# US 10,865,102 B2 · Multi-depth MEMS package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,865,102 B2 - Document ID: US10865102B2 - Status: Granted - Kind: B2 - Application number: 16/934,255 - Filed: 2020-07-21 - Published: 2020-11-05 - Granted: 2020-12-15 - Earliest claimed: 2017-11-27 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Co., Ltd. - Inventors: Wen-Chuan Tai; Fan Hu - Web page: https://patentgrep.com/patent/US10865102B2 ## CPC - B81B 7/02: containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) - B81C 1/00047: {Cavities} - B81C 1/00333: {Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325} - B81B 2201/0235: Accelerometers - B81B 2201/0242: Gyroscopes - B81B 2201/0257: Microphones or microspeakers - B81B 2201/0264: Pressure sensors - B81B 2203/0315: Cavities - B81C 2201/0125: Blanket removal, e.g. polishing - B81C 2201/013: Etching - B81C 2203/0109: Bonding an individual cap on the substrate - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) ## Abstract The present disclosure relates to a MEMS package having different trench depths, and a method of fabricating the MEMS package. In some embodiments, a cap substrate is bonded to a device substrate. The cap substrate comprises a first trench, a second trench, and an edge trench recessed from at a front-side surface of the cap substrate. A stopper is disposed within the first trench and raised from a bottom surface of the first trench. The stopper has a top surface lower than the front-side surface of the cap substrate. ## Claims ### Claim 1 A microelectromechanical systems (MEMS) package, comprising: a cap substrate bonded to a device substrate, the cap substrate comprising a first trench, a second trench, and an edge trench recessed from a front-side surface of the cap substrate, wherein the second trench is not an edge trench; and a stopper disposed within the first trench and raised from a bottom surface of the first trench; wherein the stopper has a top surface lower than the front-side surface of the cap substrate. ### Claim 2 (depends on 1) The MEMS package of claim 1, wherein the stopper has a stopper height vertically between the top surface and the front-side surface of the cap substrate that is equal to a first vertical distance between a first lateral surface of the edge trench and the front-side surface of the cap substrate. ### Claim 3 (depends on 1) The MEMS package of claim 1, wherein the first trench has a first depth with respect to the front-side surface of the cap substrate smaller than a second depth of the second trench with respect to the front-side surface of the cap substrate. ### Claim 4 (depends on 3) The MEMS package of claim 3, wherein the first depth is equal to a second vertical distance between a second lateral surface of the edge trench and the front-side surface of the cap substrate. ### Claim 5 (depends on 4) The MEMS package of claim 4, wherein the second depth is equal to a third vertical distance between a third lateral surface of the edge trench and the front-side surface of the cap substrate. ### Claim 6 (depends on 3) The MEMS package of claim 3, wherein the second trench has an intermediate lateral surface between a bottom surface of the second trench and the front-side surface of the cap substrate. ### Claim 7 (depends on 6) The MEMS package of claim 6, wherein an intermediate depth of the second trench vertically between the intermediate lateral surface and the front-side surface of the cap substrate is equal to the first depth. ### Claim 8 A microelectromechanical systems (MEMS) package, comprising: a device substrate comprising a first MEMS device and a second MEMS device; and a cap substrate bonded to the device substrate, the cap substrate comprising a first trench overlying the first MEMS device, a second trench overlying the second MEMS device, and a scribe trench disposed in a scribe line region and recessed from a front-side surface of the cap substrate; wherein a stopper is disposed within the first trench and raised from a bottom surface of the first trench to a position vertically lower than the front-side surface of the cap substrate. ### Claim 9 (depends on 8) The MEMS package of claim 8, wherein the first trench has a first depth with respect to the front-side surface of the cap substrate smaller than a second depth of the second trench with respect to the front-side surface of the cap substrate. ### Claim 10 (depends on 9) The MEMS package of claim 9, wherein the scribe trench has an intermediate lateral surface between a bottom surface of the scribe trench and the front-side surface of the cap substrate. ### Claim 11 (depends on 10) The MEMS package of claim 10, wherein the intermediate lateral surface is located in a vertical depth same as the second depth. ### Claim 12 (depends on 11) The MEMS package of claim 11, further comprising an edge trench in a boundary region of the cap substrate having a depth equal to that of the scribe trench. ### Claim 13 (depends on 12) The MEMS package of claim 12, wherein the edge trench has a first lateral surface having a first vertical distance with respect to the front-side surface of the cap substrate that is equal to a height of the stopper with respect to the front-side surface of the cap substrate. ### Claim 14 (depends on 13) The MEMS package of claim 13, wherein the edge trench has a second lateral surface having a second vertical distance with respect to the front-side surface of the cap substrate that is equal to the first depth. ### Claim 15 (depends on 14) The MEMS package of claim 14, wherein the edge trench has a third lateral surface having a third vertical distance with respect to the front-side surface of the cap substrate that is equal to a scribe depth of the scribe trench. ### Claim 16 (depends on 8) The MEMS package of claim 8, wherein the device substrate and the cap substrate are bonded by a pair of bonding elements through a eutectic bonding. ### Claim 17 (depends on 16) The MEMS package of claim 16, wherein the pair of bonding elements is disposed between the first MEMS device and the second MEMS device. ### Claim 18 A microelectromechanical systems (MEMS) package, comprising: a device substrate comprising a first MEMS device and a second MEMS device; and a cap substrate bonded to the device substrate, the cap substrate enclosing a first cavity overlying the first MEMS device and a second cavity overlying the second MEMS device; wherein the first cavity has a first depth with respect to a front-side surface of the cap substrate smaller than a second depth of the second cavity with respect to the front-side surface of the cap substrate; and wherein a stopper is raised from a bottom surface of the first cavity to a position within the first cavity and vertically lower than the front-side surface of the cap substrate. ### Claim 19 (depends on 18) The MEMS package of claim 18, further comprising a scribe trench disposed within the cap substrate, wherein the scribe trench comprises a central portion having a third depth greater than the second depth of the second cavity and a peripheral portion with an intermediate depth smaller than the third depth. ### Claim 20 (depends on 19) The MEMS package of claim 19, wherein the intermediate depth is equal to the second depth.