# US 10,871,514 B2 · High-voltage isolator testing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,871,514 B2 - Document ID: US10871514B2 - Status: Granted - Kind: B2 - Application number: 15/151,159 - Filed: 2016-05-10 - Published: 2017-11-16 - Granted: 2020-12-22 - Earliest claimed: 2016-05-10 - Assignees: Texas Instruments Incorporated - Applicants: Texas Instruments Incorporated - Inventors: Chi-Tsung Lee; Ming-Chuan You; Chien-Lin Wu; David Anthony Graham; Andrew Patrick Couch - Web page: https://patentgrep.com/patent/US10871514B2 ## CPC - G01R 31/1263: {of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation} - G01R 31/129: {of components or parts made of semiconducting materials; of LV components or parts (G01R31/18 takes precedence)} - G01R 31/16: Construction of testing vessels; Electrodes therefor - G01R 31/2853: {Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections (G01R31/31717 takes precedence; test of chip-to-PCB or lead-to-PCB connections G01R31/66)} - G01R 31/2863: {Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04)} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A handler for holding an electronic device during high voltage testing includes conductive lead guides for shorting leads on one side of the isolator together and connectors connecting the lead guides to conductors. ## Claims ### Claim 1 A handler for holding an electronic device during high voltage testing, the handler comprising: conductive lead guides, each lead guide having a single conductive surface for shorting all leads on one side of an electronic device under test; and a plurality of connectors connecting the lead guides to conductors. ### Claim 2 (depends on 1) The handler of claim 1, further comprising: an insulator, located between the lead guides. ### Claim 3 (depends on 2) The handler of claim 2, where the insulator is made of plastic. ### Claim 4 (depends on 1) The handler of claim 1, where the connectors are spring-loaded test pins. ### Claim 5 (depends on 1) The handler of claim 1, where high voltage is coupled from the conductors through the connectors to the lead guides. ### Claim 6 (depends on 1) The handler of claim 1, where the connectors are arranged into sets, each set contacting one lead guide. ### Claim 7 (depends on 6) The handler of claim 6, further comprising: an insulator, located between sets of the connectors. ### Claim 8 (depends on 7) The handler of claim 7, where the insulator is made of plastic. ### Claim 9 (depends on 6) The handler of claim 6, where each set of connectors is mounted onto a conductor. ### Claim 10 (depends on 9) The handler of claim 9, where corners of the conductors are rounded. ### Claim 11 (depends on 1) The handler of claim 1, where the lead guides are made of metal. ### Claim 12 (depends on 11) The handler of claim 11, where the lead guides are made of copper. ### Claim 13 (depends on 1) The handler of claim 1 where corners of the lead guides are rounded. ### Claim 14 A method of high-voltage testing an electronic device, comprising: pressing, by a handler, a conductive lead guide having a single conductive surface against all leads on one side of the electronic device; pressing, by the handler, the lead guide against connectors; and applying, by the handler, a high voltage to the connectors. ### Claim 15 (depends on 14) The method of claim 14, further comprising: locating, by the handler, an insulator between the lead guides and above the electronic device under test. ### Claim 16 (depends on 14) The method of claim 14, further comprising: locating, by the handler, an insulator at a midpoint between sets of the connectors. ### Claim 17 A method of fabricating a handler for holding an electronic device during high voltage testing, comprising: mounting lead guides in a position to facilitate each lead guide contacting all leads on one side of an electronic device under test with a single conductive surface of the lead guide; and mounting connectors in a position to contact the lead guides. ### Claim 18 (depends on 17) The method of claim 17, further comprising: mounting an insulator so that it is located between the lead guides and above the electronic device under test. ### Claim 19 (depends on 17) The method of claim 17, further comprising: mounting an insulator so that it is located at a midpoint between sets of the connectors. ### Claim 20 (depends on 1) The handler of claim 1, wherein the conductive lead guides are rigid. ### Claim 21 (depends on 1) The handler of claim 1, wherein the electronic device under test is an isolator. ### Claim 22 (depends on 1) The handler of claim 1, wherein each conductive lead guides presses down against a top surface of all leads on one side of the electronic device under test. ### Claim 23 (depends on 17) The method of claim 17, wherein the conductive lead guides are rigid. ### Claim 24 (depends on 17) The method of claim 17, wherein the electronic device under test is an isolator. ### Claim 25 (depends on 17) The method of claim 17, wherein each conductive lead guides presses down against a top surface of all leads on one side of the electronic device under test. ### Claim 26 A handler for holding an electronic device during high voltage testing, the handler comprising: conductive lead guides, each lead guide for pressing down against and shorting all leads on one side of an electronic device under test; and a plurality of connectors connecting the lead guides to conductors. ### Claim 27 (depends on 14) The method of claim 14, wherein the conductive lead guides are rigid. ### Claim 28 (depends on 14) The method of claim 14, wherein the electronic device under test is an isolator. ### Claim 29 (depends on 14) The method of claim 14, wherein each conductive lead guides presses down against a top surface of all leads on one side of the electronic device under test.