# US 10,864,606 B2 · Flux and solder material

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,864,606 B2
- Document ID: US10864606B2
- Status: Granted
- Kind: B2
- Application number: 16/312,822
- Filed: 2018-06-22
- Published: 2020-08-27
- Granted: 2020-12-15
- Earliest claimed: 2017-07-03
- Assignees: Koki Company Limited
- Applicants: Koki Company Limited
- Inventors: Noriyoshi Uchida
- Web page: https://patentgrep.com/patent/US10864606B2

## CPC

- B23K 35/362: Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence)
- B23K 35/262: {Sn as the principal constituent}
- B23K 35/3616: {Halogen compounds}
- B23K 35/3618: {Carboxylic acids or salts}
- C08K 3/346: {Clay}
- C08K 3/36: Silica
- C08L 93/04: Rosin
- C22C 13/00: Alloys based on tin
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C22C: ALLOYS (treatment of alloys C21D, C22F)

## Abstract

It is an object of the present invention to provide flux and a solder material of which the activity hardly decreases even at a high temperature and which can also suppress the occurrence of migration. Flux containing an isocyanuric acid derivative containing two or more carboxyl groups and the like are provided.

## Claims

### Claim 1

A flux comprising a solvent component, a rosin component, and an activator component, wherein the activator component includes an isocyanuric acid derivative containing two or more carboxyl groups, wherein the solvent component is contained at 20% by mass or more and 70% by mass or less, the rosin component is contained at 1.0% by mass or more and 80% by mass or less, and a halogen concentration in the flux is 5000 ppm or less.

### Claim 2 (depends on 1)

The flux according to claim 1, wherein the isocyanuric acid derivative is at least one kind selected from the group consisting of bis(2-carboxyethyl) isocyanurate, tris(2-carboxyethyl) isocyanuric acid, and tris(3-carboxypropyl) isocyanuric acid.

### Claim 3 (depends on 1)

The flux according to claim 1, wherein the isocyanuric acid derivative is contained in the flux at 1% by mass or more and 10% by mass or less in terms of solid matter.

### Claim 4 (depends on 1)

The flux according to claim 1, wherein the halogen concentration in the flux is 3000 ppm or less.

### Claim 5 (depends on 1)

A solder material comprising the flux according to claim 1 and a solder alloy.

### Claim 6 (depends on 1)

The flux according to claim 1, wherein the halogen concentration in the flux is 1500 ppm or less.

### Claim 7 (depends on 1)

The flux according to claim 1, wherein the halogen concentration in the flux is 0 ppm.
