# US 10,870,756 B2 · Acrylic composition for encapsulation, sheet material, laminated sheet, cured object, semiconductor device, and process for producing semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,870,756 B2 - Document ID: US10870756B2 - Status: Granted - Kind: B2 - Application number: 16/321,643 - Filed: 2017-07-21 - Published: 2020-01-09 - Granted: 2020-12-22 - Earliest claimed: 2016-08-10 - Assignees: Panasonic Intellectual Property Management Co., Ltd. - Applicants: Panasonic Intellectual Property Management Co., Ltd. - Inventors: Shigeru Yamatsu; Kazuki Watanabe; Naoki Kanagawa; Daisuke Sasaki - Web page: https://patentgrep.com/patent/US10870756B2 ## CPC - C08L 71/126: {modified by chemical after-treatment} - H10W 74/47: comprising organic materials, e.g. plastics or resins - C08F 290/06: Polymers provided for in subclass C08G - C08J 5/18: Manufacture of films or sheets - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10W 72/0198: {batch processes} - H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills} - H10W 74/131: {the semiconductor body being only partially enclosed} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 74/473: {containing a filler} - C08J 2371/10: from phenols - C08J 2371/12: Polyphenylene oxides - C08J 2423/26: modified by chemical after-treatment - C08J 2433/14: of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen - C08J 2463/10: Epoxy resins modified by unsaturated compounds - C08J 2471/02: Polyalkylene oxides - H10W 70/682: {comprising holes having chips therein} - H10W 72/01204: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates} - H10W 72/01304: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/072: {of bump connectors} - H10W 72/07234: {Using a reflow oven} - H10W 72/07334: {Using a reflow oven} - H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting} - H10W 72/222: {Multilayered bumps, e.g. a coating on top and side surfaces of a bump core} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 72/29: Bond pads specially adapted therefor - H10W 72/325: {Die-attach connectors having a filler embedded in a matrix} - H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics} - H10W 72/354: {comprising polymers} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 99/00: Subject matter not provided for in other groups of this subclass - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS - C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, and a thermal radical polymerization initiator. ## Claims ### Claim 1 An acrylic composition for sealing, the acrylic composition comprising: an acrylic compound; a polyphenylene ether resin including a radical-polymerizable substituent at a terminal; maleic acid-modified polybutadiene; an inorganic filler; and a thermal radical polymerization initiator, wherein: the acrylic compound contains a (meth)acrylate having a crosslinked polycyclic structure, a di(meth)acrylate having a structure in which an alkylene oxide is added to a bisphenol skeleton, and an epoxy (meth)acrylate, a proportion of the (meth)acrylate having a crosslinked polycyclic structure in the acrylic compound ranges from 10% by mass to 50% by mass, inclusive, a proportion of the di(meth)acrylate having a structure in which an alkylene oxide is added to a bisphenol skeleton in the acrylic compound ranges from 3% by mass to 20% by mass, inclusive, and a proportion of the epoxy (meth)acrylate in the acrylic compound ranges from 5% by mass to 30% by mass, inclusive. ### Claim 2 (depends on 1) The acrylic composition for sealing according to claim 1, further comprising a nitroxide compound. ### Claim 3 (depends on 1) The acrylic composition for sealing according to claim 1, wherein the radical-polymerizable substituent includes a carbon-carbon double bond. ### Claim 4 (depends on 3) The acrylic composition for sealing according to claim 3, wherein the radical-polymerizable substituent includes a structure represented by formula (1) shown below: wherein R is hydrogen or an alkyl group. ### Claim 5 (depends on 1) A sheet material that is a dried product or a half-cured product of the acrylic composition for sealing according to claim 1. ### Claim 6 (depends on 5) The sheet material according to claim 5, having a minimum melt viscosity less than or equal to 200 Pa·s. ### Claim 7 (depends on 5) A multilayer sheet comprising: the sheet material according to claim 5; and a support sheet that supports the sheet material. ### Claim 8 (depends on 5) A cured product that is a thermally cured product of the sheet material according to claim 5. ### Claim 9 (depends on 8) The cured product according to claim 8, having a glass transition temperature more than or equal to 170° C. ### Claim 10 (depends on 8) A semiconductor device comprising: a substrate; a semiconductor chip mounted face-down on the substrate; and a sealing material that seals a gap between the substrate and the semiconductor chip, wherein the sealing material is made of the cured product according to claim 8. ### Claim 11 (depends on 1) A cured product that is a thermally cured product of the acrylic composition for sealing according to claim 1. ### Claim 12 (depends on 11) The cured product according to claim 11, having a glass transition temperature more than or equal to 170° C. ### Claim 13 (depends on 11) A semiconductor device comprising: a substrate; a semiconductor chip mounted face-down on the substrate; and a sealing material that seals a gap between the substrate and the semiconductor chip, wherein the sealing material is made of the cured product according to claim 11. ### Claim 14 (depends on 1) The acrylic composition for sealing according to claim 1, wherein a content ratio of the maleic acid-modified polybutadiene to the acrylic compound is from 10% by mass to 30% by mass, inclusive. ### Claim 15 (depends on 1) The acrylic composition for sealing according to claim 1, wherein the (meth)acrylate having a crosslinked polycyclic structure includes at least one selected from the group consisting of a (meth)acrylate having a dicyclopentadiene skeleton, a (meth)acrylate having a perhydro-1,4:5,8-dimethanonaphthalene skeleton, a (meth)acrylate having a norbornane skeleton, dicyclopentadienyl diacrylate, perhydro-1,4:5,8-dimethanonaphthalene-2,3,7-trimethylol triacrylate, norbornane dimethylol diacrylate, and perhydro-1,4:5,8-dimethanonaphthalene-2,3-dimethylol diacrylate. ### Claim 16 (depends on 1) The acrylic composition for sealing according to claim 1, wherein the (meth)acrylate having a crosslinked polycyclic structure includes at least one of dicyclopentadienyl diacrylate and norbornane dimethylol diacrylate. ### Claim 17 A method for manufacturing a semiconductor device, the method comprising: overlaying a sheet material on a surface of a semiconductor wafer including a bump electrode, the surface including the bump electrode, the sheet material being a dried product or a half-cured product of an acrylic composition for sealing, the acrylic composition comprising an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, and a thermal radical polymerization initiator; cutting the semiconductor wafer together with the sheet material to produce a member, the member including a semiconductor chip cut out from the semiconductor wafer and an individual sheet cut out from the sheet material; stacking a substrate including a conductor wiring, the individual sheet, and the semiconductor chip in this order by overlaying the member on a surface of the substrate, the surface including the conductor wiring; and heating the individual sheet to produce a sealing material by melting and then curing the individual sheet, and to electrically connect the bump electrode to the conductor wiring. ### Claim 18 A sheet material that is a dried product or a half-cured product of an acrylic composition for sealing, the acrylic composition including: an acrylic compound; a polyphenylene ether resin including a radical-polymerizable substituent at a terminal; an inorganic filler; and a thermal radical polymerization initiator, wherein: the acrylic compound contains a (meth)acrylate having a crosslinked polycyclic structure, a di(meth)acrylate having a structure in which an alkylene oxide is added to a bisphenol skeleton, and an epoxy (meth)acrylate, a proportion of the (meth)acrylate having a crosslinked polycyclic structure in the acrylic compound ranges from 10% by mass to 50% by mass, inclusive, a proportion of the di(meth)acrylate having a structure in which an alkylene oxide is added to a bisphenol skeleton in the acrylic compound ranges from 3% by mass to 20% by mass, inclusive, a proportion of the epoxy (meth)acrylate in the acrylic compound ranges from 5% by mass to 30% by mass, inclusive, and the sheet material has a minimum melt viscosity less than or equal to 200 Pa·s. ### Claim 19 (depends on 18) The sheet material according to claim 18, wherein the sheet material has a minimum melt viscosity more than or equal to 10 Pa·s. ### Claim 20 (depends on 18) A multilayer sheet comprising: the sheet material according to claim 18; and a support sheet that supports the sheet material. ### Claim 21 (depends on 18) A cured product that is a thermally cured product of the sheet material according to claim 18. ### Claim 22 (depends on 21) The cured product according to claim 21, having a glass transition temperature more than or equal to 170° C. ### Claim 23 (depends on 21) A semiconductor device comprising: a substrate; a semiconductor chip mounted face-down on the substrate; and a sealing material that seals a gap between the substrate and the semiconductor chip, wherein the sealing material is made of the cured product according to claim 21. ### Claim 24 (depends on 18) The acrylic composition for sealing according to claim 18, wherein the (meth)acrylate having a crosslinked polycyclic structure includes at least one selected from the group consisting of a (meth)acrylate having a dicyclopentadiene skeleton, a (meth)acrylate having a perhydro-1,4:5,8-dimethanonaphthalene skeleton, a (meth)acrylate having a norbornane skeleton, dicyclopentadienyl diacrylate, perhydro-1,4:5,8-dimethanonaphthalene-2,3,7-trimethylol triacrylate, norbornane dimethylol diacrylate, and perhydro-1,4:5,8-dimethanonaphthalene-2,3-dimethylol diacrylate. ### Claim 25 (depends on 18) The acrylic composition for sealing according to claim 18, wherein the (meth)acrylate having a crosslinked polycyclic structure includes at least one of dicyclopentadienyl diacrylate and norbornane dimethylol diacrylate.