# US 10,865,332 B2 · Epoxy resin composition and electronic component device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,865,332 B2 - Document ID: US10865332B2 - Status: Granted - Kind: B2 - Application number: 14/347,901 - Filed: 2012-09-27 - Published: 2014-08-21 - Granted: 2020-12-15 - Earliest claimed: 2011-09-29 - Assignees: Showa Denko Materials Co., Ltd. - Applicants: Hitachi Chemical Company, Ltd. - Inventors: Hirokuni Ogihara; Fumio Furusawa; Shinya Nakamura; Takatoshi Ikeuchi; Takashi Yamamoto - Web page: https://patentgrep.com/patent/US10865332B2 ## CPC - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - C08G 59/3218: {Carbocyclic compounds} - C08G 59/621: {Phenols} - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - H10W 74/47: comprising organic materials, e.g. plastics or resins - C08L 2203/206: use in coating or encapsulating of electronic parts - H10W 72/5522: {comprising gold [Au]} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/40: characterised by their materials - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - Y10T 428/31511: Of epoxy ether - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1. n represents an integer from 0 to 10. In Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms. ## Claims ### Claim 1 An epoxy resin composition, consisting of: an epoxy resin component (A) consisting of: (1) a first compound represented by the following Formula (I), or (2) an epoxy resin component consisting of: at least 80% by mass, based on a total amount of the epoxy resin, of the first compound represented by the following Formula (I); and a second epoxy compound having at least two epoxy groups per molecule, the second epoxy compound including a cresol novolac epoxy resin as the epoxy resin component (A); (B) a phenol resin including a compound represented by the following Formula (II); (C) a dihydroxynaphthalene compound including a compound represented by the following Formula (III); and optionally, one or more of an antioxidant, a curing accelerator, an inorganic filler, a coupling agent, an ion exchanger, a mold releasing agent, a stress relaxing agent, a flame retardant, and a colorant; wherein, in the Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10; wherein, in the Formula (II), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1, and n represents an integer from 0 to 10; wherein, in the Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms; wherein a content of a total amount of the compound represented by the Formula (III) with respect to a total amount of the compound represented by the Formula (II) and the compound represented by the Formula (III) is from 10% by mass to 55% by mass; and wherein the epoxy resin composition is solid at 25° C. ### Claim 2 (depends on 1) The epoxy resin composition according to claim 1, wherein the epoxy resin composition includes an antioxidant. ### Claim 3 (depends on 1) An electronic component device, comprising an element sealed by the epoxy resin composition according to claim 1. ### Claim 4 (depends on 1) The epoxy resin composition according to claim 1, wherein a ratio of a number of hydroxyl groups in the phenol resin to the number of epoxy groups in the epoxy resin component (A) is from 0.5 to 2. ### Claim 5 (depends on 1) The epoxy resin composition according to claim 1, wherein the epoxy resin component (A) consists of only the first compound represented by the Formula (I). ### Claim 6 (depends on 1) The epoxy resin composition according to claim 1, wherein the epoxy resin component (A) consists of at least 80% by mass, based on a total amount of the epoxy resin, of the first compound represented by the Formula (I) and the cresol novolac epoxy resin. ### Claim 7 An epoxy resin composition, consisting of: an epoxy resin component consisting of: (1) a first compound represented by the following Formula (I), or (2) an epoxy resin component consisting of: at least 80% by mass, based on a total amount of the epoxy resin, of the first compound represented by the following Formula (I); and a second epoxy compound having at least two epoxy groups per molecule, the second epoxy compound including a cresol novolac epoxy resin as the epoxy resin component, a phenol resin including a compound represented by the following Formula (IV); a dihydroxynaphthalene compound including a compound represented by the following Formula (III); and optionally, one or more of an antioxidant, a curing accelerator, an inorganic filler, a coupling agent, an ion exchanger, a mold releasing agent, a stress relaxing agent, a flame retardant, and a colorant; wherein, in the Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10; wherein, in the Formula (IV), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R1 may be the same as or different from another R1, and n represents an integer from 0 to 10; and wherein, in the Formula (III), R1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms; wherein a content of a total amount of the compound represented by the Formula (III) with respect to a total amount of the compound represented by the Formula (IV) and the compound represented by the Formula (III) is from 10% by mass to 55% by mass; and wherein the epoxy resin composition is solid at 25° C. ### Claim 8 (depends on 7) The epoxy resin composition according to claim 7, wherein the epoxy resin composition includes an antioxidant. ### Claim 9 (depends on 7) An electronic component device, comprising an element sealed by the epoxy resin composition according to claim 7. ### Claim 10 (depends on 7) The epoxy resin composition according to claim 7, wherein a ratio of a number of hydroxyl groups in the phenol resin to a number of epoxy groups in the epoxy resin component is from 0.5 to 2. ### Claim 11 (depends on 7) The epoxy resin composition according to claim 7, wherein the epoxy resin component consists of only the first compound represented by the Formula (I). ### Claim 12 (depends on 7) The epoxy resin composition according to claim 7, wherein the epoxy resin component consists of at least 80% by mass, based on a total amount of the epoxy resin, of the first compound represented by the Formula (I) and the cresol novolac epoxy resin.