Layer assignment technique to improve timing in integrated circuit design
AssigneeCadence Design Systems, Inc.
InventorsYi-Xiao Ding, Jhih-Rong Gao, Zhuo Li
Life of this patent
Estimating the term…
Loading patent…
AssigneeCadence Design Systems, Inc.
InventorsYi-Xiao Ding, Jhih-Rong Gao, Zhuo Li
Estimating the term…
Aspects of the present disclosure address improved systems and methods for layer assignment to improve timing in integrated circuit (IC) designs. An initial placement layout of a net of an IC design is accessed. A plurality of buffer insertion candidates is generated using multiple candidate buffer insertion points and multiple layer assignments from among multiple layers of the IC design. Timing characteristics of each buffer insertion candidate are determined, and timing improvements provided by each buffer insertion candidate are determined based on respective timing characteristics. A buffer insertion candidate is selected from the plurality of buffer insertion candidates based on the timing improvement provided by the buffer insertion candidate. A layout instance for the IC is generated based in part on the selected buffer insertion candidate.
A electronic design automation (EDA) system comprising:
A method for electronic design automation, the method comprising:
A computer-storage medium storing instructions, which when executed by a machine, cause the machine to perform operations comprising:
Dependencies are inferred from the claim text.