# US 10,870,725 B2 · Heat curable resin composition, and circuit board with electronic component mounted thereon

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,870,725 B2
- Document ID: US10870725B2
- Status: Granted
- Kind: B2
- Application number: 15/479,457
- Filed: 2017-04-05
- Published: 2017-11-23
- Granted: 2020-12-22
- Earliest claimed: 2016-04-21
- Assignees: San-Ei Kagaku Co., Ltd.
- Applicants: San-Ei Kagaku Co., Ltd.
- Inventors: Yasuhiro Takase; Kazuki Hanada; Hiroshi Asami
- Web page: https://patentgrep.com/patent/US10870725B2

## CPC

- C08G 59/4014: {Nitrogen containing compounds}
- C08G 59/00: Polycondensates containing more than one epoxy group per molecule (low-molecular-weight polyepoxy compounds C07); Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G 59/5033: {aromatic}
- C08K 3/22: of metals
- C08K 3/36: Silica
- C08K 5/315: Compounds containing carbon-to-nitrogen triple bonds
- C08K 5/3492: Triazines
- C08K 7/20: Glass
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 3/386: {by the use of an organic polymeric bonding layer, e.g. adhesive}
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 74/47: comprising organic materials, e.g. plastics or resins
- C08G 59/245: {aromatic}
- C08K 2003/2227: {of aluminium}
- C08K 2201/003: Additives being defined by their diameter
- C08K 2201/005: Additives being defined by their particle size in general
- H05K 2201/10977: Encapsulated connections
- H05K 2203/085: Using vacuum or low pressure
- H05K 2203/1178: Means for venting or for letting gases escape
- H05K 2203/1189: Pressing leads, bumps or a die through an insulating layer
- H10W 72/073: {of die-attach connectors}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

## Claims

### Claim 1

A heat curable resin composition comprising:
a liquid epoxy resin,
a hemiacetal ester synthesized from monocarboxylic acid and polyvinyl ether,
a curing agent comprising cyanoguanidine and melamine, and
a filler,
wherein the hemiacetal ester is synthesized from 0.2 to 0.4 equivalents of monocarboxylic acid relative to an epoxy group of the epoxy resin and 1.0 to 1.5 equivalents of polyvinyl ether relative to a carboxyl group of the monocarboxylic acid,
wherein the curing agent comprises 0.4 to 0.5 equivalents of cyanoguanidine relative to an epoxy group o£ the epoxy resin and 0.08 to 0.18 equivalents of melamine relative to the epoxy group,
wherein a content of the filler is 10 to 40 mass %,
wherein the epoxy resin is one or more of a bisphenol-A epoxy resin, a bisphenol-F epoxy resin, a glycidyl amine epoxy resin, and an alicyclic epoxy resin,
wherein the monocarboxylic acid is an aromatic monocarboxylic acid and/or a polycyclic aromatic monocarboxylic acid,
wherein the polyvinyl ether is an aliphatic polyvinyl ether and/or an alicyclic polyvinyl ether,
wherein the filler is a spherical filler, and
wherein the heat curable composition has solder connection properties.

### Claim 2 (depends on 1)

The heat curable resin composition according to claim 1, wherein the filler having an average particle diameter of 0.5 to 5 μm.

### Claim 3 (depends on 1)

The heat curable resin composition according to claim 1, wherein the filler contains a fine particle having a size of 0.3 μm or less with a cumulative content of 10 mass % or less relative to the total filler content.

### Claim 4 (depends on 1)

The heat curable resin composition according to claim 1, wherein the reaction ratio of an epoxy group in the epoxy resin is 40% or less after reflow at 220 to 260° C., for 10 to 20 seconds.

### Claim 5 (depends on 1)

A circuit board with an electronic component mounted thereon comprising:
circuit board,
an electronic component mounted on the circuit board, and
a cured product obtained by heat-curing the heat curable resin composition according to claim 1, disposed between the circuit board and the electronic component.