# US 10,864,725 B2 · Element substrate, printhead and printing apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,864,725 B2 - Document ID: US10864725B2 - Status: Granted - Kind: B2 - Application number: 16/668,288 - Filed: 2019-10-30 - Published: 2020-05-07 - Granted: 2020-12-15 - Earliest claimed: 2018-11-01 - Assignees: Canon Kabushiki Kaisha - Applicants: Canon Kabushiki Kaisha - Inventors: Takamitsu Tokuda - Web page: https://patentgrep.com/patent/US10864725B2 ## CPC - B41J 2/14088: {Structure of heating means} - B41J 2/04541: {Specific driving circuit} - B41J 2/04563: {detecting head temperature; Ink temperature} - B41J 2/0458: {controlling heads based on heating elements forming bubbles} - B41J 2/14072: {Electrical connections, e.g. details on electrodes, connecting the chip to the outside...} - B41J 2/14153: {Structures including a sensor} - G01K 7/01: using semiconducting elements having PN junctions (G01K7/02, G01K7/16, G01K7/30 take precedence) - B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS - G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00) ## Abstract An element substrate including heaters, drivers for each heater, and a diode, and connected to an external apparatus having a circuit for detecting a temperature based on a detection signal from the diode, comprises: a first wiring grounded, connected to one end of the diode, and serving as a reference voltage of the detection signal; a second wiring connected to the first wiring near the diode; a first pad connected to the first wiring; and a second pad connected to the second wiring. When the substrate is connected to the apparatus, a wiring serving as a reference voltage for a side where the detection signal of the circuit of the apparatus is inputted is connected to the second pad via the first pad connected to a ground serving as a reference voltage of the apparatus. ## Claims ### Claim 1 An element substrate provided with a plurality of electrothermal transducers, a plurality of drive elements for driving each of the plurality of electrothermal transducers, a logic circuit for supplying a signal to the plurality of drive elements, and a temperature detection element, and connected to an external apparatus having a circuit for detecting a temperature based on a temperature detection signal outputted from the temperature detection element, comprising: a first wiring grounded, connected to an end portion of the temperature detection element, and serving as a reference voltage of the temperature detection signal outputted from the temperature detection element; a second wiring connected to the first wiring in the vicinity of the temperature detection element; a first pad connected to the first wiring; and a second pad connected to the second wiring, wherein in a case where the element substrate is connected to the external apparatus, a wiring serving as a reference voltage for a side on which the temperature detection signal of the circuit that the external apparatus has is inputted is connected to the second pad via the first pad connected to a ground serving as a reference voltage of the external apparatus. ### Claim 2 (depends on 1) The element substrate according to claim 1, wherein the temperature detection element is a diode, and further comprising: a third pad for inputting a constant current to an anode side of the diode; and a fourth pad for outputting a temperature detection signal obtained from the anode side of the diode to the external apparatus. ### Claim 3 (depends on 2) The element substrate according to claim 2, wherein the first wiring is connected to a cathode side of the diode, and the second wiring is connected in the vicinity of the cathode side of the diode. ### Claim 4 (depends on 2) The element substrate according to claim 2, wherein the first pad, the second pad, the third pad, and the fourth pad are provided at an end portion of the element substrate, and the diode is arranged at a position away from the end portion of the element substrate. ### Claim 5 (depends on 1) The element substrate according to claim 1, wherein a plurality of the temperature detection element are provided, further comprising a switch configured to select a temperature detection element for performing temperature detection from the plurality of the temperature detection elements, wherein the switch selects the temperature detection element based on a control signal inputted from the external apparatus. ### Claim 6 (depends on 1) The element substrate according to claim 1, wherein the impedance of the first wiring is high. ### Claim 7 A printhead comprising: an element substrate provided with a plurality of electrothermal transducers, a plurality of drive elements for driving each of the plurality of the electrothermal transducers, a logic circuit for supplying a signal to the plurality of the drive elements, and a temperature detection element, and connected to an external apparatus having a circuit for detecting a temperature based on a temperature detection signal outputted from the temperature detection element; and a plurality of nozzles corresponding to the plurality of the electrothermal transducers, wherein the element substrate includes: a first wiring grounded, connected to an end portion of the temperature detection element, and serving as a reference voltage of a temperature detection signal outputted from the temperature detection element; a second wiring connected to the first wiring in the vicinity of the temperature detection element; a first pad connected to the first wiring; and a second pad connected to the second wiring, wherein in a case where the element substrate is connected to the external apparatus, a wiring, serving as a reference voltage for a side on which the temperature detection signal of the circuit that the external apparatus has is inputted is connected to the second pad via the first pad connected to a ground serving as a reference voltage of the external apparatus, and wherein ink is bubbled by thermal energy generated by driving the plurality of electrothermal transducers and printing is performed by the ink being discharged from the plurality of nozzles. ### Claim 8 A printing apparatus for performing printing by discharging ink onto a print medium by using a printhead, wherein the printhead comprises: an element substrate provided with a plurality of electrothermal transducers, a plurality of drive elements for driving each of the plurality of the electrothermal transducers, a logic circuit for supplying a signal to the plurality of the drive elements, and a temperature detection element, and connected to an external apparatus having a circuit for detecting a temperature based on a temperature detection signal outputted from the temperature detection element; and a plurality of nozzles corresponding to the plurality of the electrothermal transducers, wherein the element substrate includes: a first wiring grounded, connected to an end portion of the temperature detection element, and serving as a reference voltage of a temperature detection signal outputted from the temperature detection element; a second wiring connected to the first wiring in the vicinity of the temperature detection element; a first pad connected to the first wiring; and a second pad connected to the second wiring, wherein in a case where the element substrate is connected to the external apparatus, a wiring, serving as a reference voltage for a side on which the temperature detection signal of the circuit that the external apparatus has is inputted is connected to the second pad via the first pad connected to a ground serving as a reference voltage of the external apparatus, and wherein ink is bubbled by thermal energy generated by driving the plurality of electrothermal transducers and printing is performed by the ink being discharged from the plurality of nozzles, the printing apparatus comprising: an amplifier configured to amplify a temperature detection signal outputted from the temperature detection element; an A/D converter configured to perform analog-to-digital conversion of the temperature detection signal amplified by the amplifier; a third wiring serving as a reference voltage of an analog part of the amplifier and the A/D converter; a fourth wiring that is grounded; a fifth pad connected to the third wiring; and a sixth pad connected to the fourth wiring, wherein in a case where the printhead is connected, the fifth pad is connected to the second pad, the sixth pad is connected to the first pad, and a circuit is formed from the third wiring through the fifth pad and the second pad, through the second wiring and the first wiring, through the first pad and the sixth pad, and to the fourth wiring. ### Claim 9 (depends on 8) The apparatus according to claim 8, further comprising: a constant current circuit configured to generate a constant current to be supplied to the temperature detection element on the basis of a current supplied from a power supply unit, a seventh pad configured to output a constant current generated by the constant current circuit, and an eighth pad configured to input the temperature detection signal. ### Claim 10 (depends on 8) The apparatus according to claim 8, wherein the impedance of the fourth wiring is low.