# US 10,864,706 B2 · Encapsulation film

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- Number: US 10,864,706 B2
- Document ID: US10864706B2
- Status: Granted
- Kind: B2
- Application number: 16/082,508
- Filed: 2017-03-13
- Published: 2019-03-14
- Granted: 2020-12-15
- Earliest claimed: 2016-03-11
- Assignees: LG Chem, Ltd.
- Applicants: LG Chem, Ltd.
- Inventors: Hyun Suk Kim; Hyun Jee Yoo; Jung Ok Moon; Jung Woo Lee; Se Woo Yang
- Web page: https://patentgrep.com/patent/US10864706B2

## CPC

- B32B 15/18: comprising iron or steel {(B32B15/011, B32B15/012 and B32B15/013 take precedence)}
- B32B 15/08: of synthetic resin
- B32B 15/085: comprising polyolefins
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 17/10: of synthetic resin
- B32B 27/08: of synthetic resin
- B32B 27/18: characterised by the use of special additives
- C08J 5/18: Manufacture of films or sheets
- H10K 59/8721: {Metallic sealing arrangements}
- B32B 15/088: comprising polyamides
- B32B 15/092: comprising epoxy resins
- B32B 2250/02: 2 layers
- B32B 2250/24: All layers being polymeric
- B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer
- B32B 2255/205: Metallic coating
- B32B 2255/26: Polymeric coating
- B32B 2255/28: Multiple coating on one surface
- B32B 2307/202: Conductive
- B32B 2307/416: Reflective
- B32B 2307/7246: Water vapor barrier
- B32B 2457/12: Photovoltaic modules
- B32B 2457/206: Organic displays, e.g. OLED
- C08J 2323/22: Copolymers of isobutene; butyl rubber
- C08J 2491/00: Characterised by the use of oils, fats or waxes; Derivatives thereof
- H10K 59/874: {including getter material or desiccant}
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

The present application relates to an encapsulating film, a reliability assessment therefor, an organic electronic apparatus comprising the encapsulating film, and a method for producing an organic electronic apparatus which has used the encapsulating film, and provides: a reliability assessment method which can predict the reliability of the encapsulating film before same is applied to the organic electronic apparatus, the encapsulating film blocking moisture or oxygen from the outside entering the organic electronic apparatus; and the encapsulating film which can block moisture with high reliability.

## Claims

### Claim 1

A method of evaluating reliability of an encapsulation film comprising:
providing an encapsulation film which comprises a metal layer, and an encapsulation layer formed on the metal layer and comprising a moisture adsorbent,
measuring a specular reflectance R of the encapsulation layer at a wavelength of 550 nm, and
determining the reliability of the encapsulation film by the measured value of the specular reflectance R of the encapsulation layer,
wherein the reliability of the encapsulation film is determined as excellent provided that the specular reflectance R satisfies the range of 6.5 or less,
wherein the specular reflectance R is represented by the following Equation 1:
R=SCI−SCE (Equation 1)
wherein the Equation 1, SCI is a total reflectance including normal reflection measured according to ASTM E1164-12E1, and SCE is a reflectance excluding normal reflection measured according to ASTM E1164-12E1.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the encapsulation layer has a thickness in a range of 15 μm to 70 μm.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the metal layer has a thickness in a range of 20 μm to 150 μm.

### Claim 4 (depends on 1)

The method according to claim 1, wherein the encapsulation layer comprises an encapsulation resin, and said encapsulation resin comprises an acrylic resin, an epoxy resin, a silicone resin, a fluorine resin, a styrene resin, a polyolefin resin, a thermoplastic elastomer, a polyoxyalkylene resin, a polyester resin, a polyvinyl chloride resin, a polycarbonate resin, a polyphenylene sulfide resin, a polyamide resin or a mixture thereof.

### Claim 5 (depends on 4)

The method according to claim 4, wherein the encapsulation resin has a refractive index in a range of 1.3 to 1.6.

### Claim 6 (depends on 1)

The method according to claim 1, wherein the moisture adsorbent is a moisture-reactive adsorbent.

### Claim 7 (depends on 1)

The method according to claim 1, wherein the moisture adsorbent has an average diameter in a range of 0.5 μm to 5 μm.

### Claim 8 (depends on 1)

The method according to claim 1, wherein the moisture adsorbent has a refractive index in a range of 1.6 to 2.5.

### Claim 9 (depends on 4)

The method according to claim 4, wherein the moisture adsorbent is comprised in an amount of 5 to 100 parts by weight, relative to 100 parts by weight of the encapsulation resin.

### Claim 10 (depends on 1)

The method according to claim 1, wherein the moisture adsorbent is one or more selected from the group consisting of P2O5, Li2O, Na2O, BaO, CaO, MgO, Li2SO4, Na2SO4, CaSO4, MgSO4, CoSO4, Ga2(SO4)3, Ti(SO4)2, NiSO4, CaCl2, MgCl2, SrCl2, YCl3, CuCl2, CsF, TaF5, NbF5, LiBr, CaBr2, CeBr3, SeBr4, VBr3, MgBr2, BaI2, MgI2, Ba(ClO4)2 and Mg(ClO4)2.

### Claim 11 (depends on 1)

The method according to claim 1, wherein the metal layer has a total reflectance SCI including normal reflection measured according to ASTM E1164-12E1 in a range of 50% to 80%.

### Claim 12 (depends on 1)

The method according to claim 1, wherein the metal layer has a reflectance SCE excluding normal reflection measured according to ASTM E1164-12E1 in a range of 5% to 35%.

### Claim 13 (depends on 1)

The method according to claim 1, wherein the metal layer comprises any one of a metal, a metal oxide, a metal nitride, a metal carbide, a metal oxynitride, a metal oxyboride, and a combination thereof.

### Claim 14 (depends on 1)

The method according to claim 1, wherein the metal layer comprises any one of aluminum, copper, nickel, silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and a combination thereof.

### Claim 15

An encapsulation film comprising a metal layer, and an encapsulation layer formed on said metal layer and comprising a moisture adsorbent, and having a specular reflectance R, according to Equation 1 below to the encapsulation layer formed on said metal layer at a wavelength of 550 nm, of 6.5 or less:
R=SCI−SCE (Equation 1)
wherein the Equation 1, SCI is a total reflectance including normal reflection measured according to ASTM E1164-12E1, and SCE is a reflectance excluding normal reflection measured according to ASTM E1164-12E1.

### Claim 16 (depends on 15)

An organic electronic device comprising a substrate; an organic electronic element formed on the substrate; and the encapsulation film according to claim 15 for encapsulating said organic electronic element.

### Claim 17 (depends on 15)

A method of manufacturing an organic electronic device comprising steps of applying the encapsulation film according to claim 15 to a substrate, on which an organic electronic element is formed, to cover said organic electronic element; and curing said encapsulation film.