# US 10,864,597 B2 · Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,864,597 B2 - Document ID: US10864597B2 - Status: Granted - Kind: B2 - Application number: 14/992,839 - Filed: 2016-01-11 - Published: 2016-05-05 - Granted: 2020-12-15 - Earliest claimed: 2016-01-11 - Assignees: Toshiba Mitsubishi-Electric Industrial Systems Corporation - Applicants: Toshiba Mitsubishi-Electric Industrial Systems Corporation - Inventors: Akio Yoshida; Masahisa Kogura - Web page: https://patentgrep.com/patent/US10864597B2 ## CPC - B23K 20/106: {Features related to sonotrodes} - B23K 20/22: taking account of the properties of the materials to be welded - B24B 7/16: for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings (for combined grinding of surfaces of revolution and adjacent plane surfaces on work B24B5/01; for grinding edges of bevels on work B24B9/00) - B24B 19/02: for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements - B24B 19/16: for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli (grinding bevels on diamonds or sapphires B24B9/16; polishing of needles B24B29/08) - B24B 27/0633: {using a cutting wire} - B24C 1/00: Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods - B23K 2103/54: {Glass} - H10W 72/5363: {the connected ends being wedge-shaped} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - B24C: ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An object of the present invention is to provide an ultrasonic bonding tool capable of bonding a lead wire, without any trouble, even to a surface of a thin-film base having a plate thickness of 2 mm or less such as a glass substrate. In the present invention, a surface portion of a chip portion (1c) of an ultrasonic bonding tool (1) used in an ultrasonic bonding apparatus has a plurality of planar portions (10) formed so as to be separated from one another, and a plurality of concavities (11) formed between the plurality of planar portions. Each of the plurality of planar portions (10) has a flatness of 2 μm or less. ## Claims ### Claim 1 A method for manufacturing an ultrasonic bonding tool, said ultrasonic bonding tool comprising a chip portion at a distal end portion of the tool, the chip portion comprising a surface portion, the surface portion comprising a plurality of planar portions and a plurality of concavities between planar portions of the plurality of planar portions, and the tool being capable of applying ultrasonic vibration, said method for manufacturing the tool comprising: preparing a tool original material comprising a distal planar portion with a flatness of more than 2 μm; grinding the tool original material to enhance the flatness of the distal planar portion to a flatness of 2 μm or less; selectively forming the plurality of concavities by wire cutting or with a cutting wheel, wherein the plurality of concavities separate the distal planar portion into the plurality of planar portions; shot-blasting an edge of an outer peripheral portion of planar: portions in the plurality of planar portions, thereby rounding the edge; and shot-blasting to form an uneven shape in each planar portion in the plurality of planar portions so as to maintain a flatness of 2 μm or less in the plurality of planar portions and form an uneven shape with a flatness of 0.2 μm or less in the plurality of concavities. ### Claim 2 (depends on 1) The method for manufacturing the ultrasonic bonding tool according to claim 1, wherein the chip portion comprises: a first layer and a second layer on the first layer as a most distal end portion of the chip portion, and wherein the second layer is harder than the first layer. ### Claim 3 (depends on 1) The method for manufacturing the ultrasonic bonding tool according to claim 1, wherein the chip portion comprises: a first layer and a second layer on the first layer, as a most distal end portion of the chip portion, and wherein an affinity between the second layer and a material to be bonded is lower than an affinity between the first layer and the material to be bonded. ### Claim 4 (depends on 1) The method for manufacturing the ultrasonic bonding tool according to claim 1, Wherein an interval between adjacent concavities of the plurality of concavities is 1.0 mm or less. ### Claim 5 (depends on 1) The method for manufacturing the ultrasonic bonding tool according to claim 1, wherein an average depth of concavities of the plurality of concavities is 0.15 mm or less. ### Claim 6 (depends on 1) The method for manufacturing the ultrasonic bonding tool according to claim 1, wherein the plurality of concavities comprises a plurality of first grooves and a plurality of second grooves that cross the plurality of first grooves. ### Claim 7 (depends on 1) The method for manufacturing the ultrasonic bonding tool according to claim 1, wherein the planar portions of the plurality of planar portions have a rectangular shape, a circular shape, or a rhombic shape. ### Claim 8 (depends on 2) The method for manufacturing the ultrasonic bonding tool according to claim 2, wherein the first layer comprises a steel material and the second layer comprises tungsten carbide. ### Claim 9 (depends on 1) The method for manufacturing the ultrasonic bonding tool according to claim 1, wherein the tool original material is ground to a flatness of 1 to 2 μm.