# US 10,870,721 B2 · Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,870,721 B2 - Document ID: US10870721B2 - Status: Granted - Kind: B2 - Application number: 16/448,191 - Filed: 2019-06-21 - Published: 2019-10-03 - Granted: 2020-12-22 - Earliest claimed: 2013-06-18 - Assignees: Panasonic Intellectual Property Management Co., Ltd. - Applicants: Panasonic Intellectual Property Management Co., Ltd. - Inventors: Yuki Kitai; Hiroaki Fujiwara; Hirosuke Saito - Web page: https://patentgrep.com/patent/US10870721B2 ## CPC - C08F 290/062: {Polyethers} - B32B 5/022: {Non-woven fabric} - B32B 15/14: next to a fibrous or filamentary layer - C08F 279/02: on to polymers of conjugated dienes - C08G 65/485: {Polyphenylene oxides} - C08J 5/244: {using glass fibres} - C08J 5/249: {characterised by the additives used in the prepolymer mixture} - C08K 5/01: Hydrocarbons {(C08K5/0091 takes precedence)} - C08K 5/03: aromatic {, e.g. C6H5-CH2-Cl} - C08L 9/00: Compositions of homopolymers or copolymers of conjugated diene hydrocarbons - C08L 51/08: grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds - C08L 71/126: {modified by chemical after-treatment} - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)} - B32B 2260/021: Fibrous or filamentary layer - B32B 2260/046: Synthetic resin - B32B 2262/101: Glass fibres - B32B 2307/204: Di-electric - B32B 2307/306: Resistant to heat - B32B 2457/08: PCBs, i.e. printed circuit boards - C08J 2351/08: grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds - C08J 2371/12: Polyphenylene oxides - C08L 2203/20: use in electrical or conductive gadgets - H05K 1/0326: {containing O} - H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)} - H05K 2201/012: Flame-retardant; Preventing of inflammation - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A polyphenylene ether resin composition includes (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and (B) a crosslinking agent having a carbon-carbon unsaturated double bond. The crosslinking agent serving as component (B) includes from 50 to 100 mass % of (B-1) divinylbenzene and (B-2) polybutadiene. Components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A):(B), of from 65:35 to 95:5. Components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1):(B-2), of from 1:100 to 1.5:1. ## Claims ### Claim 1 A polyphenylene ether resin composition comprising (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and (B) a crosslinking agent having a carbon-carbon unsaturated double bond, wherein the crosslinking agent serving as component (B) includes from 50 to 100 mass % of (B-1) divinylbenzene and (B-2) polybutadiene, components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A) : (B), of from 65:35 to 95:5, components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1) : (B-2), of from 1:100 to 1.5:1, and the (B-2) polybutadiene comprises at least one selected from the group consisting of 1,4-polybutadiene and 1,2-polybutadiene. ### Claim 2 (depends on 1) The polyphenylene ether resin composition according to claim 1, comprising, based on the combined amount of components (A) and (B): 70 to 95 mass % of the modified polyphenylene ether (A); 0.1 to 15 mass % of the divinylbenzene (B-1); and 4 to 25 mass % of the polybutadiene (B-2). ### Claim 3 (depends on 1) The polyphenylene ether resin composition according to claim 1, wherein the crosslinking agent serving as component (B) further includes 50 mass % or less of (B-3) another crosslinking agent having a carbon-carbon unsaturated double bond. ### Claim 4 (depends on 3) The polyphenylene ether resin composition according to claim 3, wherein the other crosslinking agent (B-3) includes a (meth)acrylate group-containing compound. ### Claim 5 (depends on 3) The polyphenylene ether resin composition according to claim 3, comprising, based on the combined amount of components (A) and (B): 70 to 95 mass % of the modified polyphenylene ether (A); 0.1 to 15 mass % of the divinylbenzene (B-1); 4 to 25 mass % of the polybutadiene (B-2); and 17.5 mass % or less of the other crosslinking agent (B-3). ### Claim 6 (depends on 1) The polyphenylene ether resin composition according to claim 1, wherein the substituent at the end of the modified polyphenylene ether (A) comprises a substituent of Formula 1 below where n is an integer from 0 to 10, Z is an arylene group, and R1 to R3 are each independently a hydrogen atom or an alkyl group. ### Claim 7 (depends on 1) The polyphenylene ether resin composition according to claim 1, wherein the substituent at the end of the modified polyphenylene ether (A) comprises a substituent selected from Formula 2 or Formula 3 below ### Claim 8 (depends on 1) The polyphenylene ether resin composition according to claim 1, wherein the substituent at the end of the modified polyphenylene ether (A) a comprises a substituent having a (meth)acrylate group. ### Claim 9 (depends on 1) The polyphenylene ether resin composition according to claim 1, wherein the modified polyphenylene ether (A) has a number-average molecular weight of from 1,000 to 7,000. ### Claim 10 (depends on 1) The polyphenylene ether resin composition according to claim 1, further comprising a flame retardant. ### Claim 11 (depends on 10) The polyphenylene ether resin composition according to claim 10, wherein the flame retardant is a bromine-containing compound and the bromine-containing compound is added in such manner that the bromine content based on the total amount of resin components in the resin composition is from 8 to 20 mass %. ### Claim 12 (depends on 1) A prepreg obtained by impregnating a base with the polyphenylene ether resin composition according to claim 1. ### Claim 13 (depends on 12) A metal-clad laminate produced by laminating the prepreg according to claim 12 and metal foil by molding under applied heat and pressure. ### Claim 14 (depends on 12) A printed wiring board produced using the prepreg according to claim 12.