# US 10,871,456 B2 · Semiconductor inspection system and semiconductor inspection apparatus

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- Number: US 10,871,456 B2
- Document ID: US10871456B2
- Status: Granted
- Kind: B2
- Application number: 16/562,502
- Filed: 2019-09-06
- Published: 2020-08-13
- Granted: 2020-12-22
- Earliest claimed: 2019-02-07
- Assignees: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
- Applicants: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
- Inventors: Ikuo Motonaga
- Web page: https://patentgrep.com/patent/US10871456B2

## CPC

- G01N 21/956: Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)}
- H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects}
- G01N 21/95684: {Patterns showing highly reflecting parts, e.g. metallic elements}
- H10W 76/10: Containers or parts thereof
- H10W 74/111: {the semiconductor body being completely enclosed}
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor inspection system according to an embodiment includes first imaging unit capturing an image of a first lead of a semiconductor package from a first direction perpendicular to an upper surface, the semiconductor package including a sealing portion and the first lead, the sealing portion having the upper surface, the first lead extending sideward from the sealing portion; first calculation unit calculating a front length of the first lead from the image captured by the first imaging unit; second imaging unit capturing an image of the first lead from a second direction inclined to the upper surface; second calculation unit calculating an oblique length of the first lead from the image captured by the second imaging unit; and third calculation unit calculating an amount of floating of the first lead from a reference plane parallel to the upper surface, using the front length and the oblique length.

## Claims

### Claim 1

A semiconductor inspection system comprising:
a rotatable index table configured to mount a semiconductor package to be inspected, the semiconductor package including a sealing portion and a first lead, the sealing portion sealing a semiconductor chip, the sealing portion having an upper surface, a lower surface, a first side surface, and a second side surface opposite to the first side surface, the first lead extending sideward from the first side surface of the sealing portion;
a first camera configured to capture an image of the first lead of the semiconductor package from a first direction perpendicular to the upper surface and the lower surface, the first camera disposed at a first position along a perimeter of the index table;
a first calculator configured to calculate a front length of the first lead from the image captured by the first camera;
a mirror;
a second camera capturing an image of the first lead from a second direction inclined with respect to the upper surface and the lower surface using the mirror, the second camera disposed at a second position along a perimeter of the index table different from the first position;
a second calculator calculating an oblique length of the first lead from the image captured by the second camera; and
a third calculator calculating an amount of floating of the first lead from a reference plane parallel to the upper surface and the lower surface, using the front length and the oblique length.

### Claim 2 (depends on 1)

The semiconductor inspection system according to claim 1,
wherein the third calculator is configured to calculate the amount of floating using the following expression in a case in which an angle formed between the reference plane and the second direction is θ, the front length is LA, the oblique length is LB, and the amount of floating is H:
H=LA×tan θ−LB/cos θ (Expression)

### Claim 3 (depends on 1)

The semiconductor inspection system according to claim 1, further comprising:
a storage storing a threshold value of the amount of floating; and
a determination hardware comparing the amount of floating with the threshold value of the amount of floating and determining whether the semiconductor package is defective.

### Claim 4 (depends on 1)

The semiconductor inspection system according to claim 1, further comprising:
a collet sucking and supporting the semiconductor package.

### Claim 5

A semiconductor inspection system comprising:
a first camera configured to capture an image of a first lead and a second lead of a semiconductor package from a first direction perpendicular to an upper surface and a lower surface at a same time, the semiconductor package including a sealing portion, the first lead, and the second lead, the sealing portion sealing a semiconductor chip, the sealing portion having the upper surface, the lower surface, a first side surface, and a second side surface opposite to the first side surface, the first lead extending sideward from the first side surface of the sealing portion, and the second lead extending sideward from the second side surface;
a first calculator calculating a front length of the first lead and the second lead from the image captured by the first camera;
a first light source provided on an upper surface side and a first side surface side of the semiconductor package;
a second light source provided on the upper surface side and a second side surface side of the semiconductor package;
a first mirror provided on a lower surface side and the second side surface side of the semiconductor package and configured to reflect a silhouette image of the first lead illuminated by the first light source;
a second mirror provided on the lower surface side and the first side surface side of the semiconductor package and configured to reflect a silhouette image of the second lead illuminated by the second light source;
a second camera provided on the lower surface side of the semiconductor package, the second camera configured to capture the silhouette image of the first lead from a second direction inclined with respect to the upper surface and the lower surface, the second camera configured to capture the silhouette image of the second lead from a third direction inclined with respect to the upper surface and the lower surface, the second camera configured to capture the silhouette image of the first lead and the silhouette image of the second lead at the same time;
a second calculator configured to calculate an oblique length of the first lead and the second lead from the image captured by the second camera; and
a third calculator configured to calculate an amount of floating of the first lead and the second lead from a reference plane parallel to the upper surface and the lower surface, using the front length and the oblique length,
wherein a perpendicular line drawn from an end of the first light source close to the semiconductor package to the reference plane intersects the semiconductor package or the first lead, and
a perpendicular line drawn from an end of the second light source close to the semiconductor package to the reference plane intersects the semiconductor package or the second lead.

### Claim 6 (depends on 5)

The semiconductor inspection system according to claim 5,
wherein an angle of the first mirror with respect to the reference plane is variable, and
an angle of the second mirror with respect to the reference plane is variable.

### Claim 7

A semiconductor inspection system comprising:
a first camera capturing an image of a first lead of a semiconductor package from a first direction perpendicular to an upper surface and a lower surface, the semiconductor package including a sealing portion and the first lead, the sealing portion sealing a semiconductor chip, the sealing portion having the upper surface, the lower surface, a first side surface, and a second side surface opposite to the first side surface, the first lead extending sideward from the first side surface of the sealing portion;
a first calculator configured to calculate a front length of the first lead from the image captured by the first camera
a second camera configured to capture an image of the first lead from a second direction inclined with respect to the upper surface and the lower surface;
a second calculator configured to calculate an oblique length of the first lead from the image captured by the second camera; and
a third calculator configured to calculate an amount of floating of the first lead from a reference plane parallel to the upper surface and the lower surface, using the front length and the oblique length,
wherein the third calculator configured to calculate the amount of floating using the following expression in a case in which an angle formed between the reference plane and the second direction is θ, the front length is LA, the oblique length is LB, and the amount of floating is H:
H=LA×tan θ−LB/cos θ (Expression).