# US 10,870,587 B2 · Cuprous oxide particle, method of producing the same, photosintering composition, method of forming conductive film using the same and paste of cuprous oxide particles

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- Number: US 10,870,587 B2
- Document ID: US10870587B2
- Status: Granted
- Kind: B2
- Application number: 16/346,222
- Filed: 2017-11-02
- Published: 2019-08-29
- Granted: 2020-12-22
- Earliest claimed: 2016-11-17
- Assignees: Nippon Chemical Industrial Co., Ltd.
- Applicants: Nippon Chemical Industrial Co., Ltd.
- Inventors: Mari Tokutake; Shinji Abe
- Web page: https://patentgrep.com/patent/US10870587B2

## CPC

- C01G 3/02: Oxides; Hydroxides
- H01B 1/00: Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B 1/02: mainly consisting of metals or alloys
- H01B 1/22: the conductive material comprising metals or alloys
- H01B 5/00: Non-insulated conductors or conductive bodies characterised by their form
- H01B 13/00: Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B 13/003: {using irradiation}
- C01G 19/00: Compounds of tin
- C01P 2002/54: one element only
- C01P 2002/60: Compounds characterised by their crystallite size
- C01P 2004/03: obtained by SEM
- C01P 2004/62: Submicrometer sized, i.e. from 0.1-1 micrometer
- C01P 2004/64: Nanometer sized, i.e. from 1-100 nanometer
- C01P 2006/40: Electric properties
- C01G: COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F (metal hydrides {monoborane, diborane or addition complexes thereof} C01B6/00; salts of oxyacids of halogens C01B11/00; peroxides, salts or peroxyacids C01B15/00; thiosulfates, dithionites, polythionates C01B17/64; compounds containing selenium, or tellurium C01B19/00; binary compounds of nitrogen with metals C01B21/06; azides C01B21/08; {compounds containing nitrogen, other non-metals and metal C01B21/082}; metal amides C01B21/092; nitrites C01B21/50; {compounds of noble gases C01B23/0005}; phosphides C01B25/08; salts of oxyacids of phosphorus C01B25/16; carbides C01B32/90; compounds containing silicon C01B33/00; compounds containing boron C01B35/00; compounds having molecular sieve properties but not having base-exchange properties C01B37/00; compounds having molecular sieve and base-exchange properties, e.g. crystalline zeolites, C01B39/00; cyanides C01C3/08; salts of cyanamide C01C3/16; thiocyanates C01C3/20)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- C01P: INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS

## Abstract

Provided is a photosintering composition including cuprous oxide particles containing at least one additive element selected from the group consisting of tin, manganese, vanadium, cerium and silver, and a solvent. It is preferable that the cuprous oxide particle contain 1 ppm to 30,000 ppm of tin as the additive element. It is also preferable that the photosintering composition contain 3% by mass to 80% by mass of the cuprous oxide particles and 20% by mass to 97% by mass of the solvent.

## Claims

### Claim 1

A photosintering composition comprising a cuprous oxide particle, and a solvent, and a binder resin,
wherein the cuprous oxide particle comprises at least one additive element selected from the group consisting of tin, manganese, vanadium, cerium and silver.

### Claim 2 (depends on 1)

The photosintering composition according to claim 1, comprising 3% by mass to 80% by mass of the cuprous oxide particle and 20% by mass to 97% by mass of the solvent.

### Claim 3 (depends on 1)

The photosintering composition according to claim 1, comprising 3% by mass to 80% by mass of the cuprous oxide particle and 20% by mass to 97% by mass of the solvent and the binder resin in total.

### Claim 4 (depends on 1)

A method of forming a conductive film, comprising the steps of:
applying the photosintering composition according to claim 1 to a substrate to form a coating film; and
irradiating the coating film with light to reduce cuprous oxide particles in the coating film.