# US 10,865,368 B2 · Rinse agent composition for silicon wafers

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- Number: US 10,865,368 B2
- Document ID: US10865368B2
- Status: Granted
- Kind: B2
- Application number: 16/471,849
- Filed: 2017-10-26
- Published: 2019-12-19
- Granted: 2020-12-15
- Earliest claimed: 2016-12-22
- Assignees: Kao Corporation
- Applicants: Kao Corporation
- Inventors: Yohei Uchida
- Web page: https://patentgrep.com/patent/US10865368B2

## CPC

- C11D 3/3773: {in liquid compositions}
- C11D 17/08: Liquid soap, {e.g. for dispensers}; capsuled
- C11D 3/3719: {Polyamides or polyimides}
- C11D 7/3209: {Amines or imines with one to four nitrogen atoms; Quaternized amines}
- H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices
- C11D 2111/22: Electronic devices, e.g. PCBs or semiconductors
- C11D: DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

The rinsing composition for a silicon wafer of the present invention contains: a water-soluble polymer A containing a constitutional unit A having a betaine structure; and an aqueous medium. The water-soluble polymer A preferably contains a constitutional unit expressed by Formula (1) below. The water-soluble polymer preferably further contains a constitutional unit B expressed by Formula (2) below. The weight average molecular weight of the water-soluble polymer A is preferably 1,000 or more and preferably 3,000,000 or less. The rinsing composition for a silicon wafer of the present invention contains a pH regulator as needed.

## Claims

### Claim 1

A rinsing composition for a silicon wafer, comprising:
a water-soluble polymer A containing a constitutional unit A having a betaine structure; and
an aqueous medium.

### Claim 2 (depends on 1)

The rinsing composition for a silicon wafer according to claim 1, wherein the constitutional unit A having a betaine structure in the water-soluble polymer A comprises a constitutional unit expressed by Formula (1) below:
where
R1 to R3 are the same or different and represent a hydrogen atom, a methyl group or an ethyl group,
R4 is an alkylene group with 1 to 4 carbon atoms or —Y1-OPO3−—Y2—,
Y1 and Y2 are the same or different and represent an alkylene group with 1 to 4 carbon atoms,
R5 and R6 are the same or different and represent a hydrocarbon group with 1 to 4 carbon atoms,
X1 is O or NR7,
R7 is a hydrogen atom or a hydrocarbon group with 1 to 4 carbon atoms,
X2 is a hydrocarbon group with 1 to 4 carbon atoms, —R17SO3− or —R18COO−,
R17 and R18 are the same or different and represent an alkylene group with 1 to 4 carbon atoms, and
when R4 is an alkylene group with 1 to 4 carbon atom, X2 is —R17SO3− or —R18COO−, and when R4 is —Y1—OPO3−—Y2—, X2 is a hydrocarbon group with 1 to 4 carbon atoms.

### Claim 3 (depends on 2)

The rinsing composition for a silicon wafer according to claim 2, wherein the water-soluble polymer A further contains a constitutional unit B expressed by Formula (2) below:
where
R8 to R10 are the same or different and represent a hydrogen atom, a methyl group or an ethyl group,
X3 is O or NR19,
R19 is a hydrogen atom or a hydrocarbon group with 1 to 4 carbon atoms,
R11 is an alkylene group with 1 to 22 carbon atoms (a hydrogen atom of the alkylene group may be substituted with a hydroxyl group) or -(AO)m- (where AO represents an alkyleneoxy group with 2 to 4 carbon atoms, and m represents an average number of added moles of 1 to 150),
X4 is a hydrogen atom, a hydrocarbon group with 1 to 4 carbon atoms (a hydrogen atom of the hydrocarbon group may be substituted with a hydroxyl group), a hydroxyl group, N+R12R13R14 or NR15R16, and
R12 to R16 are the same or different and represent a hydrogen atom or a hydrocarbon group with 1 to 4 carbon atoms.

### Claim 4 (depends on 1)

The rinsing composition for a silicon wafer according to claim 1, wherein a weight average molecular weight of the water-soluble polymer A is 1,000 or more and 3,000,000 or less.

### Claim 5 (depends on 1)

A method for rinsing a silicon wafer, comprising a step of rinsing a polished silicon wafer using the rinsing composition for a silicon wafer according to claim 1.

### Claim 6 (depends on 1)

A method for producing a semiconductor substrate, comprising a step of rinsing a polished silicon wafer using the rinsing composition for a silicon wafer according to claim 1.