# US 10,866,038 B2 · Heat sinks with vibration enhanced heat transfer for non-liquid heat sources > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,866,038 B2 - Document ID: US10866038B2 - Status: Granted - Kind: B2 - Application number: 16/664,531 - Filed: 2019-10-25 - Published: 2020-04-30 - Granted: 2020-12-15 - Earliest claimed: 2018-10-25 - Assignees: United Arab Emirates University - Applicants: United Arab Emirates University - Inventors: Salah Addin Burhan Al Omari; Emad Elnajjar - Web page: https://patentgrep.com/patent/US10866038B2 ## CPC - F28F 13/10: by imparting a pulsating motion to the flow, e.g. by sonic vibration - F28D 20/02: using latent heat - F28D 21/00: Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00 - H10W 40/73: for cooling by change of state - H10W 40/735: {by melting or evaporation of solids} - H10W 40/77: Auxiliary members characterised by their shape - F28D 20/021: {the latent heat storage material and the heat-exchanging means being enclosed in one container (F28D20/023 - F28D20/028 take precedence)} - F28D 2021/0029: {Heat sinks} - Y02E 60/14: Thermal energy storage - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract The heat sinks with vibration enhanced heat transfer for non-liquid heat sources are heat sinks formed from a first body of high thermal conductivity material received within a thermally conductive housing such that at least one contact face of the first body of high thermal conductivity material is exposed, forming a direct contact interface with a heat source requiring cooling. The heat source requiring cooling may be any non-liquid heat source, including a processor chip, an integrated circuit chip, a modular circuit package, or the like. The thermally conductive housing may be disposed such that at least one contact face of the thermally conductive housing is in direct contact with the vibrating base. Alternatively, the vibrating base may be attached to a support attached to the heat source. The vibrating base applies oscillating waves to the heat sink, thereby increasing heat transfer between the heat source and the heat sink. ## Claims ### Claim 1 A heat sink with vibration enhanced heat transfer for non-liquid heat sources, comprising: a thermally conductive housing having at least one contact face and at least one wall; a first body made of a thermally conductive phase change material disposed within thermally conductive housing, the first body of thermal conductivity material having a first contact face disposed for direct contact with a non-liquid heat source to be cooled at one end of the housing and a second contact face located at a first contact face of the housing; and a vibrating base, the vibrating base disposed in direct contact with an entire second contact face of the thermally conductive housing; wherein the vibrating base is configured to propagate oscillating waves through the thermally conductive housing and the second contact face of the first body of thermal conductivity material to reach the first contact face disposed for direct contact with the non-liquid heat source; and at least one thermally conductive vertical stud having opposed first and second ends, wherein the first end of the thermally conductive vertical stud is affixed within the second contact face of the thermally conductive housing and the first end of the vertical stud is in direct contact with the vibrating base and the second end is positioned within the first body. ### Claim 2 (depends on 1) The heat sink as recited in claim 1, further comprising a plurality of thermally conductive fins mounted on at least a portion of the at least one wall of the thermally conductive housing. ### Claim 3 (depends on 1) The heat sink as recited in claim 1, further comprising at least one internal chamber within the at least one thermally conductive vertical stud, and a body of high thermal storage capacity material within the at least one internal chamber. ### Claim 4 (depends on 1) The heat sink as recited in claim 1, further comprising a plurality of fins mounted on at least a portion of the at least one thermally conductive vertical stud. ### Claim 5 (depends on 1) The heat sink as recited in claim 1, wherein the first body of thermal conductivity material is a solid phase change material. ### Claim 6 (depends on 5) The heat sink as recited in claim 5, further comprising at least one sensor positioned on the thermally conductive housing to detect melting of the first body of thermal conductivity material at the contact face adapted for direct contact with the non-liquid heat source to be cooled. ### Claim 7 (depends on 1) The heat sink as recited in claim 1, wherein the first body of thermal conductivity material is a liquid.