# US 10,865,099 B2 · MEMS device and method for forming the same

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- Number: US 10,865,099 B2
- Document ID: US10865099B2
- Status: Granted
- Kind: B2
- Application number: 16/116,105
- Filed: 2018-08-29
- Published: 2020-03-05
- Granted: 2020-12-15
- Earliest claimed: 2018-08-29
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company Ltd.
- Inventors: Chen Hsiung Yang; Chun-Wen Cheng; Chia-Hua Chu; En-Chan Chen
- Web page: https://patentgrep.com/patent/US10865099B2

## CPC

- B81B 3/0051: {For defining the movement, i.e. structures that guide or limit the movement of an element (mechanical arrangements for preventing or damping vibration or shock H01H3/60)}
- B81B 3/0064: {Constitution or structural means for improving or controlling the physical properties of a device}
- B81B 3/007: {For controlling stiffness, e.g. ribs}
- B81B 7/0009: {Structural features, others than packages, for protecting a device against environmental influences (B81C1/00777 takes precedence)}
- B81B 7/0061: {suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound}
- B81B 7/02: containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence)
- B81C 1/00158: {Diaphragms, membranes (manufacture process for semi-permeable inorganic membranes B01D67/0039)}
- H04R 19/005: {using semiconductor materials}
- B81B 2201/0257: Microphones or microspeakers
- B81B 2203/0307: Anchors
- B81B 2203/0361: Tips, pillars
- H04R 19/04: Microphones (H04R19/01 takes precedence)
- H04R 31/00: Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)}
- H04R 2201/003: Mems transducers or their use
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K)

## Abstract

A MEMS device includes a first layer and a second layer including a same material, a third layer disposed between the first layer and the second layer, a first air gap separating the first layer and the third layer, a second air gap separating the second layer and the third layer, a plurality of first pillars exposed to the first air gap and arranged in contact with the first layer and the third layer, a plurality of second pillars exposed to the second air gap and arranged in contact with the second layer and the third layer.

## Claims

### Claim 1

A microelectromechanical system (MEMS) device comprising:
a first layer and a second layer comprising a same material;
a third layer disposed between the first layer and the second layer, wherein the third layer comprises a first insulating layer, a second insulating layer and a semiconductor layer between the first insulating layer and the second insulating layer;
a first air gap separating the first layer and the third layer;
a second air gap separating the second layer and the third layer;
a plurality of first pillars exposed to the first air gap and arranged in contact with the first layer, wherein the first pillars penetrate the first insulating layer to be in contact with the semiconductor layer of the third layer; and
a plurality of second pillars exposed to the second air gap and arranged in contact with the second layer, wherein the second pillars penetrate the second insulating layer to be in contact with the semiconductor layer of the third layer.

### Claim 2 (depends on 1)

The MEMS device of claim 1, wherein the first pillars and the second pillars comprise semiconductor materials.

### Claim 3 (depends on 2)

The MEMS device of claim 2, wherein the first pillars, the second pillars, the first layer and the second layer comprise a same material.

### Claim 4 (depends on 2)

The MEMS device of claim 2, wherein the first pillars, the second pillars and the semiconductor layer of the third layer comprise a same material.

### Claim 5 (depends on 1)

The MEMS device of claim 1, wherein the first layer has a first movable portion, a first anchor portion, and at least a first hole formed in the first movable portion, and the second layer has a second movable portion and a second anchor portion.

### Claim 6 (depends on 5)

The MEMS device of claim 5, wherein the first pillars are in contact with the first movable portion and the second pillars are in contact with the second movable portion.

### Claim 7 (depends on 5)

The MEMS device of claim 5, wherein the second layer further comprises a plurality of second holes, and each of the second holes is formed between the second anchor portion and the second pillars.

### Claim 8 (depends on 5)

The MEMS device of claim 5, wherein the second layer further comprises a plurality of second holes, and the second pillars are formed between the second anchor portion and the second holes.

### Claim 9 (depends on 5)

The MEMS device of claim 5, wherein the third layer comprises at least a third hole, and the third hole is aligned with first hole.

### Claim 10 (depends on 8)

The MEMS device of claim 8, wherein the third layer comprises at least a third hole, and the third hole is aligned with the first hole and one of the second holes.

### Claim 11

A microelectromechanical system (MEMS) device comprising:
a substrate having an environment port in communication with an ambient environment;
a first layer over the substrate and comprising a first movable portion and at least a first hole formed in the first movable portion;
a second layer over the first layer and comprising a second movable portion and a plurality of second holes formed in the second movable portion;
a third layer disposed between the first layer and the second layer and comprising a plurality of third holes;
a plurality of first pillars extending from the first movable portion of the first layer to the third layer; and
a plurality of second pillars extending from the second movable portion of the second layer to the third layer,
wherein the first pillars and the second pillars comprise a same material, and the first pillars are misaligned with the second pillars.

### Claim 12 (depends on 11)

The MEMS device of claim 11, wherein the first layer further comprises a first anchor portion substantially surrounding the first movable portion.

### Claim 13 (depends on 11)

The MEMS device of claim 11, wherein the second layer further comprises a second anchor portion.

### Claim 14 (depends on 13)

The MEMS device of claim 13, wherein the second holes are formed between the second anchor portion and the second pillars.

### Claim 15 (depends on 13)

The MEMS device of claim 13, wherein the second pillars are formed between the second anchor portion and the second holes.

### Claim 16 (depends on 15)

The MEMES device of claim 15, wherein the second holes are aligned with the third holes, and one of the second holes and one of the third holes are aligned with the first hole.

### Claim 17

A microelectromechanical system (MEMS) device comprising:
a first layer and a second layer comprising a same material;
a third layer disposed between the first layer and the second layer;
a first air gap separating the first layer and the third layer;
a second air gap separating the second layer and the third layer;
a plurality of first pillars exposed to the first air gap and arranged in contact with the first layer and the third layer;
a plurality of second pillars exposed to the second air gap and arranged in contact with the second layer and the third layer;
a plurality of first connecting structures coupled to the first layer and the third layer; and
a plurality of second connecting structures coupled to the second layer and the third layer,
wherein the first pillars and the first connecting structures comprise a same material, the second pillars and the second connecting structures comprise a same material and the first pillars are misaligned with the second pillars.

### Claim 18 (depends on 17)

The MEMS device of claim 17, wherein the first layer has a first movable portion and a first anchor portion, and the second layer has a second movable portion and a second anchor portion.

### Claim 19 (depends on 18)

The MEMS device of claim 18, wherein the first pillars are in contact with the first movable portion, the first connecting structures are in contact with the first anchor portion, the second pillars are in contact with the second movable portion, and the second connecting structure are in contact with the second anchor portion.

### Claim 20 (depends on 18)

The MEMS device of claim 18, wherein the first layer further comprises at least a first hole formed in the first movable portion, the second layer further comprises a plurality of second holes, each of the second holes is formed between the second anchor portion and the second pillars, and the third layer further comprises a plurality of third holes.