# US 10,871,268 B2 · LED lighting unit > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,871,268 B2 - Document ID: US10871268B2 - Status: Granted - Kind: B2 - Application number: 15/318,068 - Filed: 2015-06-26 - Published: 2017-05-04 - Granted: 2020-12-22 - Earliest claimed: 2014-06-26 - Assignees: Koninklijke Philips N.V. - Applicants: Koninklijke Philips N.V. - Inventors: Hendrik Johannes Boudewijn Jagt; Floris Maria Hermansz Crompvoets; Wouter Dekkers; Fritz Helmut Zahn; Olexandr Valentynovych Vdovin; Jacobus Johannes Franciscus Gerardus Heuts; Maria Johanna Helena Jochem; Christian Kleijnen - Web page: https://patentgrep.com/patent/US10871268B2 ## CPC - F21V 5/002: {using microoptical elements for redirecting or diffusing light} - F21K 9/64: using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer - F21V 17/101: {permanently, e.g. welding, gluing or riveting} - F21V 33/0052: {Audio or video equipment, e.g. televisions, telephones, cameras or computers; Remote control devices therefor} - G02B 19/0061: {the light source comprising a LED} - G03B 15/05: Combinations of cameras with electronic flash apparatus; Electronic flash units - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/56: provided with illuminating means - H10H 20/8512: {Wavelength conversion materials} - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - F21Y 2115/10: Light-emitting diodes [LED] - G03B 2215/0567: Solid-state light source, e.g. LED, laser - G03B 2215/0592: installed in front of light emitter - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract An LED lighting unit comprising a support structure (14), an LED-based light emitting structure (10) mounted within the support structure and an optical beam shaping arrangement (50, 52) over the top of the support structure. The optical beam shaping arrangement comprises an optically transparent and thermally stable material, and the support structure supports the microstructured layer at a small height above the LED-based light emitting structure. This height may for example be less than 0.5 mm. The optical beam shaping arrangement enables a compact and low height lighting unit to be mounted on a carrier by reflow soldering without damaging the optical beam-shaping component. ## Claims ### Claim 1 A LED lighting unit, comprising: a support structure; an LED chip mounted within the support structure, the LED chip comprising a height of less than 0.6 mm; an optical beam shaping arrangement disposed over the support structure and comprising a microstructured layer positioned at a height of less than the square root of a light emitting area of the LED chip above the LED chip, the microstructured layer comprising: an optically transparent and thermally stable material having a refractive index; and at least one array of micro-elements that extend in a line giving a one-dimensional repetition, each micro-element having one or more sides which meet at a top apex, the one or more sides being straight from their base to the top apex, a distance from the top apex of at least one micro-element to a bottom surface of the LED lighting unit opposite the top apex is less than 1.5 mm; and a first material between the LED chip and the optical beam shaping arrangement, the first material having a first refractive index, the refractive index of the optically transparent and thermally stable material is between 0.3 and 0.65 greater than the first refractive index, and the optical beam shaping arrangement is: in contact with the first material of the first refractive index; or bonded to the first material of the first refractive index through an intermediate bonding layer; or bonded to the LED chip using a partial bonding layer having bonding portions and portions of the first material of the first refractive index. ### Claim 2 (depends on 1) A lighting unit as claimed in claim 1, wherein the beam shaping arrangement is in contact with the first material of the first refractive index. ### Claim 3 (depends on 1) A lighting unit as claimed in claim 1, wherein the optical beam shaping arrangement is bonded to the LED chip. ### Claim 4 (depends on 1) A lighting unit as claimed in claim 1, wherein the LED chip comprises: an LED die and a phosphor directly over the LED die; or an LED die, and the lighting unit further comprises a phosphor filling the support structure; or an LED die, and the lighting unit further comprises a phosphor layer beneath the first microstructured layer and spaced from the LED die. ### Claim 5 (depends on 1) A lighting unit as claimed in claim 1, comprising a plurality of beam shaping arrangements in a stack, and comprising a layer between the beam shaping arrangements which comprises air or an adhesive. ### Claim 6 (depends on 1) A lighting unit as claimed in claim 1, comprising a camera flash unit. ### Claim 7 (depends on 1) A lighting unit as claimed in claim 1, comprising a total of three or less LED chips mounted within the support structure, the LED chips having different colors. ### Claim 8 (depends on 1) A lighting unit as claimed in claim 1, comprising a total of two or less LED chips mounted within the support structure, the LED chips having different colors. ### Claim 9 (depends on 1) A lighting unit as claimed in claim 1, comprising a total of one LED chip mounted within the support structure. ### Claim 10 (depends on 1) A lighting unit as claimed in claim 1, wherein the optical beam shaping arrangement is bonded to the first material of the first refractive index through an intermediate bonding layer. ### Claim 11 (depends on 1) A lighting unit as claimed in claim 1, wherein the optical beam shaping arrangement is bonded to the LED chip using a partial bonding layer having bonding portions and portions of the first material of the first refractive index. ### Claim 12 (depends on 2) A lighting unit as claimed in claim 2, wherein the support structure comprises reflective side walls extending between the LED chip and the optical beam shaping arrangement. ### Claim 13 (depends on 2) A lighting unit as claimed in claim 2, wherein the microstructured layer comprises a silicone, a hybrid silicone, a silicate, a hybrid silicate, a sol-gel material, a polyimide, a glass or a transparent ceramic. ### Claim 14 (depends on 2) A lighting unit as claimed in claim 2, wherein the optical beam shaping arrangement comprises a base layer and the microstructured layer over the base layer, wherein the base layer preferably comprises a polyimide or a heat-stabilized PEN, or a silicones, or a glass or a transparent ceramic. ### Claim 15 (depends on 2) A lighting unit as claimed in claim 2, wherein the support structure supports the microstructured layer of the beam shaping arrangement at a height of less than 0.5 mm above the LED chip. ### Claim 16 (depends on 2) A lighting unit as claimed in claim 2, wherein the first material comprises: air with a refractive index of 1.0; a low refractive index layer with a refractive index below 1.3; or a covering layer with a refractive index between 1.3 and 1.6. ### Claim 17 (depends on 13) A lighting unit as claimed in claim 13, wherein the microstructured layer comprises a methylsiloxane, a methylphenyl siloxane, a phenylsiloxane, an epoxy functionalized siloxane or a high index silicone, a methylsilicate or methylphenylsilicate or phenyl silicate or other alkylsilicate, or materials derived from metal alkoxide precursors or mixtures thereof. ### Claim 18 (depends on 13) A lighting unit as claimed in claim 13, further comprising an adhesion promoting layer between the base layer and the microstructured layer. ### Claim 19 (depends on 18) A lighting unit as claimed in claim 18, wherein the adhesion promoting layer comprises a silane, titanate or zirconate containing material. ### Claim 20 (depends on 6) A mobile portable device comprising a camera optical sensor and a flash unit as claimed in claim 6.