# US 10,870,009 B2 · Buzzer apparatus

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- Number: US 10,870,009 B2
- Document ID: US10870009B2
- Status: Granted
- Kind: B2
- Application number: 15/862,118
- Filed: 2018-01-04
- Published: 2018-07-05
- Granted: 2020-12-22
- Earliest claimed: 2017-01-04
- Assignees: Cardiac Pacemakers, Inc.
- Applicants: Cardiac Pacemakers, Inc.
- Inventors: James E. Blood; Scott A. Spadgenske; Doug E. Giwoyna; Lonnie D. Myers; Shawn Larson; David A. Chizek
- Web page: https://patentgrep.com/patent/US10870009B2

## CPC

- A61N 1/37258: {Alerting the patient}
- A61N 1/08: Arrangements or circuits for monitoring, protecting, controlling or indicating {(for external stimulators A61N1/3603; for implantable neurostimulators A61N1/36128; for heart stimulators A61N1/37; for defibrillators A61N1/3925)}
- A61N 1/3627: {for treating a mechanical deficiency of the heart, e.g. congestive heart failure or cardiomyopathy}
- A61N 1/3956: {Implantable devices for applying electric shocks to the heart, e.g. for cardioversion}
- G10K 9/122: using piezoelectric driving means {(G10K9/121 takes precedence)}
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H10N 30/06: Forming electrodes or interconnections, e.g. leads or terminals
- H10N 30/875: {Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins}
- H10N 30/883: {Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings}
- H05K 2201/10083: Electromechanical or electro-acoustic component, e.g. microphone
- H05K 2203/107: Using laser light
- H05K 2203/1469: Circuit made after mounting or encapsulation of the components
- A61N: ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY (measurement of bioelectric currents A61B; surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body A61B18/00; anaesthetic apparatus in general A61M; incandescent lamps H01K; infrared radiators for heating H05B)
- G10K: SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

## Abstract

This document discusses, among other things, systems and methods related to a flexible circuit buzzer apparatus, such as a buzzer apparatus for use in an implantable medical device. In an example, the buzzer apparatus can include a flexible circuit having a first dielectric layer. A conductive layer can be disposed on the first dielectric layer. A hole can be formed in the first dielectric layer, the conductive layer, or both. A buzzer including a first contact can be located proximate to the hole. A conductive via can be plated or deposited in the hole. At least the first contact can be electrically coupled to the conductive layer by the conductive via.

## Claims

### Claim 1

A flexible circuit buzzer apparatus for use in an implantable medical device, comprising:
a flexible circuit having a first dielectric layer;
a conductive layer disposed on the first dielectric layer;
a hole in the first dielectric layer;
a buzzer including a first contact located proximate to the hole; and
a conductive via in the hole, wherein at least the first contact is electrically coupled to the conductive layer by the conductive via.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the buzzer is located within an aperture of a second dielectric layer, the second dielectric layer is coupled to the first dielectric layer.

### Claim 3 (depends on 1)

The apparatus of claim 1, further comprising a group of redundant conductive vias electrically coupled between the conductive layer and the first contact, a spacing between two or more conductive vias of the group being less than 0.40 mm.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein the conductive via is a high density interconnect via having a dimension of 150 μm or less transverse to a longitudinal axis of the hole.

### Claim 5 (depends on 1)

The apparatus of claim 1, wherein the conductive via includes a plated material selected from at least one of a group comprising a chemically deposited, electroplated, electroless deposition, vapor deposited, evaporative deposited, and sputtered plating.

### Claim 6 (depends on 1)

The apparatus of claim 1, wherein the conductive via includes electroless copper, electro-deposited copper, or shadow graphite.

### Claim 7 (depends on 1)

The apparatus of claim 1, wherein the hole includes a first opening on a first side of the first dielectric layer and a second opening on a second side of the dielectric layer, the first opening being proximate the first contact and the second opening being proximate the conductive layer, and wherein the conductive via is tapered, the conductive via having a smaller dimension proximate to the first opening than proximate to the second opening.

### Claim 8

A system, comprising:
a flexible circuit buzzer apparatus for use in an implantable medical device, the buzzer apparatus including:
a flexible circuit,
a buzzer laminated into the flexible circuit,
a conductive via in the flexible circuit; and
wherein the buzzer is operatively coupled to a controller circuit in a housing of the implantable medical device through the via.

### Claim 9 (depends on 8)

The system of claim 8, wherein the flexible circuit includes a first dielectric layer including a first hole extending through the first dielectric layer, a first conductive layer disposed on the first dielectric layer, a buzzer including a first contact located proximate to the first hole; and the conductive via in the first hole, the first contact being electrically coupled to the first conductive layer by the conductive via, and the first conductive layer being coupled to the controller circuit.

### Claim 10 (depends on 9)

The system of claim 9, further comprising a second dielectric layer, the buzzer being between the first dielectric layer and the second dielectric layer, wherein the buzzer is electrically isolated from a surrounding environment.

### Claim 11 (depends on 9)

The system of claim 9, wherein the flexible circuit further comprises a second hole extending through the first dielectric layer, and a second conductive via in the second hole, the second conductive via being electrically coupled to the first conductive layer.

### Claim 12 (depends on 11)

The system of claim 11, wherein the flexible circuit further comprises a third hole extending through the first dielectric layer, and a third conductive via in the third hole, the third conductive via being coupled to a ground connection.

### Claim 13 (depends on 9)

The system of claim 9, wherein the buzzer has a central region and a peripheral region, and the first via is located at a peripheral region of the buzzer.

### Claim 14 (depends on 8)

The system of claim 8, comprising the implantable medical device, the implantable medical device comprising the housing, the controller circuit, and the flexible circuit buzzer apparatus.