# US 10,865,329 B2 · Adhesive film for semiconductor

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- Number: US 10,865,329 B2
- Document ID: US10865329B2
- Status: Granted
- Kind: B2
- Application number: 15/500,355
- Filed: 2016-04-29
- Published: 2017-08-17
- Granted: 2020-12-15
- Earliest claimed: 2015-04-29
- Assignees: LG Chem, Ltd.
- Applicants: LG Chem, Ltd.
- Inventors: Hee Jung Kim; Se Ra Kim; Jung Hak Kim; Seung Hee Nam; Jung Ho Jo; Kwang Joo Lee; Young Kook Kim
- Web page: https://patentgrep.com/patent/US10865329B2

## CPC

- C09J 7/10: without carriers
- B32B 7/06: permitting easy separation
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 15/08: of synthetic resin
- B32B 15/082: comprising vinyl resins; comprising acrylic resins
- B32B 15/085: comprising polyolefins
- B32B 15/09: comprising polyesters
- B32B 27/06: as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)}
- B32B 27/08: of synthetic resin
- B32B 27/16: specially treated, e.g. irradiated
- B32B 27/18: characterised by the use of special additives
- B32B 27/20: using fillers, pigments, thixotroping agents
- B32B 27/24: using solvents or swelling agents
- B32B 27/26: using curing agents
- B32B 27/281: {comprising polyimides}
- B32B 27/285: {comprising polyethers}
- B32B 27/286: {comprising polysulphones; polysulfides}
- B32B 27/288: {comprising polyketones}
- B32B 27/302: {comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers}
- B32B 27/304: {comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF}
- B32B 27/306: {comprising vinyl acetate or vinyl alcohol (co)polymers}
- B32B 27/308: {comprising acrylic (co)polymers}
- B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)}
- B32B 27/34: comprising polyamides
- B32B 27/36: comprising polyesters
- B32B 27/38: comprising epoxy resins
- B32B 27/42: comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C09D 163/00: Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09J 7/00: Adhesives in the form of films or foils
- C09J 7/20: characterised by their carriers
- C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J 163/04: Epoxynovolacs
- C09J 201/00: Adhesives based on unspecified macromolecular compounds
- H10P 54/00: Cutting or separating of wafers, substrates or parts of devices
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10P 72/7404: {the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer
- B32B 2255/26: Polymeric coating
- B32B 2270/00: Resin or rubber layer containing a blend of at least two different polymers
- B32B 2307/306: Resistant to heat
- B32B 2307/50: having particular mechanical properties
- B32B 2307/51: Elastic
- B32B 2307/558: Impact strength, toughness
- B32B 2307/58: Cuttability
- B32B 2307/732: Dimensional properties
- B32B 2405/00: Adhesive articles, e.g. adhesive tapes
- B32B 2457/14: Semiconductor wafers
- B32B 2553/00: Packaging equipment or accessories not otherwise provided for
- C09J 161/12: with polyhydric phenols
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/162: the carrier being a laminate constituted by plastic layers only
- C09J 2301/208: the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
- C09J 2423/006: in the substrate
- C09J 2433/00: Presence of (meth)acrylic polymer
- C09J 2433/006: in the substrate
- C09J 2461/00: Presence of condensation polymers of aldehydes or ketones
- C09J 2463/00: Presence of epoxy resin
- C09J 2467/005: in the release coating
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7438: {with parts of the auxiliary support remaining in the finished device}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- H10P 72/7442: {Separation by peeling}
- H10W 72/354: {comprising polymers}
- H10W 90/732: {between stacked chips}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.

## Claims

### Claim 1

An adhesive film for a semiconductor having a melt viscosity of 1,000 Pa·s to 4,000 Pa·s at a temperature of 110° C. and a shear rate of 5 rad/s, and a modulus generated at 5% to 10% elongation at room temperature of 75 MPa to 300 MPa,
wherein the adhesive film for a semiconductor comprises a thermoplastic resin having a glass transition temperature of −10° C. to 20° C., a curing agent containing a phenol resin having a softening point of greater than 100° C. and 160° C. or less, a liquid epoxy resin, and a solid epoxy resin,
wherein a weight ratio of total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, and
wherein a weight ratio of the phenol resin to the total weight of the thermoplastic resin, the phenol resin, and the liquid epoxy resin is 0.333 to 0.600.

### Claim 2 (depends on 1)

A die attachment film (DAF), comprising the adhesive film for a semiconductor according to claim 1.

### Claim 3 (depends on 2)

The die attachment film of claim 2, further comprising a base film and a tacky layer formed on the base film.

### Claim 4 (depends on 1)

The adhesive film for a semiconductor according to claim 1, wherein the adhesive film has a thickness of 1 μm to 300 μm.

### Claim 5

An adhesive film for a semiconductor having a melt viscosity of 1,000 Pa·s to 4,000 Pa·s at a temperature of 110° C. and a shear rate of 5 rad/s, and elongation at room temperature of 500% or less,
wherein the adhesive film for a semiconductor comprises a thermoplastic resin having a glass transition temperature of −10° C. to 20° C., a curing agent containing a phenol resin having a softening point of greater than 100° C. and 160° C. or less, a liquid epoxy resin, and a solid epoxy resin,
wherein a weight ratio of total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6,
wherein a weight ratio of the phenol resin to the total weight of the thermoplastic resin, the phenol resin, and the liquid epoxy resin is 0.333 to 0.600, and
wherein a modulus generated at 5% to 10% elongation at room temperature is 75 MPa to 300 MPa.

### Claim 6 (depends on 5)

A die attachment film (DAF), comprising the adhesive film for a semiconductor according to claim 5.

### Claim 7 (depends on 6)

The die attachment film of claim 6, further comprising a base film and a tacky layer formed on the base film.

### Claim 8 (depends on 5)

The adhesive film for a semiconductor according to claim 5, wherein the adhesive film has a thickness of 1 μm to 300 μm.

### Claim 9

An adhesive film for a semiconductor having a modulus generated at 5% to 10% elongation at room temperature of 75 MPa to 300 MPa, and elongation at room temperature of 500% or less,
wherein the adhesive film for a semiconductor comprises a thermoplastic resin having a glass transition temperature of −10° C. to 20° C., a curing agent containing a phenol resin having a softening point of greater than 100° C. and 160° C. or less, a liquid epoxy resin, and a solid epoxy resin,
wherein a weight ratio of total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, and
wherein a weight ratio of the phenol resin to the total weight of the thermoplastic resin, the phenol resin, and the liquid epoxy resin is 0.333 to 0.600.

### Claim 10 (depends on 9)

A die attachment film (DAF), comprising the adhesive film for a semiconductor according to claim 9.

### Claim 11 (depends on 10)

The die attachment film of claim 10, further comprising a base film and a tacky layer formed on the base film.

### Claim 12 (depends on 9)

The adhesive film for a semiconductor according to claim 9, wherein the adhesive film has a thickness of 1 μm to 300 μm.

### Claim 13

An adhesive film for a semiconductor having a melt viscosity of 1,000 Pa·s to 4,000 Pa·s at a temperature of 110° C. and a shear rate of 5 rad/s, a modulus generated at 5% to 10% elongation at room temperature of 75 MPa to 300 MPa, and elongation at room temperature of 500% or less,
wherein the adhesive film for a semiconductor comprises a thermoplastic resin having a glass transition temperature of −10° C. to 20° C., a curing agent containing a phenol resin having a softening point of greater than 100° C. and 160° C. or less, a liquid epoxy resin, and a solid epoxy resin,
wherein a weight ratio of total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, and
wherein a weight ratio of the phenol resin to the total weight of the thermoplastic resin, the phenol resin, and the liquid epoxy resin is 0.333 to 0.600.

### Claim 14 (depends on 13)

A die attachment film (DAF), comprising the adhesive film for a semiconductor according to claim 13.

### Claim 15 (depends on 14)

The die attachment film of claim 14, further comprising a base film and a tacky layer formed on the base film.

### Claim 16 (depends on 13)

The adhesive film for a semiconductor according to claim 13, wherein the adhesive film has a thickness of 1 μm to 300 μm.