# US 10,871,394 B2 · Optical sensor assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,871,394 B2 - Document ID: US10871394B2 - Status: Granted - Kind: B2 - Application number: 16/458,626 - Filed: 2019-07-01 - Published: 2020-02-06 - Granted: 2020-12-22 - Earliest claimed: 2018-08-03 - Assignees: Pixart Imaging Inc. - Applicants: PixArt Imaging Inc. - Inventors: Chih-Ming Sun; Po-Wei Yu - Web page: https://patentgrep.com/patent/US10871394B2 ## CPC - G01J 1/0271: {Housings; Attachments or accessories for photometers} - G01J 1/0422: {using light concentrators, collectors or condensers} - G01J 1/0204: {Compact construction} - G01J 1/0411: {using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction} - G01J 1/06: Restricting the angle of incident light - G01J 1/42: using electric radiation detectors (optical or mechanical part G01J1/04; by comparison with a reference light or electric value G01J1/10) - H05K 1/181: associated with surface mounted components - G01J 2001/0276: {Protection} - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 2201/10121: Optical component, e.g. opto-electronic component - H05K 2201/10151: Sensor - G01J: MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources F21, H01J, H01K, H05B; investigating properties of materials by optical means G01N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An optical sensor assembly is provided. The optical sensor assembly includes a circuit board, an optical sensor positioned on the circuit board, and a front cover attached to the circuit board and covering the optical sensor. The front cover includes an optical element configured to guide or condense an incident light of a predetermined wavelength onto the optical sensor. The front cover is made of polypropylene or polyethylene. The predetermined wavelength is in a range from 8 micrometers to 12 micrometers. ## Claims ### Claim 1 An optical sensor assembly, comprising: a circuit board; an optical sensor positioned on the circuit board; and a front cover comprising a receiving cavity configured to accommodate the optical sensor, wherein the front cover further comprises: an optical element configured to condense an incident light of a predetermined wavelength onto the optical sensor; a curved sheet; and a planar frame connected to and surrounding the curved sheet, the optical element is positioned in the curved sheet, and the optical element is parallel to a sensing surface of the optical sensor, the front cover is made of polypropylene or polyethylene, and the predetermined wavelength is in a range from 8 micrometers to 12 micrometers. ### Claim 2 (depends on 1) The optical sensor assembly of claim 1, wherein the optical element has a transmittance in a range from 20% to 80%. ### Claim 3 (depends on 1) The optical sensor assembly of claim 1, wherein the optical element comprises at least one of a polypropylene film, a polyethylene film, a silicon film, a germanium film, and a diamond-like carbon film. ### Claim 4 (depends on 1) The optical sensor assembly of claim 1, wherein the optical element comprises a convex lens or a Fresnel lens, and the convex lens or the Fresnel lens is located at an inner surface of the optical element. ### Claim 5 (depends on 1) The optical sensor assembly of claim 1, wherein the front cover further comprises: a wall structure positioned on the curved sheet, wherein the receiving cavity is positioned in the wall structure. ### Claim 6 (depends on 5) The optical sensor assembly of claim 5, wherein the wall structure comprises an inner loop wall surrounding the optical element and an outer loop wall surrounding the inner loop wall, one end of the inner loop wall is connected to the curved sheet and another end of the inner loop wall has an opening, one end of the outer loop wall is connected to the curved sheet and another end of the outer loop wall has an opening, and an area of the circuit board is between an area of the opening of the inner loop wall and an area of the opening of the outer loop wall. ### Claim 7 (depends on 6) The optical sensor assembly of claim 6, further comprising: a connector positioned on the circuit board and configured to transmit electrical signals to and from the optical sensor; and a back cover attached to the outer loop wall and configured to seal the opening of the outer loop wall, wherein the back cover has an opening configured to expose an end of the connector. ### Claim 8 (depends on 6) The optical sensor assembly of claim 6, wherein the receiving cavity comprises a first cavity receiving the optical sensor and a second cavity receiving the circuit board, the first cavity is positioned in the inner loop wall, and the second cavity is positioned in the outer loop wall. ### Claim 9 (depends on 8) The optical sensor assembly of claim 8, wherein the wall structure further comprises a plurality of ridge walls connecting the inner loop wall, the outer loop wall and the curved sheet, each of the ridge walls has an indent on an edge of that ridge wall connecting the inner loop wall and the outer loop wall, and the second cavity is formed by the indents of all of the ridge walls. ### Claim 10 (depends on 1) The optical sensor assembly of claim 1, wherein the optical element and the optical sensor are parallel to the planar frame. ### Claim 11 (depends on 1) The optical sensor assembly of claim 1, wherein the optical element and the optical sensor are neither parallel nor perpendicular to the planar frame. ### Claim 12 An optical sensor assembly, comprising: a circuit board; an optical sensor positioned on the circuit board; and a front cover comprising a receiving cavity configured to accommodate the optical sensor, wherein the front cover further comprises: an optical element configured to guide an incident light of a predetermined wavelength to the optical sensor, a curved sheet; and a planar frame connected to and surrounding the curved sheet, the optical element is positioned in the curved sheet, and the optical element is parallel to a sensing surface of the optical sensor, the front cover is made of polypropylene or polyethylene, and the predetermined wavelength is in a range from 8 micrometers to 12 micrometers. ### Claim 13 (depends on 12) The optical sensor assembly of claim 12, wherein the optical element and the optical sensor are parallel to the planar frame. ### Claim 14 (depends on 12) The optical sensor assembly of claim 12, wherein the optical element and the optical sensor are neither parallel nor perpendicular to the planar frame. ### Claim 15 (depends on 12) The optical sensor assembly of claim 12, wherein the front cover further comprises a wall structure positioned on the curved sheet, and the receiving cavity is positioned in the wall structure. ### Claim 16 (depends on 15) The optical sensor assembly of claim 15, wherein the wall structure comprises an inner loop wall surrounding the optical element and an outer loop wall surrounding the inner loop wall, one end of the inner loop wall is connected to the curved sheet and another end of the inner loop wall has an opening, one end of the outer loop wall is connected to the curved sheet and another end of the outer loop wall has an opening, and an area of the circuit board is between an area of the opening of the inner loop wall and an area of the opening of the outer loop wall. ### Claim 17 (depends on 16) The optical sensor assembly of claim 16, further comprising: a connector positioned on the circuit board and configured to transmit electrical signals to and from the optical sensor; and a back cover attached to the outer loop wall and configured to seal the opening of the outer loop wall, wherein the back cover has an opening configured to expose an end of the connector. ### Claim 18 (depends on 16) The optical sensor assembly of claim 16, wherein the receiving cavity comprises a first cavity receiving the optical sensor and a second cavity receiving the circuit board, the first cavity is positioned in the inner loop wall, and the second cavity is positioned in the outer loop wall. ### Claim 19 (depends on 18) The optical sensor assembly of claim 18, wherein the wall structure further comprises a plurality of ridge walls connecting the inner loop wall, the outer loop wall and the curved sheet, each of the ridge walls has an indent on an edge of that ridge wall connecting the inner loop wall and the outer loop wall, and the second cavity is formed by the indents of all of the ridge walls. ### Claim 20 A front cover of an optical sensor assembly, the optical sensor assembly comprising an optical sensor, the front cover comprising: a receiving cavity configured to accommodate the optical sensor; a curved sheet; a planar frame connected to and surrounding the curved sheet; and an optical element positioned in the curved sheet, and configured to condense an incident light of a predetermined wavelength onto the optical sensor.