding pad and the touch electrode are located on a same surface of the first transparent substrate; the method further comprises: forming a via hole in the first transparent substrate; connecting the second bonding pad and the display electrode through the via hole; and bonding the first and second bonding pads to a flexible printed circuit simultaneously, or, the second transparent substrate is further provided with a bonding area located at the periphery of the display area; a first bonding pad and a second bonding pad are arranged in the bonding area, the first bonding pad is connected to the touch electrode, the second bonding pad is connected to the display electrode; the method further comprises: forming a via hole in the first transparent substrate; connecting the first bonding pad and the touch electrode through the via hole; bonding the first and the second bonding pads to a flexible printed circuit simultaneously. ### Claim 13 (depends on 12) The method according to claim 12, wherein connecting the remaining bonding pad and the remaining electrode through the via hole comprises: injecting conductive film into the via hole to connect the remaining bonding pad and the remaining electrode. ### Claim 14 (depends on 13) The method according to claim 13, wherein the first bonding pad and the second bonding pad are bonded to two flexible printed circuits, respectively; or the first bonding pad and the second bonding pad are bonded to the same flexible printed circuit. ### Claim 15 (depends on 12) The method according to claim 12, wherein the first bonding pad and the second bonding pad are bonded to two flexible printed circuits; or the first bonding pad and the second bonding pad are bonded to the same flexible printed circuit. ### Claim 16 (depends on 12) The method according to claim 12, wherein the second bonding pad and the via hole are spaced apart from each other. ### Claim 17 (depends on 12) The method according to claim 12, wherein when the bonding area is arranged on the first transparent substrate, the first bonding pad, the second bonding pad and the touch electrode are located on the same surface of the first transparent substrate; or when the bonding area is arranged on the second transparent substrate, the first bonding pad, the second bonding pad and the display electrode are located on the same surface of the second transparent substrate. ### Claim 18 (depends on 12) The method according to claim 12, wherein when the bonding area is arranged on the first transparent substrate, the first bonding pad, the second bonding pad and the touch electrode are located on the same surface of the first transparent substrate distal from the second transparent substrate; or when the bonding area is arranged on the second transparent substrate, the first bonding pad, the second bonding pad and the display electrode are located on the same surface of the second transparent substrate facing the first transparent substrate.