# US 10,870,924 B2 · Aluminum-copper connector having a heterostructure, and method for producing the heterostructure

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- Number: US 10,870,924 B2
- Document ID: US10870924B2
- Status: Granted
- Kind: B2
- Application number: 16/320,204
- Filed: 2017-06-03
- Published: 2019-08-29
- Granted: 2020-12-22
- Earliest claimed: 2016-07-25
- Assignees: Christian-Albrechts-Universitaet zu Kiel
- Applicants: Christian-Albrechts-Universitaet zu Kiel
- Inventors: Mark-Daniel Gerngross; Melike Baytekin-Gerngross; Juergen Carstensen; Rainer Adelung
- Web page: https://patentgrep.com/patent/US10870924B2

## CPC

- C25D 5/44: Aluminium
- C25D 5/38: of refractory metals or nickel
- C25D 7/00: Electroplating characterised by the article coated
- C25D 7/0607: {Wires}
- C25D 7/0614: {Strips or foils}
- C25F 3/04: of light metals
- H01R 13/03: characterised by the material, e.g. plating, or coating materials
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25F: PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminium or an aluminium alloy with solid solutions present in the alloy, wherein a. an anchoring layer is arranged between the first and second surfaces, wherein b. each slice plane running perpendicular to the anchoring layer has at least one aluminium or aluminium-alloy island surrounded by copper, and c. at most the aluminium alloy solid solutions which are present in the alloy occur in the anchoring layer. Also, an aluminium-copper connector and a heterostructure production method.

## Claims

### Claim 1

A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminum or an aluminum alloy with solid solutions present in the alloy, wherein
a. an anchoring layer is arranged between the first and second surfaces, wherein
b. each slice plane running perpendicular to the anchoring layer has at least one aluminum or aluminum-alloy island surrounded by copper,
c. any aluminum alloy solid solutions present in the alloy are in the anchoring layer,
d. the islands of aluminum or aluminum alloy enclosed by copper have nested and sideways protruding cantilevered structure,
e. if the heterostructure is made of copper and pure aluminum, there are no mixed crystals at all, and
if the heterostructure is made of copper and aluminum alloy, any mixed crystals present in the heterostructure were pre-existing in the alloy prior to forming the heterostructure and the forming of the heterostructure has not formed any new solid solution crystals, and
f. the thickness of the anchoring layer is between 0.5 and 100 micrometers.

### Claim 2 (depends on 1)

The heterostructure according to claim 1, wherein an X-ray diffractogram of the anchoring layer shows only the crystallites of copper and aluminum or aluminum alloy which also occurred in the bulk materials.

### Claim 3 (depends on 1)

The heterostructure according to claim 1, wherein the thickness of the anchoring layer is between 10 and 50 micrometers.